AMD XC7K410T-L2FFG900E

Overview

XC7K410T-L2FFG900E from AMD is a Kintex-7 FPGA with 405,550 logic cells, 2,080 DSP slices, and 28.5 Mb of block RAM, configured in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-speed serial interface and embedded vision applications.

For engineers reviewing the XC7K410T-L2FFG900E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 13.1 Gb/s, and -2L speed grade timing performance under industrial temperature range.

Technical Context

The XC7K410T-L2FFG900E implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated 18 × 25 multiplier-accumulator units, and integrated PCIe Gen2 x8 endpoint capability. It supports DDR3 memory interfaces up to 800 MHz and includes hardened Gigabit transceivers compliant with SATA, SRIO, and CPRI protocols.

This device integrates dual 32-bit AXI interconnects, clock management tiles with MMCM and PLL resources, and supports partial reconfiguration. The -2L speed grade guarantees setup/hold timing margins at 100 °C junction temperature across all I/O banks and transceiver lanes.

Key Specifications

Pinout & Package

XC7K410T-L2FFG900E is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-density PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing and high-speed interface applications.

Compared with XC7K410T-L2FFG900E, XCKU040-2FFVA1156E offers higher bandwidth but requires board redesign and new toolchain validation, whereas XC7K325T-2FFG900E provides drop-in scalability within the same package and speed grade for incremental feature reduction.

Availability

XC7K410T-L2FFG900E is available at Aetrix Electronics and suitable for 5G wireless infrastructure, medical imaging systems, and aerospace data acquisition requiring stable component supply and long-term industrial temperature support.

Supply support for XC7K410T-L2FFG900E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.

The Kintex-7 FPGA product line targets high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources - especially in wired communications, video processing, and test equipment.

FAQ

What is the maximum supported transceiver line rate for XC7K410T-L2FFG900E?

The XC7K410T-L2FFG900E supports a maximum transceiver line rate of 13.1 Gb/s across its GTH transceivers. This rating applies to all transceiver quads in Bank 224 and Bank 225 when operated within the –40 °C to +100 °C industrial temperature range and powered with specified MGTAVCC and MGTAVTT supplies. The XC7K410T-L2FFG900E achieves this performance using adaptive equalization and CDR circuitry compliant with CPRI, SATA III, and SRIO Gen2 standards.

Does XC7K410T-L2FFG900E include hard IP for PCI Express?

Yes, XC7K410T-L2FFG900E integrates a PCIe Gen2 x8 endpoint hard IP block compliant with the PCI Express Base Specification 2.1. This dedicated logic eliminates the need for soft-core PCIe implementations, reduces resource utilization, and guarantees protocol compliance. The XC7K410T-L2FFG900E supports both root complex and endpoint configurations through configuration space access and transaction layer arbitration.

What I/O standards are supported by XC7K410T-L2FFG900E?

XC7K410T-L2FFG900E supports LVCMOS (1.2 V to 3.3 V), LVDS, BLVDS, RSDS, Differential SSTL, and HSTL I/O standards across its HR and HP I/O banks. Each bank is independently configurable for voltage and standard, enabling mixed-voltage interfaces such as DDR3 SDRAM (SSTL15) alongside CMOS image sensors (LVCMOS18). The XC7K410T-L2FFG900E does not support GTL or PECL standards.

Is XC7K410T-L2FFG900E compatible with partial reconfiguration workflows?

Yes, XC7K410T-L2FFG900E fully supports partial reconfiguration using Vivado Design Suite tools and the ICAP interface. Reconfigurable partitions must be constrained to specific CLB columns and avoid crossing clock domain boundaries. The XC7K410T-L2FFG900E requires bitstream authentication and CRC checking during dynamic module loading to ensure functional integrity.

What is the industrial temperature range specification for XC7K410T-L2FFG900E?

The XC7K410T-L2FFG900E is rated for operation across the industrial temperature range of –40 °C to +100 °C junction temperature. This rating is guaranteed for all speed-critical paths including CLB timing, transceiver CDR lock, and memory controller interfaces under the -2L speed grade. The XC7K410T-L2FFG900E meets JEDEC JESD22-A104D thermal cycling requirements and supports extended life testing per JESD22-A108F.