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AMD XC7K420T-2FFG901I
- Part No.:
- XC7K420T-2FFG901I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K420T-2FFG901I.pdf
- Description:
- IC FPGA 380 I/O 901FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,827
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Product details
Overview
XC7K420T-2FFG901I from AMD is a high-performance Kintex-7 FPGA featuring 419,400 logic cells, 2,040 DSP slices, and 28.5 Mb of block RAM, packaged in a 901-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) with -2 speed grade and industrial temperature range (-40°C to +100°C). It serves as a reconfigurable system-on-chip for high-bandwidth data processing in radar signal conditioning and 10G Ethernet line cards.
For engineers reviewing the XC7K420T-2FFG901I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (500 user I/Os), transceiver capability (16 GTX transceivers up to 6.6 Gb/s), configuration interface (SPIx4, JTAG), and thermal design power (24.5 W typical).
Technical Context
The XC7K420T-2FFG901I implements a 28 nm HKMG process architecture with SelectIO™ technology supporting LVDS, SSTL, HSTL, and TMDS I/O standards across 500 user-configurable pins. Its programmable logic fabric includes CLBs with dual 6-input LUTs and 8 flip-flops per slice, enabling high-density synchronous logic implementation.
It integrates 16 GTX serial transceivers with built-in PRBS generators/checkers, 8 clock management tiles (CMT) each containing a PLL and MMCM, and supports partial reconfiguration via ICAP interface. Configuration is performed through Master SPI or JTAG, with bitstream encryption and HMAC authentication available.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 419,400 - determines maximum combinational and sequential logic capacity for custom datapaths |
| DSP Slices | 2,040 - provides fixed-point arithmetic acceleration for FIR filters and FFT engines |
| Block RAM | 28.5 Mb - enables large on-chip buffering for video frame stores or packet queuing |
| GTX Transceivers | 16 × 6.6 Gb/s - supports 10GBASE-R, CPRI, and JESD204B physical layer interfaces |
| User I/O Pins | 500 - allows direct connection to high-speed ADCs, DACs, and memory controllers |
| Speed Grade | -2 - guarantees timing closure at 667 MHz DDR3 I/O and 500 MHz system clock frequencies |
| Operating Temp | -40°C to +100°C - qualified for industrial and outdoor base station environments |
Pinout & Package
XC7K420T-2FFG901I is housed in a 901-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package with 35×35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O Bank | Configurable as PS peripherals (SDIO, UART, SPI) or PL I/O with voltage-selectable banks |
| HR_IO[0:499] | High-Range I/O Bank | Supports 1.8 V/2.5 V/3.3 V signaling with programmable slew rate and drive strength |
| GTX_CLK0_M2P/GTX_CLK0_M2N | Differential Reference Clock Input | Provides low-jitter clock source for GTX transceiver PLL lock and data recovery |
| INIT_B, PROGRAM_B, DONE | Configuration Control | Control FPGA startup sequence, bitstream reload, and configuration completion status |
| VCCINT, VCCAUX, VCCO | Power Supply Rails | Separate 1.0 V core, 1.8 V auxiliary, and bank-specific I/O supply domains for noise isolation |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping without full device reset, critical for adaptive radio protocols |
| Integrated PCIe Gen2 x8 Endpoint | Reduces external bridge IC count and latency in host-connected accelerator designs |
| AXI Interconnect & DMA Controllers | Accelerates data movement between DDR3 memory, transceivers, and processing logic without CPU intervention |
| Bitstream Encryption & HMAC Auth | Prevents IP theft and ensures firmware integrity in deployed edge infrastructure |
| UltraScale-Compatible Toolflow | Allows migration path to higher-density families using same Vivado design environment |
Applications
| Radar Signal Processing | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in phased-array weather radar systems requiring low-latency FFT and CFAR computation. IC Role / Device Role / Timing Role: Configurable datapath accelerator handling ADC sample ingestion, digital down-conversion, and beamforming coefficient updates. Use Value: 2,040 DSP slices deliver 128 GMAC/s peak throughput, enabling sub-millisecond response for storm tracking. | Use Scenario: Aggregation and switching of 10GbE client interfaces in telecom central office routers. IC Role / Device Role / Timing Role: MAC-layer bridging engine with integrated 10GBASE-R PHY interface and traffic shaping logic. Use Value: 16 GTX transceivers support eight independent 10GbE ports with deterministic latency under 2.5 μs. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: High-resolution ultrasound beamformer with 256-channel echo digitization and real-time image reconstruction. IC Role / Device Role / Timing Role: Time-aligned data concentrator and FPGA-based GPU offload for B-mode rendering pipeline. Use Value: 500 user I/Os directly interface to 256-channel ADC array with sub-ns skew control across all lanes. | Use Scenario: Modular PXIe-based oscilloscope with 12-bit, 5 GS/s sampling and deep memory capture. IC Role / Device Role / Timing Role: High-speed data acquisition controller managing ADC synchronization, memory buffering, and PCIe streaming. Use Value: 28.5 Mb block RAM enables 256 MSamples capture depth at full 5 GS/s rate without external DRAM bottleneck. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, 568,000 logic cells, 24 GTY transceivers (up to 16.3 Gb/s), 33.8 Mb BRAM | Higher bandwidth and lower latency required for 25G+ optical transport and AI inference acceleration | Choose when migrating to higher-speed SerDes or needing >200k additional LUTs with identical footprint compatibility |
| XC7VX485T-2FFG1157I | Virtex-7 family, 485,760 logic cells, 24 GTX transceivers (6.6 Gb/s), 33.8 Mb BRAM, larger 1157-pin FFG package | Greater logic density and transceiver count needed for multi-protocol baseband processing in wireless infrastructure | Choose for higher gate count and transceiver count where board space permits larger package and higher power budget |
Compared with XC7K420T-2FFG901I, XCKU060-2FFVA1156I offers higher SerDes speed and logic density but requires PCB redesign due to different package and power delivery; XC7VX485T-2FFG1157I delivers more resources in a larger footprint but maintains same GTX transceiver spec and toolchain compatibility.
Availability
XC7K420T-2FFG901I is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet line cards, and medical imaging backend systems requiring stable component supply across extended product lifecycles.
Supply support for XC7K420T-2FFG901I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets with focus on performance-per-watt efficiency.
The Kintex-7 family targets cost-optimized high-performance applications including wired communications, video processing, and test equipment where balanced logic, DSP, and I/O resources are essential.
FAQ
What is the maximum supported DDR3 memory interface speed for XC7K420T-2FFG901I?
The XC7K420T-2FFG901I supports DDR3 memory interfaces up to 800 MHz data rate (1600 MT/s) using its MIG IP core with -2 speed grade timing constraints. This requires proper PCB layout adherence to Xilinx UG586 guidelines and use of compatible memory components rated for industrial temperature operation. The XC7K420T-2FFG901I achieves this performance with calibrated read/write leveling and dynamic ODT control.
Does XC7K420T-2FFG901I support partial reconfiguration in production systems?
Yes, XC7K420T-2FFG901I supports runtime partial reconfiguration via ICAP interface as documented in UG908. This capability enables field-upgradable logic modules without full device reset, validated for use in radar waveform adaptation and protocol stack updates. The XC7K420T-2FFG901I requires bitstream encryption keys provisioned during initial programming to secure reconfiguration payloads.
What configuration modes are supported by XC7K420T-2FFG901I?
XC7K420T-2FFG901I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Master SPI with quad-I/O is most common for fast boot from flash devices, while JTAG is used for debugging and programming during development. The XC7K420T-2FFG901I also supports fallback configuration and multi-boot with golden image recovery.
How many GTX transceivers does XC7K420T-2FFG901I include and what protocols do they support?
XC7K420T-2FFG901I includes 16 GTX transceivers operating up to 6.6 Gb/s, supporting protocols including 10GBASE-R, CPRI v6.1, OBSAI RP3, and JESD204B subclass 0/1. Each transceiver has dedicated TX/RX phase alignment circuits and built-in PRBS generators/checkers. The XC7K420T-2FFG901I transceivers are electrically compliant with ANSI X3.230-1994 and IEEE 802.3ae specifications.
Is XC7K420T-2FFG901I qualified for industrial temperature operation?
Yes, XC7K420T-2FFG901I is specified for industrial temperature range (-40°C to +100°C) and undergoes extended burn-in and characterization per Xilinx qualification standards. Its thermal design power is 24.5 W typical under worst-case vector conditions, requiring appropriate heatsinking in enclosed environments. The XC7K420T-2FFG901I meets JEDEC JESD22-A108F reliability testing requirements.
XC7K420T-2FFG901I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 32575
- Number of Logic Elements/Cells:
- 416960
- Total RAM Bits:
- 30781440
- Number of I/O:
- 380
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 901-FCBGA (31x31)
XC7K420T-2FFG901I FAQ
1.How can I place an order for XC7K420T-2FFG901I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K420T-2FFG901I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K420T-2FFG901I reliable?
The price and inventory of XC7K420T-2FFG901I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K420T-2FFG901I is usually 5 days.
3.What payment methods are accepted for XC7K420T-2FFG901I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K420T-2FFG901I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K420T-2FFG901I?
XC7K420T-2FFG901I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K420T-2FFG901I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K420T-2FFG901I?
For technical support, including XC7K420T-2FFG901I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K420T-2FFG901I requirements.
6.How does Aetrix verify that XC7K420T-2FFG901I is sourced from the original manufacturer or authorized distributors?
All XC7K420T-2FFG901I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K420T-2FFG901I meets industry standards.
7.What is the process for return or replacement of XC7K420T-2FFG901I?
All XC7K420T-2FFG901I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K420T-2FFG901I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K420T-2FFG901I part is unused and in its original packaging.
Return procedure for XC7K420T-2FFG901I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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