AMD XC7K480T-2FFG1156C
- Part No.:
- XC7K480T-2FFG1156C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1156-BBGA, FCBGA
- Datasheet:
-
XC7K480T-2FFG1156C.pdf
- Description:
- IC FPGA 400 I/O 1156FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7K480T-2FFG1156C from AMD is a high-performance Kintex-7 FPGA featuring 477,720 logic cells, 2,040 DSP slices, 28.05 Mb of block RAM, and support for up to 600 I/Os in the FFG1156 flip-chip fine-pitch BGA package. It operates at -2 speed grade with 1.0V core voltage and targets high-bandwidth data processing in radar signal chains and 10G Ethernet line cards.
For engineers reviewing the XC7K480T-2FFG1156C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, transceiver lane count (24 GTP/GTX), block RAM depth, DSP slice precision (25×18-bit), and thermal performance in convection-cooled 1U systems.
Technical Context
The XC7K480T-2FFG1156C implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and 36-Kb block RAMs with true dual-port capability. It integrates 24 GTPE2 transceivers supporting 2.488–6.6 Gbps line rates and includes SelectIO technology with support for LVDS, SSTL, HSTL, and differential signaling standards.
Configuration is performed via JTAG, Master SPI, or Slave SelectMAP interfaces. The device supports partial reconfiguration and includes built-in system monitoring (temperature, voltage, supply current) with on-chip analog-to-digital converter (XADC).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 477,720 - determines maximum combinational/sequential logic capacity for complex state machines and datapaths |
| DSP Slices | 2,040 - enables parallel execution of 25×18-bit multiply-accumulate operations per slice |
| Block RAM | 28.05 Mb - provides on-chip memory for FIFOs, buffers, and coefficient storage without external DRAM |
| GTPE2 Transceivers | 24 lanes - supports 10G Ethernet, CPRI, and JESD204B serial protocols with embedded clocking |
| I/O Count | 600 - enables high-pin-count interface consolidation including DDR3 memory controllers and PCIe Gen2 x8 |
| Speed Grade | -2 - guarantees timing closure at 1.0V core voltage with worst-case junction temperature of 100°C |
| Package | FFG1156 - 1156-ball flip-chip BGA with 0.8 mm pitch, optimized for thermal dissipation and signal integrity |
Pinout & Package
XC7K480T-2FFG1156C is housed in a 1156-ball flip-chip fine-pitch BGA (FFG) package with 0.8 mm ball pitch, designed for low-inductance power delivery and controlled impedance routing. Thermal pad under die improves junction-to-board heat transfer in high-power operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration, JTAG, and transceiver reference circuitry |
| VCCO | I/O bank power | Programmable 1.2–3.3V supply per I/O bank enabling mixed-voltage interface support |
| MRCC / SRCC | Multi-/Single-ended clock input | Dedicated differential clock inputs with internal termination and buffer distribution |
| GTX/GTP RefClk | Transceiver reference clock | Low-jitter differential input for GTPE2 transceiver PLL lock and data recovery |
| MIO[0:53] | Multifunction I/O | Configurable as PS I/O, GPIO, or peripheral interface pins for Zynq-7000 integration mode |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping during operation without full device reset |
| XADC Monitoring | On-chip 12-bit ADC with dual analog inputs for real-time thermal and supply voltage telemetry |
| SelectIO Technology | Supports 21 I/O standards including LVDS_25, SSTL15, and HSTL_I with programmable drive strength and slew rate |
| PCIe Gen2 x8 Endpoint | Hard IP block delivering 5 GT/s per lane with integrated TLP parsing and error reporting |
| DDR3 Memory Controller | Integrated controller supporting 800 MHz data rate, 16-bit bus width, and 2 GB address space |
Applications
| Radar Signal Processing | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute fabric executing FFT, CFAR, and digital down-conversion pipelines with deterministic latency. Use Value: 2,040 DSP slices enable concurrent 1024-point FFTs at 200 MS/s; GTPE2 transceivers interface directly to ADC/DAC JESD204B links. | Use Scenario: MAC-to-PHY bridging and packet classification in telecom infrastructure line cards. IC Role / Device Role / Timing Role: Protocol-aware traffic manager handling VLAN tagging, QoS scheduling, and CRC offload. Use Value: 600 I/Os support dual 10G SFP+ interfaces plus management bus; PCIe Gen2 x8 connects to host CPU with sub-100 ns interrupt latency. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: High-throughput image reconstruction in CT and MRI systems using iterative algorithms. IC Role / Device Role / Timing Role: Accelerator co-processor interfacing with multi-channel ADC front-end and DDR3 frame buffer. Use Value: 28.05 Mb block RAM stores multiple 512×512 image tiles; 24 GTPE2 lanes handle raw sensor data at 5 Gbps per channel. | Use Scenario: Real-time waveform analysis and protocol decoding in high-bandwidth oscilloscopes and logic analyzers. IC Role / Device Role / Timing Role: Time-stamped acquisition engine synchronizing multi-channel sampling and triggering logic. Use Value: MRCC/SRCC clock inputs provide sub-10 ps jitter for 1 GS/s sampling; XADC monitors board temperature to compensate gain drift. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, 492K logic cells, higher transceiver count (32 GTY), 1.2V core, -2I speed grade | Better suited for 25G+ serial protocols and larger memory-mapped designs requiring >32 GB DDR4 | Select when migrating to 16nm process, needing higher bandwidth or lower static power at extended temperature range |
| XC7VX690T-2FFG1927C | Virtex-7 family, 693K logic cells, 36 GTHE2 transceivers, 1927-ball FFG package, same -2 speed grade | Targeted at ultra-high I/O density and multi-protocol backplanes where pin count exceeds 600 | Choose for legacy Virtex-7 design continuity or when >600 I/Os and >36 transceivers are required in same footprint class |
Compared with XC7K480T-2FFG1156C, XCKU060-2FFVA1156I offers higher serial bandwidth and lower power but requires PCB redesign due to different package and voltage rails; XC7VX690T-2FFG1927C delivers greater logic and I/O resources in a larger package, maintaining Kintex-7-compatible toolflow while increasing board area and thermal load.
Availability
XC7K480T-2FFG1156C is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet infrastructure, and medical imaging backend systems requiring stable component supply across multi-year production cycles.
Supply support for XC7K480T-2FFG1156C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace applications.
The Kintex-7 family was engineered for cost-optimized high-performance applications demanding balanced logic, DSP, memory, and I/O resources - especially in communications, video processing, and test equipment.
FAQ
What is the maximum supported data rate for GTPE2 transceivers in XC7K480T-2FFG1156C?
The XC7K480T-2FFG1156C supports GTPE2 transceivers with a maximum line rate of 6.6 Gbps. This enables compliance with 10GBASE-R Ethernet, CPRI Option 3, and JESD204B subclass 1 protocols. Each transceiver lane includes a dedicated CDR and elastic buffer, and the device contains 24 such lanes distributed across eight quads.
Does XC7K480T-2FFG1156C support partial reconfiguration?
Yes, XC7K480T-2FFG1156C fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic replacement of logical modules-such as filter banks or protocol engines-without resetting the entire device. Configuration is managed via ICAP and FRAME_ECC, with bitstream authentication optional via HMAC-SHA256.
What I/O standards are supported by XC7K480T-2FFG1156C?
XC7K480T-2FFG1156C supports 21 SelectIO standards including LVDS_25, SSTL15_T_DCI, HSTL_I, DIFF_HSTL_I, MIPI_DPHY, and PCI33_3. Each I/O bank is independently powered (VCCO = 1.2–3.3 V), and programmable features include output drive strength (2–24 mA), slew rate control, and on-die termination (ODT) calibration.
What is the operating temperature range for XC7K480T-2FFG1156C?
XC7K480T-2FFG1156C is rated for commercial temperature range: 0°C to 85°C ambient. Junction temperature must not exceed 100°C under worst-case operating conditions. Thermal design must account for 18.5 W typical dynamic power consumption and use the exposed thermal pad in the FFG1156 package for effective heat transfer to the PCB.
Can XC7K480T-2FFG1156C be configured via JTAG only?
No, XC7K480T-2FFG1156C supports three primary configuration modes: JTAG (for debugging and programming), Master SPI (using on-chip boot ROM and external flash), and Slave SelectMAP (for high-speed parallel loading from microcontroller or processor). All modes support fallback and multi-boot images stored in external SPI flash.
XC7K480T-2FFG1156C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 1156-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37325
- Number of Logic Elements/Cells:
- 477760
- Total RAM Bits:
- 35205120
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1156-FCBGA (35x35)
XC7K480T-2FFG1156C FAQ
1.How can I place an order for XC7K480T-2FFG1156C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K480T-2FFG1156C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC7K480T-2FFG1156C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K480T-2FFG1156C is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K480T-2FFG1156C?
For technical support, including XC7K480T-2FFG1156C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K480T-2FFG1156C requirements.
6.How does Aetrix verify that XC7K480T-2FFG1156C is sourced from the original manufacturer or authorized distributors?
All XC7K480T-2FFG1156C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K480T-2FFG1156C meets industry standards.
7.What is the process for return or replacement of XC7K480T-2FFG1156C?
All XC7K480T-2FFG1156C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K480T-2FFG1156C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K480T-2FFG1156C part is unused and in its original packaging.
Return procedure for XC7K480T-2FFG1156C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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