AMD XC7K480T-L2FFG901E
- Part No.:
- XC7K480T-L2FFG901E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA, FCBGA
- Datasheet:
-
XC7K480T-L2FFG901E.pdf
- Description:
- IC FPGA 380 I/O 901FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7K480T-L2FFG901E from AMD is a high-performance Kintex-7 FPGA with 477,750 logic cells, 2,800 DSP slices, 28.1 Mb of block RAM, 480 I/Os, and built-in multi-gigabit transceivers supporting up to 13.1 Gb/s. It targets high-bandwidth data processing in radar signal conditioning and 10G Ethernet line cards.
For engineers reviewing the XC7K480T-L2FFG901E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), thermal design power (22.5 W typical), and configuration interface options (JTAG, SelectMAP, SPI).
Technical Context
The XC7K480T-L2FFG901E implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 36 Kb block RAMs, and integrated PCIe Gen2 x8 endpoint capability. It supports partial reconfiguration and AXI4-compliant interconnect for heterogeneous system integration.
Its transceiver subsystem includes 24 GTY transceivers with built-in PRBS generators/checkers, TX pre-emphasis, and RX equalization - enabling compliance with CPRI, SRIO Gen2, and 10GBASE-KR standards without external retimers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 477,750 - determines maximum combinational and sequential logic capacity for RTL implementation |
| DSP Slices | 2,800 - enables parallel multiply-accumulate operations for FIR filtering and FFT acceleration |
| Block RAM | 28.1 Mb - supports large on-chip buffering for video frame storage or packet queuing |
| GTY Transceivers | 24 × 13.1 Gb/s - provides native serial connectivity for optical modules and backplane interfaces |
| I/O Count | 480 - allows dense peripheral interfacing including DDR3/DDR4 memory controllers and custom parallel buses |
| Configuration Interface | JTAG, SPIx4, SelectMAP x16 - enables flexible programming via debug probes, flash memory, or host processors |
| Thermal Design Power | 22.5 W typical - defines heatsink and airflow requirements for sustained operation at full utilization |
Pinout & Package
XC7K480T-L2FFG901E is housed in a 901-pin Flip-Chip Fine-Pitch Ball Grid Array (FCBGA) package with 35×35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports dual-voltage I/O banks and thermal vias for efficient heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O bank | Configurable as PS peripherals (UART, SDIO, SPI) or PL I/O with programmable slew rate and drive strength |
| HR Bank 13–16 | High-range I/O bank | Supports 1.2V–3.3V signaling, LVDS, TMDS, and sub-1.0V HSTL for memory and display interfaces |
| GTYTXN/GTYTXP | Differential transceiver output | AC-coupled differential pair driving optical modules or backplane traces per IEEE 802.3ap |
| GTYRXN/GTYRXP | Differential transceiver input | Receiver pair with adaptive equalization for signal integrity recovery over lossy channels |
| CCLK, INIT_B, DONE | Configuration control | Manage master SPI configuration startup sequence and status reporting during bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping in operational systems without full FPGA reset or service interruption |
| AXI4 Interconnect Fabric | Provides standardized, pipelined, and burst-capable bus protocol between processor subsystem and programmable logic |
| PCIe Gen2 x8 Endpoint | Delivers 4 GB/s bidirectional throughput for host CPU offload and DMA-based data streaming |
| Integrated ADC (XADC) | Monitors on-die temperature and supply voltages with ±5°C accuracy for thermal management and power sequencing |
| UltraScale-Compatible Toolflow | Allows migration path to UltraScale+ devices using same Vivado IP and constraint methodology |
Applications
| Radar Signal Processing | 10G Ethernet Line Card |
|---|---|
Use Scenario: Real-time pulse-Doppler processing of phased-array radar returns with adaptive beamforming. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR detection; GTY transceivers interface with ADC/DAC FMC mezzanine cards. Use Value: 24 GTY lanes enable direct connection to 12-channel RF sampling ADCs at 2.5 GSPS, eliminating external serializer/deserializer chips. | Use Scenario: Aggregation and switching of 10GbE client ports into a 40GbE uplink in telecom access equipment. IC Role / Device Role / Timing Role: Implements MAC layer, flow control, and SerDes PHY alignment; acts as timing reference for synchronous Ethernet (SyncE) recovery. Use Value: Built-in PCIe Gen2 x8 allows direct host CPU attachment for control plane processing, reducing latency versus external controller solutions. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: High-throughput image reconstruction pipeline for CT and MRI scanners using iterative algorithms. IC Role / Device Role / Timing Role: Accelerates back-projection and denoising kernels; interfaces with DDR4 memory subsystem and PCIe Gen2 host interface. Use Value: 28.1 Mb block RAM supports double-buffered frame storage for real-time reconstruction without DRAM latency stalls. | Use Scenario: Modular oscilloscope platform requiring synchronized multi-channel acquisition and deep memory capture. IC Role / Device Role / Timing Role: Manages 16-channel 1 GS/s ADC sampling, timestamping, and real-time FFT analysis; routes data via PCIe to host PC. Use Value: 477,750 logic cells accommodate custom trigger engines and digital down-conversion filters within single device. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU060-2FFVA1156I | UltraScale architecture, higher DSP density (3,600 slices), lower power per logic cell, no GTY (uses GTY-equivalent GT transceivers at 12.5 Gb/s) | Better suited for compute-intensive workloads with tighter power budgets; lacks native CPRI v6.1 support | Select when migrating to newer toolchain and prioritizing energy efficiency over legacy transceiver compatibility |
| XC7VX690T-2FFG1927I | Virtex-7 family, identical 28 nm node, 690K logic cells, 3,600 DSP slices, 36.9 Mb BRAM, but only 20 GTX transceivers (max 6.6 Gb/s) | Higher logic capacity for complex SoC integration; insufficient serial bandwidth for 10GBASE-KR line-rate processing | Choose when maximum logic density is critical and serial I/O bandwidth requirements are ≤6.6 Gb/s |
Compared with XC7K480T-L2FFG901E, XCKU060 offers improved DSP efficiency and lower static power but requires Vivado 2015.4+, while XC7VX690T delivers more logic and memory but limits high-speed serial I/O to older GTX technology - making XC7K480T-L2FFG901E optimal for balanced transceiver bandwidth and logic scalability in 10G+ infrastructure.
Availability
XC7K480T-L2FFG901E is available at Aetrix Electronics and suitable for radar signal processing, 10G Ethernet line cards, and medical imaging backend systems requiring stable component supply across extended production lifecycles.
Supply support for XC7K480T-L2FFG901E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.
The Kintex-7 family targets cost-optimized high-performance applications where transceiver bandwidth, logic density, and power efficiency must be balanced - especially in wired communications, aerospace, and instrumentation.
FAQ
What is the maximum supported transceiver data rate for XC7K480T-L2FFG901E?
The XC7K480T-L2FFG901E supports GTY transceivers with a maximum data rate of 13.1 Gb/s per lane. This enables compliance with 10GBASE-KR, CPRI v6.1, and SRIO Gen2 protocols. The transceiver architecture includes TX pre-emphasis and RX adaptive equalization to maintain signal integrity over PCB traces up to 40 cm. XC7K480T-L2FFG901E achieves this performance without requiring external retimers or redrivers in standard FR4 layouts.
Does XC7K480T-L2FFG901E support partial reconfiguration?
Yes, XC7K480T-L2FFG901E fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic replacement of logic modules while the rest of the FPGA remains operational - critical for mission-critical systems like radar ECM updates or protocol stack upgrades in telecom gear. XC7K480T-L2FFG901E implements dedicated configuration logic and frame-based bitstream addressing to ensure deterministic reconfiguration timing and CRC-protected integrity checks.
What I/O standards are supported by XC7K480T-L2FFG901E?
XC7K480T-L2FFG901E supports 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, and 3.3V single-ended and differential I/O standards including LVCMOS, LVDS, BLVDS, RSDS, TMDS, and HSTL. Each of its 480 I/O pins is grouped into banks with independent VCCO and VREF supplies, enabling mixed-voltage interfaces on a single device. XC7K480T-L2FFG901E also supports source-synchronous interfaces such as DDR3/DDR4 memory controllers with calibrated delay elements.
Is XC7K480T-L2FFG901E compatible with Xilinx Vivado tools?
Yes, XC7K480T-L2FFG901E is fully supported by Xilinx Vivado Design Suite versions 2013.4 through 2018.4. Synthesis, implementation, and bitstream generation are validated for this specific speed grade (-2) and package (FFG901). XC7K480T-L2FFG901E requires the Kintex-7 device definition files and transceiver wizard templates included in those Vivado releases. Post-2018.4 toolchains require manual IP migration due to deprecated device support.
What thermal management guidance applies to XC7K480T-L2FFG901E?
XC7K480T-L2FFG901E has a thermal design power (TDP) of 22.5 W under typical operating conditions. AMD recommends a 4-layer PCB with internal ground/power planes, thermal vias under the package center, and a 25 mm² copper pad connected to an external heatsink. Ambient temperature must not exceed 85°C, and junction temperature must stay below 100°C. XC7K480T-L2FFG901E integrates an on-die XADC that monitors die temperature with ±5°C accuracy for closed-loop thermal throttling.
XC7K480T-L2FFG901E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 900-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 37325
- Number of Logic Elements/Cells:
- 477760
- Total RAM Bits:
- 35205120
- Number of I/O:
- 380
- Number of Gates:
- -
- Voltage - Supply:
- 0.87V ~ 0.93V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 901-FCBGA (31x31)
XC7K480T-L2FFG901E FAQ
1.How can I place an order for XC7K480T-L2FFG901E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K480T-L2FFG901E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K480T-L2FFG901E reliable?
The price and inventory of XC7K480T-L2FFG901E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K480T-L2FFG901E is usually 5 days.
3.What payment methods are accepted for XC7K480T-L2FFG901E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K480T-L2FFG901E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K480T-L2FFG901E?
XC7K480T-L2FFG901E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K480T-L2FFG901E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K480T-L2FFG901E?
For technical support, including XC7K480T-L2FFG901E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K480T-L2FFG901E requirements.
6.How does Aetrix verify that XC7K480T-L2FFG901E is sourced from the original manufacturer or authorized distributors?
All XC7K480T-L2FFG901E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K480T-L2FFG901E meets industry standards.
7.What is the process for return or replacement of XC7K480T-L2FFG901E?
All XC7K480T-L2FFG901E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K480T-L2FFG901E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K480T-L2FFG901E part is unused and in its original packaging.
Return procedure for XC7K480T-L2FFG901E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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