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AMD XC7K410T-L2FBG676E
- Part No.:
- XC7K410T-L2FBG676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K410T-L2FBG676E.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,088
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Product details
Overview
XC7K410T-L2FBG676E from AMD is a Kintex-7 FPGA with 405,550 logic cells, 2,080 DSP slices, and 28.5 Mb of block RAM, packaged in a 676-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch. It targets high-throughput data processing in radar signal conditioning and PCIe Gen2 endpoint interfaces.
For engineers reviewing the XC7K410T-L2FBG676E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2–3.3 V), transceiver line rates up to 6.6 Gb/s, and -2L speed grade timing performance.
Technical Context
This device implements a fully programmable fabric with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates 24 GTX transceivers supporting protocols including PCIe Gen2, SATA, and CPRI.
The XC7K410T-L2FBG676E includes dual 32-bit AXI interconnects, hardened memory controllers for DDR3/DDR3L/LPDDR2, and clock management tiles with MMCM and PLL blocks capable of sub-100 fs jitter synthesis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 2,080 - enables parallel multiply-accumulate operations at up to 352 GMAC/s peak throughput |
| Block RAM | 28.5 Mb - supports large on-chip buffering, FIFOs, and lookup tables without external memory |
| GTX Transceivers | 24 × - each supports 600 Mb/s to 6.6 Gb/s line rates for serial protocol bridging |
| I/O Standards | LVCMOS, SSTL, HSTL, LVDS, TMDS - enables direct interfacing with FPGAs, ADCs, DACs, and display controllers |
| Speed Grade | -2L - guarantees timing closure at 1.2 V core supply with extended temperature range operation |
Pinout & Package
XC7K410T-L2FBG676E uses a 676-pin Flip-Chip BGA (FCBGA) package with 0.8 mm ball pitch, thermal lid, and standard JEDEC MO-271AB footprint. Pin assignment follows Xilinx UG475 v1.14 for Kintex-7 FPGA pinout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% regulated input powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary power supply | 1.8 V ±3% supply for configuration, clocking, and transceiver reference circuitry |
| VCCO_0 | I/O bank power | Configurable 1.2–3.3 V supply per I/O bank enabling mixed-voltage interface design |
| MRCC/MRCC_N | Multi-Gigabit transceiver reference clock input | Dedicated differential pair for GTX PLL reference clock, supporting 10–625 MHz input |
| PROGRAM_B | Configuration reset control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| Hardened Memory Controller | Supports DDR3/DDR3L/LPDDR2 up to 800 MHz clock rate with full calibration and error correction |
| AXI Interconnect | Dual 32-bit AXI4-Lite and AXI4-Stream interconnects enable scalable IP integration without custom bus bridges |
| MMCM + PLL Clocking | Two independent clock management tiles provide frequency synthesis, phase shifting, and jitter filtering for multi-domain timing |
| Partial Reconfiguration Support | Enables dynamic logic swapping in operational systems without full FPGA reset or system interruption |
| Transceiver Power Management | Per-transceiver power gating reduces active power by up to 40% when lanes are idle or unused |
Applications
| Radar Signal Processing | PCIe Gen2 Endpoint |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: Configurable digital signal processor implementing FFT engines, FIR filters, and DMA-controlled data movement between ADCs and DDR3 memory. Use Value: 2,080 DSP slices deliver deterministic latency and >300 GMAC/s sustained throughput for multi-channel coherent processing. | Use Scenario: High-bandwidth host-to-accelerator communication in medical imaging workstations using PCIe Gen2 x8 links. IC Role / Device Role / Timing Role: Endpoint controller managing TLP routing, credit-based flow control, and MSI-X interrupt generation. Use Value: Native PCIe Gen2 hard IP eliminates soft-core overhead and ensures <100 ns transaction latency with guaranteed link training compliance. |
| Video Over IP Transport | Software-Defined Radio (SDR) |
Use Scenario: Compression-free 4K60 video streaming over 10GbE using SMPTE 2110-20/21 standards in broadcast infrastructure. IC Role / Device Role / Timing Role: Media transport engine performing packetization, timestamp alignment, and PTPv2 timestamp insertion. Use Value: 24 GTX transceivers enable concurrent 10GbE MAC + video PHY + auxiliary control channel without external SerDes. | Use Scenario: Wideband IF digitization and adaptive modulation/demodulation in military tactical radios operating across 2–6 GHz bands. IC Role / Device Role / Timing Role: Reconfigurable baseband processor handling channelization, equalization, and waveform-specific symbol mapping. Use Value: Partial reconfiguration allows runtime switching between OFDM, TDMA, and CDMA waveforms while maintaining RF front-end synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156E | UltraScale architecture, higher logic density (503K LUTs), 32 GTY transceivers (12.5 Gb/s), no DDR3 controller hard IP | Better suited for 100G Ethernet or 5G fronthaul where line rate >6.6 Gb/s is required | Select when migrating to higher-speed serial protocols or requiring greater logic capacity with newer toolchain support |
| XC7K325T-2FFG676C | Same Kintex-7 family, lower logic count (326K LC), same -2 speed grade, identical 676-pin FCBGA package | Used in cost-optimized versions of radar processing boards where DSP slice count can be reduced by 30% | Choose for design reuse with simplified thermal and power delivery requirements while retaining pin compatibility |
Compared with XC7K410T-L2FBG676E, XCKU040-2FFVA1156E offers higher bandwidth but requires new PCB layout and Vivado 2018.2+, whereas XC7K325T-2FFG676C provides drop-in replacement capability with reduced resource budget and legacy toolchain compatibility.
Availability
XC7K410T-L2FBG676E is available at Aetrix Electronics and suitable for radar signal processing, PCIe Gen2 endpoint designs, and broadcast video transport systems requiring stable component supply and long-term industrial lifecycle support.
Supply support for XC7K410T-L2FBG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions through FPGA, adaptive SoC, and AI engine technologies.
The Kintex-7 family was designed for high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources - especially in aerospace, defense, and wired communications.
FAQ
What is the maximum supported DDR3 memory speed for XC7K410T-L2FBG676E?
The XC7K410T-L2FBG676E supports DDR3/DDR3L memory up to 800 MHz clock frequency (1600 MT/s data rate) using its hardened memory controller. This includes full support for write leveling, read leveling, and gate training calibration sequences defined in JEDEC JESD79-3F. The XC7K410T-L2FBG676E achieves this with single-rank, dual-rank, and fly-by topology configurations.
Does XC7K410T-L2FBG676E support partial reconfiguration?
Yes, XC7K410T-L2FBG676E supports partial reconfiguration through Vivado Design Suite tools and associated bitstream generation flows. This capability allows dynamic swapping of logic modules while the rest of the FPGA remains operational. The XC7K410T-L2FBG676E implements frame-based reconfiguration with dedicated configuration access ports and CRC-protected configuration frames.
What transceiver protocols are natively supported by XC7K410T-L2FBG676E?
The XC7K410T-L2FBG676E GTX transceivers natively support PCIe Gen2, SATA II/III, CPRI, and Aurora 8B/10B protocols via hard IP blocks. These are implemented in the transceiver physical coding sublayer (PCS) and do not require soft logic. The XC7K410T-L2FBG676E does not include native support for PCIe Gen3 or 10GBASE-R.
What is the operating temperature range for XC7K410T-L2FBG676E?
The XC7K410T-L2FBG676E is rated for industrial temperature operation from –40 °C to +100 °C junction temperature. This rating applies to the -L (extended) variant denoted by the 'E' suffix in the part number. Thermal derating curves and power consumption tables for this range are provided in Xilinx DS182 v2.6.
Can XC7K410T-L2FBG676E be used with Vivado 2023.x toolchain?
No, XC7K410T-L2FBG676E is not supported in Vivado 2023.x. Official toolchain support ends with Vivado 2021.2, which remains the last version with full synthesis, implementation, and debug capabilities for the Kintex-7 family. The XC7K410T-L2FBG676E requires continued use of Vivado 2021.2 or earlier for production design flow.
XC7K410T-L2FBG676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K410T-L2FBG676E FAQ
1.How can I place an order for XC7K410T-L2FBG676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-L2FBG676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-L2FBG676E reliable?
The price and inventory of XC7K410T-L2FBG676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-L2FBG676E is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-L2FBG676E transactions.
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Once your XC7K410T-L2FBG676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-L2FBG676E?
For technical support, including XC7K410T-L2FBG676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-L2FBG676E requirements.
6.How does Aetrix verify that XC7K410T-L2FBG676E is sourced from the original manufacturer or authorized distributors?
All XC7K410T-L2FBG676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-L2FBG676E meets industry standards.
7.What is the process for return or replacement of XC7K410T-L2FBG676E?
All XC7K410T-L2FBG676E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-L2FBG676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-L2FBG676E part is unused and in its original packaging.
Return procedure for XC7K410T-L2FBG676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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