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AMD XC7K410T-2FFV900C
- Part No.:
- XC7K410T-2FFV900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K410T-2FFV900C.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC7K410T-2FFV900C from AMD (Xilinx) is a Kintex-7 FPGA with 405,550 logic cells, 2,040 DSP slices, 28.5 Mb of block RAM, -2 speed grade, and 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FFVBGA) package. It targets high-throughput data processing in radar signal conditioning and PCIe Gen2 endpoint interfaces.
For engineers reviewing the XC7K410T-2FFV900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), transceiver line rate (6.6 Gb/s), voltage compatibility (1.0V core / 1.8V I/O), and thermal envelope (100°C case temperature).
Technical Context
The XC7K410T-2FFV900C implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic acceleration, and 24 transceivers supporting protocols including PCIe Gen2, SATA, and SRIO. It integrates dual 32-bit AXI interconnects and supports partial reconfiguration.
Configuration occurs via Master SPI or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential signaling such as LVDS and TMDS up to 1.25 Gb/s.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - determines maximum combinational and sequential logic capacity for complex state machines or protocol stacks |
| DSP Slices | 2,040 - enables parallel execution of multiply-accumulate operations for real-time filtering or FFT computation |
| Block RAM | 28.5 Mb - provides on-chip memory for buffering video frames, packet queues, or coefficient tables without external DRAM |
| User I/O Pins | 500 - supports wide parallel buses, multi-lane SerDes interfaces, or mixed-voltage peripheral connectivity |
| Transceiver Line Rate | 6.6 Gb/s - meets PCIe Gen2 x8 bandwidth requirements and enables 10G Ethernet PHY layer implementation |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock with worst-case voltage/temperature margins |
| Package | FFV900 - 900-ball flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation in conduction-cooled enclosures |
Pinout & Package
XC7K410T-2FFV900C uses a 900-ball Flip-Chip Fine-Pitch BGA (FFVBGA) package with 35 rows × 35 columns, 1.0 mm ball pitch, and thermal lid. Pin assignment follows Xilinx UG475 v1.14, with dedicated configuration, clock, JTAG, and transceiver banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master SPI mode; requires 50 MHz max frequency |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating readiness for configuration or detecting CRC errors |
| PROGRAM_B | Configuration Reset Input | Asynchronous active-low reset that clears configuration memory and restarts boot sequence |
| M0–M2 | Mode Selection Inputs | Set configuration interface (SPI/JTAG/Slave Parallel) and bus width at power-up |
| GTX_CLK0_M2C_P/N | Differential Transceiver Reference Clock | Provides low-jitter reference for GTX transceivers; must be routed with controlled impedance and length matching |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic swapping of logic partitions without resetting the entire device-critical for adaptive radio or multi-standard baseband processing |
| AES-256 Bitstream Encryption | Prevents IP theft by encrypting configuration bitstream stored in external flash; decryption occurs on-chip during load |
| Dual 32-bit AXI Interconnect | Provides non-blocking, low-latency communication between processor subsystems and custom accelerators in Zynq-7000 compatible designs |
| UltraScale-Compatible I/O Banks | Supports mixed-voltage operation across 12 I/O banks, enabling direct interfacing with legacy 3.3V peripherals and modern 1.2V memory |
| Thermal Monitoring Diode | On-die diode enables real-time junction temperature measurement via external ADC-required for fan control in sealed radar enclosures |
Applications
| Radar Signal Processing | PCIe Gen2 Endpoint Acceleration |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in airborne SAR systems with 12-bit ADC inputs and deterministic latency under 5 µs. IC Role / Device Role / Timing Role: FPGA fabric implements matched filter chains, CFAR detection, and beamforming engines synchronized to 100 MHz system clock. Use Value: 2,040 DSP slices enable simultaneous 16-channel Doppler FFTs; 28.5 Mb block RAM buffers 4096-sample chirp sequences per channel. | Use Scenario: High-speed data acquisition card for industrial test equipment requiring DMA transfers to host CPU over x4 PCIe Gen2 link. IC Role / Device Role / Timing Role: Acts as PCIe endpoint with integrated hard IP, managing TLP generation, completion handling, and BAR decoding. Use Value: Native PCIe Gen2 x4 support eliminates external bridge IC; 500 user I/Os route analog front-end signals and trigger lines without multiplexing. |
| Video Over IP Transport | Software-Defined Radio Baseband |
Use Scenario: 4K60 HDMI capture and compression module embedding HEVC encoding pipeline with low-latency frame synchronization. IC Role / Device Role / Timing Role: Implements pixel clock domain crossing, chroma subsampling, and motion estimation engine using pipelined CLBs and DSP slices. Use Value: 405,550 logic cells accommodate full HEVC Main Profile encoder; transceivers serialize compressed streams over SFP+ at 3.125 Gb/s. | Use Scenario: Multi-band LTE/FDD-TDD baseband processor supporting 20 MHz bandwidth and MIMO-2x2 with real-time channel estimation. IC Role / Device Role / Timing Role: Hosts OFDM modulator/demodulator, channel coding (LDPC), and digital pre-distortion (DPD) kernels in time-sliced execution. Use Value: -2 speed grade ensures 204.8 MHz sampling clock timing closure; 24 transceivers handle four independent RF front-end interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K325T-2FFG901I | 326,080 logic cells, 1,920 DSP slices, same FFVBGA-901 package but industrial temp range (-40°C to 100°C) | Lower gate count limits multi-channel radar processing; suitable for cost-sensitive PCIe endpoint designs with reduced DSP demand | Select when thermal margin exceeds 100°C case requirement and logic utilization stays below 80% |
| XCKU040-2FFVA1156E | Ku040 offers 504,000 logic cells, 1,920 DSP slices, UltraScale architecture, and 1156-ball FCBGA package | Higher performance and lower power per logic cell; supports PCIe Gen3 and DDR4, but requires PCB redesign and new toolchain licensing | Choose for next-generation designs needing Gen3 bandwidth or DDR4 memory controllers, accepting layout and software investment |
Compared with XC7K325T-2FFG901I, XC7K410T-2FFV900C delivers 24% more logic and 6% more DSP resources for radar beamforming, while XC7K410T-2FFV900C avoids the PCB and toolchain migration burden of XCKU040-2FFVA1156E despite its architectural advantages.
Availability
XC7K410T-2FFV900C is available at Aetrix Electronics and suitable for radar signal processing, PCIe Gen2 endpoint acceleration, and video-over-IP transport requiring stable component supply across extended product lifecycles.
Supply support for XC7K410T-2FFV900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) is a global semiconductor leader delivering adaptive computing platforms for data center, AI, and embedded applications.
The Kintex-7 family targets high-performance, cost-optimized FPGA solutions for wired communications, video processing, and aerospace/defense systems where power efficiency and logic density are balanced.
FAQ
What is the maximum supported transceiver line rate for XC7K410T-2FFV900C?
The XC7K410T-2FFV900C supports a maximum transceiver line rate of 6.6 Gb/s across its 24 GTX transceivers. This enables compliance with PCIe Gen2 (5.0 GT/s), SATA III (6.0 Gb/s), and SRIO Gen2 (5.0 GT/s) standards. The actual achievable rate depends on board layout quality, reference clock jitter, and operating temperature.
Does XC7K410T-2FFV900C support partial reconfiguration?
Yes, XC7K410T-2FFV900C fully supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic replacement of logic modules-such as modulation schemes or filter coefficients-without disrupting active functions like PCIe link maintenance or memory controller operation in the running XC7K410T-2FFV900C design.
What configuration modes are supported by XC7K410T-2FFV900C?
XC7K410T-2FFV900C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most common for single-flash boot; JTAG is used for debugging and programming during development of the XC7K410T-2FFV900C system.
What is the I/O voltage range supported by XC7K410T-2FFV900C?
XC7K410T-2FFV900C supports I/O voltages from 1.2V to 3.3V across 12 selectable I/O banks. Each bank operates independently with dedicated VCCO and VREF supplies. This enables direct interfacing with DDR3 (1.5V), QDR-IV (1.2V), and legacy parallel peripherals (3.3V) within a single XC7K410T-2FFV900C implementation.
Is XC7K410T-2FFV900C qualified for automotive applications?
No, XC7K410T-2FFV900C is rated for commercial temperature range (0°C to 85°C case) and is not AEC-Q100 qualified. For automotive use, AMD offers the XA7K325T variant with extended temperature range (-40°C to 125°C) and automotive qualification-XC7K410T-2FFV900C lacks the required screening and documentation for automotive deployment.
XC7K410T-2FFV900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K410T-2FFV900C FAQ
1.How can I place an order for XC7K410T-2FFV900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-2FFV900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-2FFV900C reliable?
The price and inventory of XC7K410T-2FFV900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-2FFV900C is usually 5 days.
3.What payment methods are accepted for XC7K410T-2FFV900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-2FFV900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-2FFV900C?
XC7K410T-2FFV900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-2FFV900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-2FFV900C?
For technical support, including XC7K410T-2FFV900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-2FFV900C requirements.
6.How does Aetrix verify that XC7K410T-2FFV900C is sourced from the original manufacturer or authorized distributors?
All XC7K410T-2FFV900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-2FFV900C meets industry standards.
7.What is the process for return or replacement of XC7K410T-2FFV900C?
All XC7K410T-2FFV900C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-2FFV900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-2FFV900C part is unused and in its original packaging.
Return procedure for XC7K410T-2FFV900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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