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AMD XC7K410T-3FFG900E
- Part No.:
- XC7K410T-3FFG900E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K410T-3FFG900E.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,142
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Product details
Overview
XC7K410T-3FFG900E from AMD is a Kintex-7 FPGA with 405,550 logic cells, 2,080 DSP slices, and 28.5 Mb of block RAM, configured in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-speed serial interface and embedded vision applications.
For engineers reviewing the XC7K410T-3FFG900E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), transceiver line rate (13.1 Gb/s), speed grade (-3), and thermal performance in industrial temperature range (-40°C to +100°C).
Technical Context
The XC7K410T-3FFG900E implements a 28 nm HKMG process architecture with integrated SelectIO technology supporting LVDS, SSTL, HSTL, and MIPI D-PHY standards. It includes 24 transceivers compliant with PCIe Gen3, SATA, and CPRI protocols.
Configuration is performed via Master SPI or JTAG, with support for dual-boot and bitstream encryption using AES-256 and HMAC-SHA-256. The device integrates hardened IP including PCIe Gen3 x8 endpoint, Gigabit Ethernet MAC, and AXI interconnect fabric.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 2,080 - enables parallel multiply-accumulate operations for high-throughput signal processing |
| Block RAM | 28.5 Mb - supports large on-chip data buffering and FIFO/lookup table storage |
| User I/O Pins | 500 - provides flexible interface routing for multi-protocol peripheral connectivity |
| Transceiver Line Rate | 13.1 Gb/s - enables 10G Ethernet, CPRI, and PCIe Gen3 physical layer compliance |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency under industrial temperature conditions |
| Operating Temperature | -40°C to +100°C - qualified for extended industrial and outdoor embedded deployment |
Pinout & Package
XC7K410T-3FFG900E is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 31×31 array, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core voltage supply (1.0V) for FPGA logic fabric and CLBs |
| A15 | VCCAUX | 1.8V auxiliary supply for configuration, clocking, and transceiver reference circuitry |
| P17 | VCCO_0 | I/O bank 0 output driver supply (1.2–3.3V configurable) |
| Y16 | MR | Master reset input - asynchronous active-low global reset for configuration and logic state clearing |
| T15 | CCLK | Configuration clock input - drives internal configuration shift register during SPI/JTAG programming |
| H14 | INIT_B | Open-drain initialization status output - signals configuration memory readiness and error detection |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen3 x8 Hard IP | Reduces integration effort and latency for host interface designs without soft-core overhead |
| AXI Interconnect Fabric | Enables scalable, low-latency communication between multiple masters and slaves in SoC-style architectures |
| AES-256 Bitstream Encryption | Protects intellectual property against unauthorized readback and cloning in field-deployed systems |
| Multi-Boot Support | Allows field-upgradable firmware images with fail-safe fallback to known-good configuration |
| MIPI D-PHY v1.2 Support | Direct camera sensor interfacing up to 2.5 Gbps per lane for embedded vision pipelines |
Applications
| Medical Imaging Systems | 5G Wireless Baseband Units |
|---|---|
Use Scenario: Real-time beamforming and image reconstruction in portable ultrasound and digital X-ray systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFT, filtering, and data compression algorithms; transceivers interface with ADC/DAC and DDR3 memory controllers. Use Value: 2,080 DSP slices enable simultaneous multi-channel processing; 13.1 Gb/s transceivers support high-speed sensor data ingestion from CMOS image sensors. | Use Scenario: Layer 1 PHY processing and fronthaul interface aggregation in massive MIMO radio units. IC Role / Device Role / Timing Role: Implements CPRI and eCPRI protocol stacks, JESD204B converter interfaces, and deterministic low-latency packet switching. Use Value: 24 transceivers with 13.1 Gb/s line rate meet 5G NR sub-6 GHz and mmWave fronthaul bandwidth requirements; -3 speed grade ensures timing margin at 300 MHz system clocks. |
| Industrial Machine Vision | Aerospace Data Acquisition |
Use Scenario: High-speed inspection of PCB assemblies and semiconductor wafers using multi-camera synchronized capture. IC Role / Device Role / Timing Role: Coordinates MIPI D-PHY camera inputs, performs real-time defect classification via embedded CNN accelerators, and streams results over Gigabit Ethernet. Use Value: 500 user I/Os allow concurrent connection of 4+ MIPI camera modules; hardened Gigabit Ethernet MAC reduces software stack overhead and jitter. | Use Scenario: Radiation-tolerant telemetry processing and sensor fusion in LEO satellite payloads. IC Role / Device Role / Timing Role: Manages time-synchronized sampling across analog and digital sensors, performs onboard FFT and anomaly detection, and formats CCSDS-compliant downlink packets. Use Value: Industrial temperature rating (-40°C to +100°C) supports operation in unheated payload bays; AES-256 encryption secures command channel integrity against tampering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | UltraScale architecture, higher logic density (503K LC), 16.3 Gb/s transceivers, but larger 1156-pin FC-BGA package | Better suited for next-gen 5G mmWave and AI inference acceleration where bandwidth exceeds Kintex-7 capability | Select when >13.1 Gb/s line rate or >28.5 Mb BRAM is required; requires PCB redesign due to different footprint |
| XC7K325T-2FFG900I | Same Kintex-7 family, lower logic count (326K LC), same 900-pin FFG package, but industrial-grade (-40°C to +100°C) and speed grade -2 | Targeted for cost-sensitive industrial control and video processing where full 405K LC capacity is unused | Drop-in replacement only if design fits within reduced resources; timing closure may require re-optimization at -2 speed grade |
Compared with XC7K410T-3FFG900E, XCKU040-2FFVA1156E offers higher bandwidth and logic scale at the cost of board space and power, while XC7K325T-2FFG900I provides footprint compatibility with relaxed performance margins for less demanding workloads.
Availability
XC7K410T-3FFG900E is available at Aetrix Electronics and suitable for 5G infrastructure, medical imaging systems, and industrial machine vision applications requiring stable component supply across long production lifecycles.
Supply support for XC7K410T-3FFG900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and AI accelerator technologies.
The Kintex-7 family targets high-performance, cost-optimized applications such as wireless infrastructure, video processing, and test equipment where balanced logic, DSP, and I/O resources are critical.
FAQ
What is the maximum transceiver line rate supported by XC7K410T-3FFG900E?
The XC7K410T-3FFG900E supports a maximum transceiver line rate of 13.1 Gb/s, enabling compliance with PCIe Gen3, 10G Ethernet, and CPRI protocols. This specification is validated across the full industrial temperature range and applies to all 24 GT transceivers integrated into the XC7K410T-3FFG900E device.
Does XC7K410T-3FFG900E include hardened PCIe Gen3 IP?
Yes, XC7K410T-3FFG900E integrates a hardened PCIe Gen3 x8 endpoint block, eliminating the need for soft-core implementations and reducing latency and resource utilization. This IP is fully compliant with the PCI Express Base Specification Revision 3.0 and is accessible via the AXI4-Stream interface in the XC7K410T-3FFG900E configuration.
What configuration modes are supported by XC7K410T-3FFG900E?
XC7K410T-3FFG900E supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Configuration can be initiated from external flash memory or host processor, with dual-boot capability allowing two independent bitstreams stored in the same flash device for fail-safe updates in the XC7K410T-3FFG900E.
Is XC7K410T-3FFG900E qualified for industrial temperature operation?
Yes, the XC7K410T-3FFG900E is rated for industrial temperature operation from -40°C to +100°C ambient, with thermal characteristics verified under JEDEC JESD51-2 conditions. This qualification applies specifically to the -3FFG900E speed/package variant and is documented in the official AMD Kintex-7 DC and AC Switching Characteristics datasheet for XC7K410T-3FFG900E.
How many DSP slices does XC7K410T-3FFG900E provide?
The XC7K410T-3FFG900E contains 2,080 DSP48E1 slices, each capable of performing 25×18-bit signed multiplication with optional pre-adder and cascade features. These slices are distributed across the FPGA fabric to support parallel arithmetic-intensive workloads in the XC7K410T-3FFG900E, such as FIR filtering and matrix operations.
XC7K410T-3FFG900E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K410T-3FFG900E FAQ
1.How can I place an order for XC7K410T-3FFG900E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-3FFG900E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-3FFG900E reliable?
The price and inventory of XC7K410T-3FFG900E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-3FFG900E is usually 5 days.
3.What payment methods are accepted for XC7K410T-3FFG900E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-3FFG900E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-3FFG900E?
XC7K410T-3FFG900E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-3FFG900E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-3FFG900E?
For technical support, including XC7K410T-3FFG900E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-3FFG900E requirements.
6.How does Aetrix verify that XC7K410T-3FFG900E is sourced from the original manufacturer or authorized distributors?
All XC7K410T-3FFG900E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-3FFG900E meets industry standards.
7.What is the process for return or replacement of XC7K410T-3FFG900E?
All XC7K410T-3FFG900E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-3FFG900E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-3FFG900E part is unused and in its original packaging.
Return procedure for XC7K410T-3FFG900E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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