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AMD XC7K410T-L2FBG676I
- Part No.:
- XC7K410T-L2FBG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K410T-L2FBG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,674
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Product details
Overview
XC7K410T-L2FBG676I from AMD is a high-performance Kintex-7 FPGA featuring 405,550 logic cells, 2,080 DSP slices, and 28.5 Mb of block RAM, configured in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with -2L speed grade and industrial temperature range (-40°C to +100°C). It targets high-bandwidth data processing in radar signal conditioning, 10G Ethernet line cards, and medical imaging subsystems.
For engineers reviewing the XC7K410T-L2FBG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/Os), transceiver line rate (up to 13.1 Gb/s), configuration interface (SPIx4/JTAG), and thermal design power (22.5 W typical).
Technical Context
The XC7K410T-L2FBG676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36-Kb RAM blocks, and multi-gigabit transceivers supporting PCIe Gen2/Gen3, SATA, and SRIO protocols. It integrates hardened IP including PCI Express® Gen2 x8 endpoint, 10/100/1000 Mbps Ethernet MAC, and clock management tiles with MMCM and PLL.
Configuration is performed via Master SPI, Slave SelectMAP, or JTAG; bitstream encryption and HMAC authentication are supported for secure boot. The device supports partial reconfiguration and AXI4-Stream interfaces for real-time data path adaptation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 2,080 - enables parallel execution of multiply-accumulate operations for radar FFT or video filtering |
| Block RAM | 28.5 Mb - provides on-chip memory for frame buffering, FIFOs, or coefficient storage without external DRAM |
| User I/Os | 400 - supports high-pin-count interfaces such as DDR3/DDR4 memory controllers and parallel sensor buses |
| Transceiver Line Rate | 13.1 Gb/s - enables direct connection to 10G Ethernet PHYs or CPRI optical modules |
| Speed Grade | -2L - guarantees timing closure at higher frequencies with lower voltage margin than -1, suitable for industrial thermal profiles |
| Operating Temp | -40°C to +100°C - qualified for deployment in sealed industrial enclosures or outdoor base station equipment |
Pinout & Package
XC7K410T-L2FBG676I is housed in a 27×27 mm, 676-ball Flip-Chip BGA (FCBGA) package with 1.0 mm ball pitch, designed for high-signal-integrity PCB routing and thermal dissipation via center thermal ball array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core supply input (1.0V) - must be filtered with low-ESR ceramic capacitors adjacent to ball |
| A19 | VCCAUX | Auxiliary supply (1.8V) - powers configuration logic, PCIe block, and select I/O banks |
| M20 | VCCO_13 | I/O bank 13 output supply (1.2–3.3V selectable) - sets voltage level for connected DDR3 DQ/DQS signals |
| T14 | MGTAVCC | Analog transceiver supply (1.0V) - requires ultra-low-noise regulation for <1.5 ps RMS jitter compliance |
| R15 | INIT_B | Open-drain initialization status - pulled low during configuration failure or CRC error detection |
| P16 | CCLK | Configuration clock input - driven by PROM or external controller during Master SPI mode |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Hard IP | Reduces RTL integration effort and ensures protocol compliance without soft-core licensing or timing closure risk |
| AXI4-Stream Interface Support | Enables plug-and-play data flow between IP cores (e.g., FFT → DMA → Ethernet MAC) without custom handshaking logic |
| Partial Reconfiguration | Allows dynamic swapping of functional modules (e.g., modulator/demodulator) without full system reset or downtime |
| HMAC Authentication | Verifies bitstream integrity before loading, preventing unauthorized firmware injection in secured medical or defense systems |
| Multi-Voltage I/O Banks | Permits simultaneous interfacing to 1.2V DDR3, 1.8V eMMC, and 3.3V legacy peripherals on same device |
Applications
| Radar Signal Processing | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in ground-based air traffic control radar. IC Role / Device Role / Timing Role: FPGA fabric executes matched filtering, CFAR detection, and beamforming; transceivers interface to ADC/DAC FMC mezzanine. Use Value: 2,080 DSP slices enable 16-channel parallel FFTs at 200 MSPS, meeting sub-millisecond latency requirements. | Use Scenario: Aggregation and packet forwarding in telecom central office line cards. IC Role / Device Role / Timing Role: Handles 10G MAC layer, SERDES termination, and traffic shaping; PCIe Gen2 x8 connects to host CPU. Use Value: 400 user I/Os support dual 10G SFP+ cages plus management interfaces, eliminating need for companion PHYs. |
| Medical Ultrasound Beamformer | Industrial Vision Inspection System |
Use Scenario: Digital beam synthesis and RF echo processing in portable ultrasound scanners. IC Role / Device Role / Timing Role: Configurable logic implements delay-and-sum beamforming; block RAM stores channel calibration coefficients. Use Value: 28.5 Mb block RAM holds 256-channel coefficient tables with zero external memory access latency. | Use Scenario: High-speed image preprocessing and defect classification on factory-floor vision controllers. IC Role / Device Role / Timing Role: Captures 12-bit 100-MHz camera streams via LVDS receivers; runs Sobel edge detection in hardware. Use Value: -2L speed grade sustains 250 MHz pixel clock timing across full temperature range without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU040-2FFVA1156I | UltraScale architecture, 504,000 logic cells, 22.5 Mb BRAM, 16.3 Gb/s transceivers, larger 1156-ball package | Better suited for 25G+ networking or AI inference acceleration requiring higher DSP density | Select when migrating to 16nm node for improved power efficiency or needing >13.1 Gb/s serial links |
| XC7K325T-2FFG676I | Same Kintex-7 family, 326,080 logic cells, 1,440 DSP slices, identical 676-ball FCBGA package | Lower gate count and DSP resources; suitable for cost-optimized 10G Ethernet or mid-tier radar variants | Choose for pin-compatible upgrade path where XC7K410T resources exceed requirements and BOM cost reduction is critical |
Compared with XC7K410T-L2FBG676I, XCKU040-2FFVA1156I offers higher bandwidth and scalability but requires PCB redesign, while XC7K325T-2FFG676I delivers identical footprint and toolchain compatibility at reduced logic capacity-enabling incremental performance tuning without layout change.
Availability
XC7K410T-L2FBG676I is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet infrastructure, and medical imaging systems requiring stable component supply and long-term industrial temperature support.
Supply support for XC7K410T-L2FBG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace applications.
The Kintex-7 FPGA product line delivers optimized performance-per-watt for high-throughput, real-time signal and packet processing in communications and instrumentation systems.
FAQ
What is the maximum transceiver line rate supported by XC7K410T-L2FBG676I?
The XC7K410T-L2FBG676I supports a maximum transceiver line rate of 13.1 Gb/s per lane. This capability enables direct interfacing with 10G Ethernet PHYs, CPRI optical modules, and high-speed ADC/DAC converters. The transceivers comply with industry standards including PCIe Gen2, SATA, and SRIO. Performance is guaranteed under industrial temperature conditions when operated within specified voltage and cooling constraints.
Does XC7K410T-L2FBG676I support partial reconfiguration?
Yes, XC7K410T-L2FBG676I supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic replacement of specific logic regions without resetting the entire device. Use cases include runtime protocol switching (e.g., LTE to 5G NR) or adaptive filter updates in radar systems. Implementation requires dedicated configuration controller logic and careful floorplanning to isolate reconfigurable partitions.
What configuration modes are available for XC7K410T-L2FBG676I?
XC7K410T-L2FBG676I supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Master SPI uses an internal oscillator to drive external serial PROM; Slave SelectMAP enables high-speed parallel loading from microcontroller or processor; JTAG is used for debugging and programming during development. All modes support bitstream encryption and HMAC authentication for secure boot.
Is XC7K410T-L2FBG676I pin-compatible with other Kintex-7 devices in the same package?
XC7K410T-L2FBG676I shares the 676-ball FCBGA package with XC7K325T-2FFG676I and XC7K160T-2FFG676I, and pin assignments for power, ground, configuration, and I/O banks are consistent across these variants. However, transceiver location and certain dedicated I/O functions differ. Full pin compatibility requires verification against the specific device's pinout table and bank voltage constraints.
What is the thermal design power (TDP) of XC7K410T-L2FBG676I under typical operating conditions?
The typical thermal design power (TDP) of XC7K410T-L2FBG676I is 22.5 W, measured under representative industrial workload conditions including active logic, DSP, and transceiver usage. This value assumes proper decoupling, 1.0 V core supply, and ambient temperature of 85°C. Actual power varies with design utilization, clock frequency, and I/O activity, and should be validated using Xilinx Power Estimator (XPE) with the final netlist.
XC7K410T-L2FBG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K410T-L2FBG676I FAQ
1.How can I place an order for XC7K410T-L2FBG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-L2FBG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-L2FBG676I reliable?
The price and inventory of XC7K410T-L2FBG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-L2FBG676I is usually 5 days.
3.What payment methods are accepted for XC7K410T-L2FBG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-L2FBG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-L2FBG676I?
XC7K410T-L2FBG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-L2FBG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-L2FBG676I?
For technical support, including XC7K410T-L2FBG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-L2FBG676I requirements.
6.How does Aetrix verify that XC7K410T-L2FBG676I is sourced from the original manufacturer or authorized distributors?
All XC7K410T-L2FBG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-L2FBG676I meets industry standards.
7.What is the process for return or replacement of XC7K410T-L2FBG676I?
All XC7K410T-L2FBG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-L2FBG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-L2FBG676I part is unused and in its original packaging.
Return procedure for XC7K410T-L2FBG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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