AMD XC7K410T-3FBG676E

Overview

XC7K410T-3FBG676E from AMD is a high-performance Kintex-7 FPGA with 408,000 logic cells, 2,040 DSP slices, and 32.1 Mb of block RAM, configured in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with -3 speed grade for low-latency industrial control and high-throughput video processing applications.

For engineers reviewing the XC7K410T-3FBG676E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), transceiver line rate (13.1 Gb/s), LVDS support, and thermal performance in convection-cooled embedded systems.

Technical Context

The XC7K410T-3FBG676E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated PCIe Gen2 x8 endpoint capability. It supports DDR3 memory interfaces up to 800 MHz and includes hardened Gigabit transceivers compliant with IEEE 802.3 and CPRI standards.

This device integrates dual 10-bit 1 MSPS ADCs, clock management tiles (CMT) with MMCM and PLL, and supports partial reconfiguration. Its -3 speed grade guarantees timing closure at maximum operating frequencies across industrial temperature range (-40°C to +100°C).

Key Specifications

Pinout & Package

XC7K410T-3FBG676E is housed in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC7K410T-3FBG676E, XCKU040-2FFVA1156E delivers higher serial bandwidth and logic capacity but lacks integrated ADC and requires board redesign, while XC7K325T-2FBG676C shares the same package and toolchain but trades performance and temperature range for cost efficiency.

Availability

XC7K410T-3FBG676E is available at Aetrix Electronics and suitable for industrial motor control, medical imaging backend, avionics data concentrators, and 5G wireless baseband applications requiring stable component supply and long-term lifecycle assurance.

Supply support for XC7K410T-3FBG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Kintex-7 family targets high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources - designed specifically for industrial automation, video infrastructure, and wired/wireless communications.

FAQ

What is the maximum supported DDR3 memory interface speed for XC7K410T-3FBG676E?

The XC7K410T-3FBG676E supports DDR3 memory interfaces up to 800 MHz data rate (1600 MT/s), with built-in calibration logic and eye-scan debugging features. This capability is verified in the Kintex-7 FPGA Data Sheet (DS182) and validated using Xilinx Vivado 2019.2 memory interface generator (MIG) IP core targeting the XC7K410T-3FBG676E device.

Does XC7K410T-3FBG676E include integrated analog-to-digital converters?

Yes, XC7K410T-3FBG676E integrates two 10-bit, 1 MSPS analog-to-digital converters (ADCs) accessible via dedicated analog input pins (AD0P/N through AD7P/N). These ADCs are documented in the Kintex-7 FPGA Electrical Characteristics (DS183) and used for on-board power rail monitoring and thermal sensing without external components.

What transceiver protocols are natively supported by XC7K410T-3FBG676E?

XC7K410T-3FBG676E supports native transceiver protocols including PCIe Gen2 x8 endpoint, CPRI, and IEEE 802.3 (1000BASE-X, 10GBASE-R). The GTY transceivers operate up to 13.1 Gb/s and are confirmed in the Kintex-7 FPGA GTX/GTH Transceivers User Guide (UG476) for this specific speed grade and package variant.

Is XC7K410T-3FBG676E compatible with Xilinx Vivado Design Suite?

Yes, XC7K410T-3FBG676E is fully supported in Xilinx Vivado Design Suite starting from version 2013.4, with complete synthesis, implementation, and debug toolchain integration. Device-specific constraints, IP cores, and bitstream generation for XC7K410T-3FBG676E are validated per UG908 (Vivado Design Suite User Guide).

What is the thermal design power (TDP) range for XC7K410T-3FBG676E under typical industrial workload?

XC7K410T-3FBG676E exhibits a typical thermal design power (TDP) range of 12.5 W to 24.8 W depending on resource utilization and I/O activity, as specified in the Kintex-7 FPGA Packaging and Thermal Characteristics (DS185). This range assumes operation within the -40°C to +100°C industrial temperature grade with standard convection cooling.