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AMD XC7K420T-2FFG1156C
- Part No.:
- XC7K420T-2FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7K420T-2FFG1156C.pdf
- Description:
- IC FPGA 400 I/O 1156FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,153
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Product details
Overview
XC7K420T-2FFG1156C from AMD is a high-performance Kintex-7 FPGA with 419,400 logic cells, 2,040 DSP slices, and 32.1 Mb of block RAM, packaged in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) with 0.8 mm pitch. It targets high-bandwidth data processing in radar signal conditioning, 10G Ethernet line cards, and medical imaging subsystems.
For engineers reviewing the XC7K420T-2FFG1156C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (500 user I/Os), speed grade (-2), thermal performance (max junction temperature 100°C), and transceiver capability (16 GTX transceivers up to 6.6 Gb/s).
Technical Context
The XC7K420T-2FFG1156C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated PCIe Gen2 x8 endpoint/switch functionality. It supports DDR3 memory interfaces up to 1866 Mbps and includes hardened Gigabit transceivers compliant with IEEE 802.3 and CPRI standards.
Configuration is performed via JTAG, SPIx4, or SelectMAP interfaces; startup time is 40 ms from power-on reset. The device supports partial reconfiguration and includes built-in system monitoring (on-chip temperature and supply voltage sensors).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 419,400 - determines maximum combinational and sequential logic capacity for complex digital systems |
| DSP Slices | 2,040 - enables parallel execution of multiply-accumulate operations for real-time filtering and FFT |
| Block RAM | 32.1 Mb - provides on-die memory for buffering, FIFOs, and lookup tables without external SRAM |
| User I/Os | 500 - supports high-pin-count interface bridging between processors, ADCs, DACs, and FMC mezzanine connectors |
| GTX Transceivers | 16 × 6.6 Gb/s - delivers serial connectivity for JESD204B, CPRI, and 10GbE PHY layers |
| Speed Grade | -2 - guarantees timing closure at 640 MHz for register-to-register paths in worst-case industrial conditions |
| Max Junction Temp | 100°C - defines thermal derating limits for continuous operation in enclosed industrial enclosures |
Pinout & Package
XC7K420T-2FFG1156C is housed in a 1156-ball FC-FBGA package (1156AB) with 0.8 mm ball pitch, 35 mm × 35 mm body size, and standard JEDEC MO-271AC footprint. Thermal pad on underside requires solder paste stencil design per Xilinx UG475 v1.14 Section 3.3.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for CLBs, interconnect, and configuration logic; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration circuitry, clock management tiles, and transceiver analog bias |
| VCCO | I/O bank power | Programmable 1.2–3.3V per bank; sets output swing and input threshold for each I/O group |
| MGTAVCC | Transceiver analog supply | 1.0V supply for GTX analog front-end; must be isolated from digital supplies with ferrite beads |
| CLK_IN | Dedicated clock input | Single-ended or differential reference clock input to MMCM/PLL; supports 10–800 MHz range |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness and bitstream validity |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Hard IP block enabling direct host CPU attachment without external bridge IC or firmware overhead |
| DDR3 Memory Controller | Integrated controller supporting 1866 Mbps with 64-bit bus width and ECC support for reliable data acquisition buffers |
| Partial Reconfiguration | Allows dynamic swapping of logic partitions during operation-critical for multi-mode radar waveform adaptation |
| System Monitor | On-die ADC measuring VCCINT, VCCAUX, die temperature; enables closed-loop thermal throttling in fanless systems |
| JTAG Boundary Scan | IEEE 1149.1-compliant test access port supporting board-level interconnect verification and in-system programming |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems with >1000-element antenna arrays. IC Role / Device Role / Timing Role: Primary data-path processor handling ADC sample ingestion, FIR filtering, and FFT computation before host transfer. Use Value: 2,040 DSP slices enable concurrent 128-point complex FFTs at 200 MS/s, reducing latency below 5 µs per frame. | Use Scenario: Digital backend for 3T MRI scanners requiring real-time k-space data reconstruction and motion correction. IC Role / Device Role / Timing Role: High-throughput data aggregator interfacing with 32-channel ADCs and feeding GPU-accelerated reconstruction pipelines. Use Value: 500 user I/Os support simultaneous LVDS links to multiple ADCs while GTX transceivers stream compressed k-space data over optical fiber. |
| 10G Ethernet Line Card | Industrial Test Equipment |
Use Scenario: Aggregation and packet classification in telecom edge routers with dual 10GbE SFP+ ports and deep packet inspection. IC Role / Device Role / Timing Role: Traffic manager and classifier implementing TCAM-like pattern matching using distributed RAM and LUT-based state machines. Use Value: -2 speed grade ensures deterministic 10 GbE MAC timing closure across temperature, eliminating need for retiming SerDes buffers. | Use Scenario: Modular PXIe chassis controller performing synchronized multi-channel waveform generation and capture for semiconductor ATE. IC Role / Device Role / Timing Role: Timing engine and pattern sequencer coordinating 16-channel AWG/DIG modules with sub-nanosecond skew control. Use Value: Integrated MMCMs generate phase-aligned clocks at 1.2 GHz for DAC sampling and 625 MHz for ADC capture, maintaining <150 ps channel-to-channel skew. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, 568K logic cells, higher transceiver count (20 GTY @ 12.5 Gb/s), but larger die area and higher static power | Better suited for 25G+ optical transport and AI inference acceleration; less optimal for cost-sensitive radar subsystems | Select when bandwidth >10 Gb/s per lane and PCIe Gen3/Gen4 host interface are required |
| XC7VX690T-2FFG1927C | Virtex-7 family, 693K logic cells, same 28 nm node, but 1927-ball package and no PCIe hard IP | Preferred for ultra-high gate count compute engines where PCIe offload is handled externally | Choose for maximum logic density in fixed-function compute clusters where transceiver count is secondary |
Compared with XC7K420T-2FFG1156C, XCKU060-2FFVA1156I offers higher serial bandwidth and newer architecture at increased cost and power, while XC7VX690T-2FFG1927C trades PCIe integration for raw logic capacity and larger footprint-making XC7K420T-2FFG1156C optimal for balanced I/O, DSP, and protocol integration in space-constrained industrial platforms.
Availability
XC7K420T-2FFG1156C is available at Aetrix Electronics and suitable for radar signal conditioning, 10G Ethernet infrastructure, and medical imaging subsystems requiring stable component supply across extended product lifecycles.
Supply support for XC7K420T-2FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.
The Kintex-7 family was designed for high-performance, cost-optimized applications demanding balanced logic, DSP, memory, and I/O resources-targeting wireless infrastructure, video processing, and test & measurement equipment.
FAQ
What is the maximum supported data rate for GTX transceivers on the XC7K420T-2FFG1156C?
The XC7K420T-2FFG1156C integrates 16 GTX transceivers each capable of 6.6 Gb/s line rates. This enables compliance with JESD204B subclass 1, CPRI Option 3, and 10GBASE-R Ethernet physical layer specifications. Actual achievable rate depends on PCB stackup, reference clock jitter, and termination quality.
Does the XC7K420T-2FFG1156C include a hard PCIe Gen2 endpoint block?
Yes, the XC7K420T-2FFG1156C contains a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.1. It supports both root complex and endpoint modes and includes AXI4 streaming interfaces for direct DMA to external memory without soft-core overhead.
What is the recommended configuration mode for high-reliability industrial use of XC7K420T-2FFG1156C?
For high-reliability industrial use, master SPIx4 configuration mode is recommended for XC7K420T-2FFG1156C. It provides faster startup (≤25 ms), single-flash device dependency, and CRC-protected bitstream loading-reducing risk of configuration corruption compared to SelectMAP or JTAG-only methods.
Can the XC7K420T-2FFG1156C support DDR3 memory interfaces at 1866 Mbps?
Yes, the XC7K420T-2FFG1156C supports DDR3 SDRAM interfaces up to 1866 Mbps using its integrated MIG (Memory Interface Generator) core. This requires proper fly-by topology, on-die termination calibration, and strict trace length matching per UG586 v1.7 guidelines.
What thermal management guidance applies to the XC7K420T-2FFG1156C in sealed enclosures?
The XC7K420T-2FFG1156C has a maximum junction temperature of 100°C. In sealed industrial enclosures, thermal design must ensure case temperature stays ≤85°C using 2-layer thermal vias under the thermal pad, 2 oz copper planes, and ≥200 LFM airflow or conductive heatsinking per Xilinx AR55971.
XC7K420T-2FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 32575
- Number of Logic Elements/Cells:
- 416960
- Total RAM Bits:
- 30781440
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC7K420T-2FFG1156C FAQ
1.How can I place an order for XC7K420T-2FFG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K420T-2FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K420T-2FFG1156C reliable?
The price and inventory of XC7K420T-2FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K420T-2FFG1156C is usually 5 days.
3.What payment methods are accepted for XC7K420T-2FFG1156C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K420T-2FFG1156C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K420T-2FFG1156C?
XC7K420T-2FFG1156C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K420T-2FFG1156C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K420T-2FFG1156C?
For technical support, including XC7K420T-2FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K420T-2FFG1156C requirements.
6.How does Aetrix verify that XC7K420T-2FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC7K420T-2FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K420T-2FFG1156C meets industry standards.
7.What is the process for return or replacement of XC7K420T-2FFG1156C?
All XC7K420T-2FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K420T-2FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K420T-2FFG1156C part is unused and in its original packaging.
Return procedure for XC7K420T-2FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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