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AMD XC7K480T-3FFG1156E

Part No.:
XC7K480T-3FFG1156E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1156-BBGA, FCBGA
Datasheet:
AetrixXC7K480T-3FFG1156E.pdf
Description:
IC FPGA 400 I/O 1156FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,630

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Product details

Overview

XC7K480T-3FFG1156E from AMD is a high-performance Kintex-7 FPGA with 477,750 logic cells, 2,800 DSP slices, and 32.1 Mb of block RAM, configured in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package for high-speed serial interface and compute-accelerated embedded vision systems.

For engineers reviewing the XC7K480T-3FFG1156E datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (500 user I/Os), transceiver line rate (13.1 Gb/s), speed grade (-3), and thermal design power (29.2 W at typical operation).

Technical Context

The XC7K480T-3FFG1156E implements a 28 nm HKMG process-based architecture with 24 transceiver quads supporting PCIe Gen3 x8, SATA 3.0, and SRIO 2.1 protocols. It integrates dual 36-bit wide memory controllers for DDR3/DDR3L up to 1866 Mbps and supports JTAG, SelectMAP, and SPI configuration modes.

It features hardened IP blocks including 24 GTX transceivers, 24 clock management tiles (CMT), and AXI-4 compliant interconnect infrastructure. Configuration security includes AES-256 bitstream encryption and HMAC authentication.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells477,750 - total programmable LUTs + flip-flops for complex digital logic implementation
DSP Slices2,800 - fixed-point arithmetic units supporting 25 × 18 multiply-accumulate per slice
Block RAM32.1 Mb - configurable as 36 Kb or 18 Kb primitives for on-chip data buffering
User I/O Pins500 - LVDS/LVCMOS-compatible pins with programmable slew rate and drive strength
Transceiver Line Rate13.1 Gb/s - maximum serial data rate per GTX channel for high-bandwidth interfaces
Speed Grade-3 - highest timing performance bin for Kintex-7, enabling 640 MHz system clock operation
TDP29.2 W - thermal design power at typical operating conditions, guiding heatsink selection

Pinout & Package

XC7K480T-3FFG1156E is housed in a 1156-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-271AC footprint. Thermal pad on underside requires solder paste stencil aperture and ground plane connection.

Pin/TerminalCircuit RoleDesign Meaning
MGTAVCC / MGTAVTTAnalog power supply for GTX transceiversMust be filtered separately with low-ESR ceramic capacitors; noise sensitivity ≤ 10 mVpp
CCLK / INIT_B / DONEConfiguration control signalsDrive CCLK externally during master SPI mode; DONE indicates successful bitstream loading
HR_IO_Lx / HR_IO_UxHigh-range I/O banks (1.8/2.5/3.3 V)Supports SSTL15/SSTL18/HSTL_I for memory interface; bank voltage must match VCCO
HP_IO_Lx / HP_IO_UxHigh-performance I/O banks (1.2/1.35/1.5/1.8 V)Enable differential standards (LVDS, TMDS) with internal termination; require matched trace lengths
VRP / VRNReference voltage inputs for I/O banksProvide stable reference for differential input receivers; must be decoupled with 0.1 µF capacitor

Key Features

FeatureDesign Value
24 GTX transceiversEach supports 600 Mb/s–13.1 Gb/s line rates with built-in 8B/10B encoder/decoder
Dual DDR3 memory controller2 × 64-bit interfaces with 1866 Mbps data rate and hardware calibration (DQS gating)
AES-256 bitstream encryptionPrevents unauthorized readback and cloning via on-chip decryption engine and key storage
AXI-4 interconnect fabricEnables seamless integration of soft-core processors (MicroBlaze), DMA engines, and peripherals
Configurable I/O standardsSupports 21 I/O standards including LVDS, SSTL, HSTL, and MIPI D-PHY (receiver only)

Applications

Medical Imaging AccelerationAvionics Data Concentrator

Use Scenario: Real-time CT/MRI image reconstruction pipeline with parallel filtering and back-projection kernels.

IC Role / Device Role / Timing Role: FPGA fabric executes custom HDL-accelerated algorithms; GTX transceivers stream raw detector data from ADC modules.

Use Value: 2,800 DSP slices enable simultaneous 32-channel beamforming; 13.1 Gb/s transceivers sustain 8× 1.25 Gb/s sensor links without bottlenecks.

Use Scenario: ARINC 664 (AFDX) end-system aggregating LRUs across multiple avionics bays.

IC Role / Device Role / Timing Role: Implements deterministic AFDX switch logic, time-triggered scheduling, and CRC-32 validation in hardware.

Use Value: -3 speed grade ensures sub-500 ns packet forwarding latency; 500 I/Os support 12× dual-redundant AFDX ports plus discrete monitoring signals.

5G Massive MIMO BasebandIndustrial Machine Vision Controller

Use Scenario: 64T64R massive MIMO baseband unit performing real-time precoding and channel estimation.

IC Role / Device Role / Timing Role: Hosts multi-threaded OFDM processing chain; DDR3 controllers buffer IQ samples between FFT and MIMO matrix operations.

Use Value: 32.1 Mb block RAM stores 128× 1024-point FFT twiddle tables; GTX transceivers interface directly with 4× 4.9152 Gbps CPRI links.

Use Scenario: High-speed PCB inspection system using 12 MP monochrome sensors and sub-pixel defect detection.

IC Role / Device Role / Timing Role: Synchronizes four CMOS image sensors, performs real-time blob analysis, and triggers laser marking.

Use Value: 477,750 logic cells implement 4× parallel Bayer demosaic pipelines; HP I/O banks drive 800 Mbps LVDS camera interfaces with <1 ns skew.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based acceleration applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU060-2FFVA1156IUltraScale architecture, 464,960 logic cells, 15.1 Gb/s GTY transceivers, higher static powerBetter for 25+ Gb/s serial protocols (PCIe Gen4, 100G Ethernet); less suitable for cost-sensitive DDR3-only designsSelect when migrating to higher-speed serial standards or requiring hardened 100G MAC cores
XC7VX690T-3FFG1927EVirtex-7 family, 693,120 logic cells, same -3 speed grade, larger 1927-pin FCBGA packageHigher logic density and transceiver count (36 GTX) for multi-die emulation or radar beamformer scalingChoose when >477K LUTs or >24 transceivers are required; verify PCB redesign for 1927-ball footprint

Compared with XC7K480T-3FFG1156E, XCKU060-2FFVA1156I offers higher serial bandwidth but increased power and cost, while XC7VX690T-3FFG1927E delivers greater logic capacity at the expense of board space and thermal management complexity.

Availability

XC7K480T-3FFG1156E is available at Aetrix Electronics and suitable for medical imaging acceleration, avionics data concentration, and 5G massive MIMO baseband applications requiring stable component supply and long-term industrial lifecycle support.

Supply support for XC7K480T-3FFG1156E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies, with leadership in FPGA, GPU, and CPU design.

The Kintex-7 family targets high-performance, cost-optimized applications such as wired communications, video processing, and embedded vision, balancing logic density, transceiver capability, and power efficiency.

FAQ

What is the maximum supported DDR3 data rate for XC7K480T-3FFG1156E?

The XC7K480T-3FFG1156E supports DDR3/DDR3L memory interfaces up to 1866 Mbps (933 MHz clock) using its dual hardened memory controllers. This rate is achievable with proper PCB layout, fly-by topology, and calibrated ODT settings per JEDEC specification. The XC7K480T-3FFG1156E memory controller includes automatic write-leveling and gate training to ensure signal integrity at full speed.

Does XC7K480T-3FFG1156E support PCIe Gen3 x8 endpoint functionality?

Yes, the XC7K480T-3FFG1156E supports PCIe Gen3 x8 endpoint operation using its 24 GTX transceivers and integrated PCIe hard IP block. It complies with PCI Express Base Specification v3.0 and supports link training, power management states (L0s/L1), and advanced error reporting. The XC7K480T-3FFG1156E requires external EEPROM for configuration and adheres to standard PCIe slot mechanical and electrical requirements.

What configuration modes are supported by XC7K480T-3FFG1156E?

The XC7K480T-3FFG1156E supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Master SPI is most common for single-bitstream boot from flash; JTAG enables boundary-scan testing and partial reconfiguration. All modes use the same dedicated configuration pins (CCLK, INIT_B, DONE, PROGRAM_B), and the XC7K480T-3FFG1156E automatically detects mode based on M[2:0] pin states at power-up.

Is XC7K480T-3FFG1156E qualified for extended temperature operation?

No, the XC7K480T-3FFG1156E is rated for commercial temperature range (0 °C to +85 °C ambient). It is not automotive-grade (AEC-Q100) or industrial-grade (–40 °C to +100 °C). For extended temperature applications, consider the XC7K480T-3FFG1156I variant, which shares identical logic resources and pinout but is screened for –40 °C to +100 °C operation.

How many GTX transceivers does XC7K480T-3FFG1156E include, and what protocols do they support?

The XC7K480T-3FFG1156E includes 24 GTX transceivers grouped into six quads, each supporting line rates from 600 Mb/s to 13.1 Gb/s. These transceivers natively support PCIe Gen3, SATA 3.0, SRIO 2.1, and 10GBase-R protocols via configurable physical coding sublayer (PCS) and physical medium attachment (PMA) layers. The XC7K480T-3FFG1156E transceivers do not support 25G+ protocols like CAUI or 100G Ethernet.

XC7K480T-3FFG1156E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Kintex®-7
Package/Case:
1156-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
37325
Number of Logic Elements/Cells:
477760
Total RAM Bits:
35205120
Number of I/O:
400
Number of Gates:
-
Voltage - Supply:
0.97V ~ 1.03V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1156-FCBGA (35x35)

XC7K480T-3FFG1156E FAQ

1.How can I place an order for XC7K480T-3FFG1156E through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7K480T-3FFG1156E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7K480T-3FFG1156E reliable?

The price and inventory of XC7K480T-3FFG1156E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K480T-3FFG1156E is usually 5 days.

3.What payment methods are accepted for XC7K480T-3FFG1156E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K480T-3FFG1156E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7K480T-3FFG1156E?

XC7K480T-3FFG1156E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7K480T-3FFG1156E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7K480T-3FFG1156E?

For technical support, including XC7K480T-3FFG1156E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K480T-3FFG1156E requirements.

6.How does Aetrix verify that XC7K480T-3FFG1156E is sourced from the original manufacturer or authorized distributors?

All XC7K480T-3FFG1156E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K480T-3FFG1156E meets industry standards.

7.What is the process for return or replacement of XC7K480T-3FFG1156E?

All XC7K480T-3FFG1156E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K480T-3FFG1156E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7K480T-3FFG1156E part is unused and in its original packaging.

Return procedure for XC7K480T-3FFG1156E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7K480T-3FFG1156E Tags

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