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AMD XC7K410T-L2FFG676I
- Part No.:
- XC7K410T-L2FFG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K410T-L2FFG676I.pdf
- Description:
- IC FPGA 400 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,291
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Product details
Overview
XC7K410T-L2FFG676I from AMD is a Kintex-7 FPGA featuring 405,000 logic cells, 2,080 DSP slices, and 28.5 Mb of block RAM, packaged in a 676-pin FCBGA with 0.8 mm pitch. It operates across industrial temperature range (–40°C to +100°C) and supports transceivers up to 6.6 Gb/s for high-speed serial interface applications in radar signal processing.
For engineers reviewing the XC7K410T-L2FFG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/Os), transceiver lane count (16 lanes), voltage supply requirements (1.0V core, 1.8V/3.3V I/O), and thermal design power (19.2 W typical).
Technical Context
The XC7K410T-L2FFG676I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated carry chains, and integrated PCIe Gen2 x8 endpoint capability. It includes 16 GTP transceivers supporting SATA, SRIO, and CPRI protocols, and features SelectIO technology with support for LVDS, SSTL, HSTL, and MIPI D-PHY standards.
Configuration is performed via Master SPI or JTAG, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and AXI-4 compliant interconnect for heterogeneous system integration with ARM-based processors or soft-core microcontrollers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,000 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 2,080 - enables parallel multiply-accumulate operations for real-time filtering and FFT acceleration |
| Block RAM | 28.5 Mb - provides on-chip memory for buffering, FIFOs, and coefficient storage without external memory |
| User I/O Pins | 400 - supports high-density parallel bus interfaces and multi-standard I/O bank configuration |
| GTP Transceivers | 16 lanes @ 6.6 Gb/s - delivers serial connectivity for JESD204B, CPRI, and GigE PHY layers |
| Thermal Design Power | 19.2 W typical - defines heatsink and airflow requirements for sustained operation at full utilization |
| Operating Temperature | –40°C to +100°C - qualifies for industrial and outdoor embedded deployment without derating |
Pinout & Package
XC7K410T-L2FFG676I is housed in a 676-ball Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 0.8 mm ball pitch and 27 × 27 array configuration. The package supports thermal dissipation via exposed thermal pad and complies with JEDEC MO-271AB mechanical standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.0V to CLBs, DSP slices, and block RAM; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | Provides 1.8V to configuration logic, clock management, and transceiver analog circuitry |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2V–3.3V) enabling mixed-voltage interface interoperability |
| MRCC / SRCC | Multi-/Single-ended clock input | Accepts differential (LVDS/LVPECL) or single-ended (LVCMOS) clocks for global timing distribution |
| GTxP/N | Transceiver differential pair | Each GTxP/GTxN pair routes one high-speed serial lane (up to 6.6 Gb/s) |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP enables plug-and-play host communication without external bridge IC or firmware overhead |
| Partial Reconfiguration | Allows dynamic logic module swapping during operation-critical for adaptive radar waveform updates |
| AXI-4 Interconnect | Supports coherent data movement between FPGA fabric and external ARM cores or soft processors |
| Bitstream Encryption | HMAC-SHA256 authentication prevents unauthorized configuration loading and intellectual property theft |
| SelectIO Technology | Per-bank I/O standard flexibility eliminates level-shifter components in mixed-signal subsystems |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical digital down-conversion and CFAR detection algorithms; transceivers interface with ADC/DAC over JESD204B. Use Value: 405K logic cells enable concurrent multi-channel processing; 16 GTP lanes sustain 12.8 Gbps aggregate ADC data ingestion. | Use Scenario: High-throughput image reconstruction pipeline in portable ultrasound and MRI systems. IC Role / Device Role / Timing Role: Accelerates back-projection and iterative reconstruction kernels; interfaces with DDR3 memory and display controllers. Use Value: 28.5 Mb block RAM buffers raw k-space data; DSP slices deliver >2.1 TFLOPS peak compute for real-time tomographic rendering. |
| Industrial Ethernet Gateway | Avionics Data Concentrator |
Use Scenario: Deterministic protocol translation between PROFINET, EtherCAT, and Time-Sensitive Networking (TSN) endpoints. IC Role / Device Role / Timing Role: Implements hardware-timed packet scheduling, timestamping, and VLAN bridging using deterministic logic fabric. Use Value: 400 user I/Os support dual-port GigE PHYs and fieldbus connectors; PCIe Gen2 x8 enables host CPU offload. | Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B data aggregation in flight control computers. IC Role / Device Role / Timing Role: Serves as deterministic switch fabric with time-triggered scheduling and end-to-end latency monitoring. Use Value: Industrial temperature rating (–40°C to +100°C) ensures reliability in unpressurized avionics bays; encrypted bitstream secures DO-254 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture; higher logic density (568K LC), 20 Gb/s GTY transceivers, 1.2V core | Better suited for 5G massive MIMO and AI inference acceleration requiring >100 Gbps serial bandwidth | Choose XCKU060 if migrating to higher bandwidth or needing hardened 100G Ethernet MAC |
| XC7K325T-2FFG676I | Same Kintex-7 family; reduced logic (326K LC), 12 GTP lanes, identical 676-pin FFG package | Lower cost option for mid-tier radar or imaging where 405K LC and 16 lanes are not fully utilized | Choose XC7K325T for BOM cost optimization when design fits within its resource ceiling |
Compared with XC7K410T-L2FFG676I, XCKU060 offers higher transceiver speed and logic capacity but requires PCB redesign due to different package and voltage rails; XC7K325T shares pin compatibility and thermal profile but trades 19% logic and 25% transceiver count for cost reduction.
Availability
XC7K410T-L2FFG676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and industrial Ethernet gateway applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC7K410T-L2FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace applications, with heritage in FPGA innovation through its Xilinx acquisition.
The Kintex-7 family targets high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources-optimized for wireless infrastructure, video processing, and industrial automation.
FAQ
What is the maximum transceiver data rate supported by XC7K410T-L2FFG676I?
The XC7K410T-L2FFG676I supports GTP transceivers operating up to 6.6 Gb/s per lane. This rate is validated across all 16 transceiver quads under industrial temperature conditions and enables protocols including CPRI, SATA III, and JESD204B subclass 0/1. The XC7K410T-L2FFG676I does not support higher-rate GTY or GTH transceivers found in UltraScale devices.
Does XC7K410T-L2FFG676I support partial reconfiguration?
Yes, the XC7K410T-L2FFG676I natively supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic swapping of logic modules while maintaining system operation-essential for adaptive radar waveform updates or protocol stack upgrades. The XC7K410T-L2FFG676I implements frame-based reconfiguration with CRC-protected bitstream segments.
What I/O standards are supported by XC7K410T-L2FFG676I?
The XC7K410T-L2FFG676I supports LVDS, LVPECL, SSTL-18/25, HSTL-I/II, MIPI D-PHY, and LVCMOS across its 400 user I/Os. Each of the 24 I/O banks can be independently configured for voltage and standard. The XC7K410T-L2FFG676I does not support RSDS or BLVDS beyond the documented SelectIO capabilities.
Is XC7K410T-L2FFG676I qualified for automotive applications?
No, the XC7K410T-L2FFG676I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific screening, failure-in-time (FIT) reporting, and zero-defect manufacturing controls required for automotive safety-critical systems. For such use cases, AMD recommends the XA series derivatives of Kintex-7.
What configuration modes are available for XC7K410T-L2FFG676I?
The XC7K410T-L2FFG676I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Master SPI is most common for standalone boot from quad-SPI flash; JTAG is used for debugging and programming during development. The XC7K410T-L2FFG676I also supports fallback configuration and multi-boot via external mode pins.
XC7K410T-L2FFG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K410T-L2FFG676I FAQ
1.How can I place an order for XC7K410T-L2FFG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-L2FFG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-L2FFG676I reliable?
The price and inventory of XC7K410T-L2FFG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-L2FFG676I is usually 5 days.
3.What payment methods are accepted for XC7K410T-L2FFG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K410T-L2FFG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K410T-L2FFG676I?
XC7K410T-L2FFG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K410T-L2FFG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-L2FFG676I?
For technical support, including XC7K410T-L2FFG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-L2FFG676I requirements.
6.How does Aetrix verify that XC7K410T-L2FFG676I is sourced from the original manufacturer or authorized distributors?
All XC7K410T-L2FFG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-L2FFG676I meets industry standards.
7.What is the process for return or replacement of XC7K410T-L2FFG676I?
All XC7K410T-L2FFG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-L2FFG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-L2FFG676I part is unused and in its original packaging.
Return procedure for XC7K410T-L2FFG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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