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AMD XC7K480T-2FFG901I

Part No.:
XC7K480T-2FFG901I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
900-BBGA, FCBGA
Datasheet:
AetrixXC7K480T-2FFG901I.pdf
Description:
IC FPGA 380 I/O 901FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,790

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Product details

Overview

XC7K480T-2FFG901I from AMD is a high-performance Kintex-7 FPGA with 477,750 logic cells, 28,450 DSP slices, and 34.8 Mb of block RAM, packaged in a 901-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) with 0.8 mm pitch. It targets high-speed serial communication systems requiring deterministic latency and multi-gigabit transceivers.

For engineers reviewing the XC7K480T-2FFG901I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (up to 13.1 Gbps), I/O voltage support (1.2 V to 3.3 V), thermal design power (33.5 W typical), and -2 speed grade timing performance.

Technical Context

The XC7K480T-2FFG901I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 36-Kb RAM blocks, and integrated PCIe Gen2 x8 endpoint capability. It supports DDR3 memory interfaces up to 1,866 Mbps and includes 24 transceiver quads operating at 600 Mbps–13.1 Gbps.

Its configuration interface supports Master SPI, Slave SelectMAP, and JTAG modes, and it integrates dual 10-bit ADCs for on-chip monitoring. The device uses configuration security features including AES bitstream encryption and HMAC authentication.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells477,750 - determines maximum combinational/sequential logic capacity for complex digital signal processing pipelines
DSP Slices28,450 - enables parallel execution of multiply-accumulate operations for radar, video, or AI inference acceleration
Block RAM34.8 Mb - supports large on-chip data buffering for packet assembly, frame storage, or FIFO depth scaling
Transceiver Line Rate13.1 Gbps - meets CPRI, JESD204B, and 10G Ethernet PHY requirements without external retimers
I/O StandardsLVCMOS, LVDS, SSTL, HSTL, TMDS - allows direct interfacing with FPGAs, ADCs, DACs, and memory without level-shifting
Speed Grade-2 - guarantees timing closure at worst-case junction temperature (100°C) and VCCINT = 0.95 V
TDP33.5 W typical - defines heatsink sizing and airflow requirements for conduction-cooled industrial enclosures

Pinout & Package

XC7K480T-2FFG901I is housed in a 901-pin Flip-Chip Fine-Pitch BGA (FCBGA) package with 0.8 mm ball pitch, 31 × 31 array, and thermal lid. Package dimensions are 31.0 mm × 31.0 mm × 2.85 mm (height).

Pin/TerminalCircuit RoleDesign Meaning
MIO[0:15]Multiplexed I/O bankConfigurable as PS peripherals (UART, SPI, I2C, SDIO) or PL I/O; supports 1.8 V/3.3 V operation
HR Bank 0–13High-range I/O bankSupports 1.2 V–3.3 V signaling; each bank has dedicated VCCO and VREF pins for mixed-voltage designs
HP Bank 14–33High-performance I/O bankOptimized for 1.2 V–1.8 V interfaces including DDR3, QDR, and differential protocols (LVDS, TMDS)
GTX/GTH TransceiversSerial transceiver lanes24 quads (96 lanes); each lane supports protocol-specific encoding (8b/10b, 64b/66b) and built-in PRBS generators
VCCINT / VCCAUX / VCCOPower supply domainsThree independent supplies: core (0.95 V), auxiliary (1.8 V), and I/O (configurable per bank)

Key Features

FeatureDesign Value
PCIe Gen2 x8 EndpointIntegrated hard IP eliminates need for external bridge chips and reduces latency in host-attached accelerator cards
DDR3 Memory ControllerHard macro supporting 1,866 Mbps with ECC, enabling reliable high-bandwidth memory access for baseband processing
AES-256 Bitstream EncryptionPrevents unauthorized cloning or reverse-engineering of firmware in deployed military or telecom infrastructure
Dual 10-bit ADCsMonitors on-die temperature and supply voltages without external sensors, simplifying system health diagnostics
JTAG Boundary ScanEnables IEEE 1149.1-compliant testing of PCB interconnects and solder joint integrity during manufacturing

Applications

Wireless Baseband ProcessingMedical Imaging Acceleration

Use Scenario: Real-time beamforming and MIMO signal processing in 4G/LTE and 5G NR remote radio units.

IC Role / Device Role / Timing Role: Programmable baseband processor implementing channel coding, FFT, and digital pre-distortion algorithms.

Use Value: 28,450 DSP slices enable concurrent execution of 128-channel DPD with sub-100 ns loop latency.

Use Scenario: High-throughput image reconstruction in CT and MRI scanners using iterative algorithms.

IC Role / Device Role / Timing Role: Hardware-accelerated compute engine offloading GPU/CPU for back-projection and filtering kernels.

Use Value: 477,750 logic cells support parallelized sinogram processing pipelines achieving 2× throughput over software-only implementations.

Avionics Data ConcentratorsTest & Measurement Equipment

Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 bus aggregation in flight control systems.

IC Role / Device Role / Timing Role: Deterministic real-time switch fabric with time-triggered scheduling and error containment zones.

Use Value: -2 speed grade ensures guaranteed timing closure under extended temperature range (-40°C to +100°C junction).

Use Scenario: Multi-channel high-speed digitizers with synchronized sampling and real-time FFT analysis.

IC Role / Device Role / Timing Role: Time-interleaved ADC controller and spectral processing unit with deterministic jitter < 200 fs RMS.

Use Value: Integrated GTX transceivers deliver 13.1 Gbps serial links to FPGA-to-FPGA or FPGA-to-ASIC data streaming without external serializers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU060-2FFVA1156IUltraScale architecture; higher logic density (568K LUTs); 16.3 Gbps transceivers; no integrated ADCBetter suited for 100G+ optical transport and AI training accelerators where raw bandwidth exceeds Kintex-7 capabilitySelect when migrating to 20 nm node for improved power efficiency and transceiver performance beyond 13.1 Gbps
XC7VX690T-2FFG1927IVirtex-7 family; 693,120 logic cells; 36 transceiver quads; higher TDP (45.2 W); larger 1927-pin FCBGATargeted at ultra-high I/O count systems like radar front-ends and high-end test equipment requiring >1,000 user I/OChoose when additional logic resources and transceiver count justify increased board area and thermal management complexity

Compared with XC7K480T-2FFG901I, XCKU060-2FFVA1156I offers higher transceiver speed and lower static power but lacks on-die ADCs, while XC7VX690T-2FFG1927I delivers greater logic capacity and I/O count at the cost of higher power and larger footprint-making XC7K480T-2FFG901I optimal for balanced high-performance embedded systems.

Availability

XC7K480T-2FFG901I is available at Aetrix Electronics and suitable for wireless infrastructure, medical imaging systems, avionics data concentrators, and high-speed test equipment requiring stable component supply across long product lifecycles.

Supply support for XC7K480T-2FFG901I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and client applications.

The Kintex-7 FPGA family was engineered for cost-optimized high-performance applications demanding advanced transceivers, DSP capability, and memory bandwidth-targeting wireless, video, and industrial systems.

FAQ

What is the maximum supported DDR3 data rate for XC7K480T-2FFG901I?

The XC7K480T-2FFG901I supports DDR3 memory interfaces up to 1,866 Mbps using its hardened memory controller. This capability is verified in UG473 v1.12 and applies to all Kintex-7 devices with HP I/O banks. The controller includes built-in ECC and supports fly-by topology with on-die termination calibration. XC7K480T-2FFG901I achieves this rate under -2 speed grade conditions at junction temperatures up to 100°C.

Does XC7K480T-2FFG901I include built-in configuration security features?

Yes, XC7K480T-2FFG901I integrates AES-256 bitstream encryption and HMAC-based authentication for secure configuration loading. These features are implemented in hardware and require no external security ICs. Configuration can be loaded via JTAG, Master SPI, or Slave SelectMAP with encrypted bitstreams stored in external flash. XC7K480T-2FFG901I enforces decryption before configuration begins, preventing unauthorized access to design IP.

How many transceiver quads does XC7K480T-2FFG901I provide, and what protocols do they support?

XC7K480T-2FFG901I provides 24 transceiver quads (96 total lanes), each supporting line rates from 600 Mbps to 13.1 Gbps. Protocols include PCIe Gen2, SATA, CPRI, JESD204B, and 10G Ethernet. Each quad includes built-in 8b/10b and 64b/66b encoders/decoders, PRBS generators/checkers, and clock correction logic. XC7K480T-2FFG901I's transceivers are fully compliant with IEEE 802.3ap and ANSI INCITS 301-1998 standards.

What thermal management guidance applies to XC7K480T-2FFG901I in industrial environments?

XC7K480T-2FFG901I has a typical thermal design power (TDP) of 33.5 W and operates over -40°C to +100°C junction temperature. AMD recommends a 25 mm² copper thermal pad beneath the package and a 15 W/m·K thermal interface material. For convection-cooled enclosures, a 30 LFM airflow achieves ≤85°C case temperature. XC7K480T-2FFG901I includes dual 10-bit on-die ADCs for real-time thermal monitoring, enabling dynamic throttling if required.

Is XC7K480T-2FFG901I compatible with Vivado Design Suite version 2023.1?

Yes, XC7K480T-2FFG901I is fully supported in Vivado Design Suite 2023.1, including synthesis, implementation, and bitstream generation. Device files and IP integrators for PCIe, DDR3, and transceivers are included out-of-the-box. XC7K480T-2FFG901I requires Vivado 2018.1 or later; earlier versions lack timing models for -2 speed grade at 100°C junction. Support extends through planned 2025 releases per AMD's FPGA tool roadmap.

XC7K480T-2FFG901I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Kintex®-7
Package/Case:
900-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
37325
Number of Logic Elements/Cells:
477760
Total RAM Bits:
35205120
Number of I/O:
380
Number of Gates:
-
Voltage - Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
901-FCBGA (31x31)

XC7K480T-2FFG901I FAQ

1.How can I place an order for XC7K480T-2FFG901I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7K480T-2FFG901I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7K480T-2FFG901I reliable?

The price and inventory of XC7K480T-2FFG901I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K480T-2FFG901I is usually 5 days.

3.What payment methods are accepted for XC7K480T-2FFG901I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K480T-2FFG901I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7K480T-2FFG901I?

XC7K480T-2FFG901I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7K480T-2FFG901I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7K480T-2FFG901I?

For technical support, including XC7K480T-2FFG901I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K480T-2FFG901I requirements.

6.How does Aetrix verify that XC7K480T-2FFG901I is sourced from the original manufacturer or authorized distributors?

All XC7K480T-2FFG901I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K480T-2FFG901I meets industry standards.

7.What is the process for return or replacement of XC7K480T-2FFG901I?

All XC7K480T-2FFG901I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K480T-2FFG901I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7K480T-2FFG901I part is unused and in its original packaging.

Return procedure for XC7K480T-2FFG901I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7K480T-2FFG901I Tags

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