AMD XC7K410T-L2FFG900I
- Part No.:
- XC7K410T-L2FFG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K410T-L2FFG900I.pdf
- Description:
- IC FPGA 500 I/O 900FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7K410T-L2FFG900I from AMD is a Kintex-7 FPGA featuring 405,550 logic cells, 2,080 DSP slices, 28.5 Mb of block RAM, 32 GTX transceivers supporting up to 12.5 Gb/s, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It serves as a high-performance programmable logic fabric in radar signal processing, high-speed data acquisition, and PCIe Gen3 endpoint designs.
For engineers reviewing the XC7K410T-L2FFG900I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, available I/O banks with SelectIO voltage support (1.2 V to 3.3 V), thermal performance under sustained 28 W typical power, and compatibility with Vivado Design Suite 2023.2+ for implementation.
Technical Context
The XC7K410T-L2FFG900I implements a heterogeneous architecture integrating configurable logic blocks (CLBs), hardened IP blocks (PCIe Gen3, Gigabit Ethernet MAC, memory controllers), and high-speed serial transceivers. Its -2 speed grade guarantees timing closure at 640 MHz for register-to-register paths and supports DDR3 interfaces up to 800 MHz (1600 MT/s).
It uses 28 nm HKMG process technology, includes 500 user I/O pins distributed across 34 selectable I/O banks, and supports configuration via quad-SPI, BPI, or JTAG. Configuration security includes AES-256 bitstream encryption and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 405,550 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 2,080 - enables parallel multiply-accumulate operations for FIR filters, FFTs, and matrix math |
| Block RAM | 28.5 Mb - supports large on-chip buffering, FIFOs, and lookup tables without external memory |
| GTX Transceivers | 32 lanes @ up to 12.5 Gb/s - provides native support for PCIe Gen3 x16, SRIO Gen2, and CPRI |
| I/O Pins | 500 user I/O - distributed across 34 banks with independent voltage support (1.2–3.3 V) |
| Speed Grade | -2 - guarantees timing closure at highest operating frequencies for critical paths |
| Temperature Range | Industrial (-40°C to +100°C) - qualified for deployment in harsh-environment embedded systems |
Pinout & Package
The XC7K410T-L2FFG900I is housed in a 900-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package with 35×35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad on underside enables efficient heat dissipation in high-power operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O for PS peripherals | Connects Zynq-7000 PS-side peripherals (SDIO, UART, SPI, I2C) when used in hybrid SoC context; not applicable in pure FPGA mode |
| HR Bank 0–33 | User-configurable I/O banks | Each bank supports independent VCCO (1.2–3.3 V) and VREF; enables mixed-voltage interface design |
| GTX Clock Inputs (GTCLK0/1) | Differential reference clock inputs | Drives internal PLLs for GTX transceiver lanes; requires AC-coupled 100 Ω differential termination |
| CONFIG_MODE[0:2] | Configuration mode selection | Sets boot source (SPI/BPI/JTAG); must be hardwired during PCB layout |
| INIT_B / PROGRAM_B | Configuration status and reset control | INIT_B indicates configuration memory readiness; PROGRAM_B triggers full reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| 32 GTX transceivers @ 12.5 Gb/s | Enables single-chip PCIe Gen3 x16 endpoint or dual 10GbE MAC + PHY implementation |
| 28.5 Mb total block RAM | Supports >128 deep × 16-bit dual-port RAMs or 256K × 36-bit FIFOs without external memory |
| AES-256 bitstream encryption | Prevents reverse engineering and unauthorized cloning of implemented logic design |
| SelectIO technology with 1.2–3.3 V support | Allows direct interfacing to legacy 3.3 V peripherals and low-voltage 1.2 V memory subsystems |
| Vivado Design Suite support | Provides synthesis, place-and-route, and bitstream generation with deterministic timing closure for -2 grade |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in airborne SAR systems requiring sub-microsecond latency. IC Role / Device Role / Timing Role: Configurable logic fabric executing adaptive filtering, beamforming, and CFAR detection pipelines. Use Value: 2,080 DSP slices enable concurrent 128-channel FFTs; GTX transceivers stream raw ADC data at 8 Gb/s per lane. | Use Scenario: Multi-channel oscilloscope capturing 1 GS/s per channel with 12-bit resolution across 16 channels. IC Role / Device Role / Timing Role: Time-interleaved ADC controller and real-time decimation engine. Use Value: 500 I/O pins route parallel LVDS ADC outputs; block RAM buffers 4 Msample/channel before PCIe upload. |
| PCIe Gen3 Endpoint | Communications Baseband Processing |
Use Scenario: FPGA-based NVMe SSD controller handling 4× PCIe Gen3 lanes with end-to-end data integrity. IC Role / Device Role / Timing Role: PCIe root port logic, DMA engine, and NAND flash controller integrated into single die. Use Value: Native PCIe Gen3 hard IP eliminates soft-core overhead; -2 speed grade ensures 8 GT/s link stability under thermal stress. | Use Scenario: LTE-Advanced eNodeB remote radio head performing digital pre-distortion (DPD) and crest factor reduction. IC Role / Device Role / Timing Role: Real-time DPD coefficient update engine using adaptive LMS algorithm on 200+ MHz clock domain. Use Value: 405,550 logic cells implement parallelized 64-tap FIR filters; GTX lanes interface to DACs at 2.4576 GSPS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, 568,000 logic cells, 24 GTY transceivers up to 32.75 Gb/s, 1156-pin FCBGA | Better suited for 100G Ethernet and coherent optical interfaces; higher power and cost | Choose XCKU060 if migrating to 25+ Gb/s serial protocols or requiring >500K logic cells |
| XC7VX485T-2FFG1157I | Virtex-7 family, 485,760 logic cells, 36 GTH transceivers up to 13.1 Gb/s, 1157-pin FCBGA | Higher logic density and transceiver count but larger footprint and thermal envelope | Choose XC7VX485T for applications needing maximum logic capacity within 28 nm node, such as multi-gigabit packet processing |
Compared with XC7K410T-L2FFG900I, the XCKU060 offers higher serial bandwidth and newer architecture but requires board redesign; the XC7VX485T delivers more logic and transceivers in same process node but increases PCB area and cooling complexity.
Availability
XC7K410T-L2FFG900I is available at Aetrix Electronics and suitable for radar signal processing, high-speed data acquisition, and PCIe Gen3 endpoint applications requiring stable component supply over extended product lifecycles.
Supply support for XC7K410T-L2FFG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family targets high-performance, cost-sensitive applications such as wireless infrastructure, video processing, and test equipment where balanced logic, DSP, and I/O resources are essential.
FAQ
What is the maximum supported data rate for GTX transceivers on the XC7K410T-L2FFG900I?
The XC7K410T-L2FFG900I GTX transceivers support a maximum data rate of 12.5 Gb/s per lane. This enables compliance with PCIe Gen3 (8 GT/s), SATA III (6 Gb/s), and SRIO Gen2 (6.25 Gb/s) standards. The -2 speed grade ensures reliable operation at this rate under industrial temperature conditions.
Does the XC7K410T-L2FFG900I include built-in PCIe Gen3 hard IP?
No, the XC7K410T-L2FFG900I does not integrate hard PCIe Gen3 endpoint or root port IP. It relies on Xilinx's LogiCORE IP PCIe v3.0 core implemented in fabric. The GTX transceivers provide the physical layer; protocol handling is soft IP-based and consumes logic resources.
What configuration modes are supported by the XC7K410T-L2FFG900I?
The XC7K410T-L2FFG900I supports master SPI, slave SPI, BPI, and JTAG configuration modes. Mode selection is controlled by CONFIG_MODE[2:0] pins. Quad-SPI is commonly used for fast, secure bitstream loading from serial flash, while JTAG is reserved for debugging and programming during development.
Is AES-256 bitstream encryption available on the XC7K410T-L2FFG900I?
Yes, the XC7K410T-L2FFG900I supports AES-256 bitstream encryption with HMAC authentication. This feature requires a battery-backed RAM (BBRAM) or external eFUSE to store the decryption key. Encryption is enabled during bitstream generation in Vivado and verified during configuration.
What is the thermal design power (TDP) of the XC7K410T-L2FFG900I under typical operation?
The XC7K410T-L2FFG900I has a typical power consumption of 28 W under representative high-activity conditions, including active GTX transceivers, DSP usage, and I/O switching. Power estimates must be validated using Xilinx XPE tool with actual design netlist and activity factors; thermal solution must accommodate 100°C junction temperature.
XC7K410T-L2FFG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 31775
- Number of Logic Elements/Cells:
- 406720
- Total RAM Bits:
- 29306880
- Number of I/O:
- 500
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FCBGA (31x31)
XC7K410T-L2FFG900I FAQ
1.How can I place an order for XC7K410T-L2FFG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K410T-L2FFG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K410T-L2FFG900I reliable?
The price and inventory of XC7K410T-L2FFG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K410T-L2FFG900I is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K410T-L2FFG900I?
For technical support, including XC7K410T-L2FFG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K410T-L2FFG900I requirements.
6.How does Aetrix verify that XC7K410T-L2FFG900I is sourced from the original manufacturer or authorized distributors?
All XC7K410T-L2FFG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K410T-L2FFG900I meets industry standards.
7.What is the process for return or replacement of XC7K410T-L2FFG900I?
All XC7K410T-L2FFG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K410T-L2FFG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K410T-L2FFG900I part is unused and in its original packaging.
Return procedure for XC7K410T-L2FFG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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