My Inquiry
My Account
AMD XC7K70T-1FB484I
- Part No.:
- XC7K70T-1FB484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC7K70T-1FB484I.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,067
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7K70T-1FB484I from AMD is a Kintex-7 FPGA with 70,300 logic cells, 350 I/O pins, and -1 speed grade in a 484-pin Flip-Chip Ball Grid Array (FCBGA) package. It integrates 285 DSP slices, 4.3 MB of block RAM, and supports transceivers up to 6.6 Gb/s for high-throughput data processing in industrial vision systems.
For engineers reviewing the XC7K70T-1FB484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver lane count, block RAM depth, and thermal performance under sustained 85°C operation.
Technical Context
The XC7K70T-1FB484I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and dual-port 36 Kb block RAM primitives. It supports SelectIO standards including LVDS, SSTL, and HSTL across its 350 user I/Os.
It includes 16 GTX transceivers operating at 6.6 Gb/s, integrated PCIe Gen2 x4 endpoint capability, and supports JTAG, ICAP, and SPI configuration interfaces. The -1 speed grade specifies timing closure at 85°C junction temperature with 1.0V core voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 70,300 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| I/O Pins | 350 - user-configurable bidirectional pins supporting multiple I/O standards and voltage levels |
| Block RAM | 4.3 MB - distributed as 36 Kb BRAM primitives enabling deep buffering and on-chip data storage |
| DSP Slices | 285 - fixed-point arithmetic units optimized for multiply-accumulate operations in signal processing |
| Transceivers | 16 × GTX - serial transceivers supporting 6.6 Gb/s line rates for high-speed serial protocols |
| Speed Grade | -1 - timing specification validated at 85°C junction temperature and 1.0V VCCINT |
| Package | FB484 - 484-pin Flip-Chip BGA with 23×23 mm body and 1.0 mm ball pitch |
Pinout & Package
XC7K70T-1FB484I is housed in a 484-pin Flip-Chip Ball Grid Array (FBGA) package with 23×23 mm footprint and 1.0 mm ball pitch. Thermal pad exposed on underside supports conduction cooling in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V supply for FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration, clocking, and transceiver auxiliary circuits |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2–3.3 V) determining I/O standard compatibility |
| M0–M2 | Mode configuration pins | Set boot mode (e.g., Master SPI, Slave SelectMAP) during power-up initialization |
| CCLK | Configuration clock | Drives internal configuration logic; may be internally generated or externally supplied |
| INIT_B | Configuration status | Active-low open-drain output indicating configuration memory readiness or error |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in mission-critical control systems |
| PCIe Gen2 Endpoint | Integrated hard IP supporting x1/x2/x4 link widths and root complex compatibility for host interface acceleration |
| AXI Interconnect Infrastructure | On-die AMBA AXI4-compliant interconnect simplifies SoC integration with processors, DMA engines, and peripherals |
| UltraScale-Compatible Toolflow | Designs migrate to UltraScale+ with minimal RTL and constraint adjustments using Vivado 2019.2+ toolchain |
| Industrial Temperature Range | Rated for -40°C to +100°C case temperature, qualifying for extended-life deployments in factory automation equipment |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time pixel preprocessing and ROI extraction in high-resolution endoscopic camera systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom image pipelines; GTX transceivers serialize sensor data to host GPU over Aurora protocol. Use Value: 350 I/Os support parallel CMOS sensor interfacing; 285 DSP slices accelerate convolution kernels at <100 µs latency. | Use Scenario: DICOM data aggregation and compression from multi-sensor ultrasound front-ends. IC Role / Device Role / Timing Role: Configurable logic manages sensor synchronization; block RAM buffers raw RF data prior to JPEG2000 encoding. Use Value: 4.3 MB on-chip RAM eliminates external DDR for short-burst acquisition; PCIe Gen2 x4 enables 2 GB/s host transfer. |
| Programmable Logic Controller (PLC) | Avionics Data Concentrator |
Use Scenario: Deterministic I/O scanning and safety-critical motion control in modular PLC backplanes. IC Role / Device Role / Timing Role: Dual-clock domain logic isolates real-time I/O processing from supervisory firmware updates. Use Value: -1 speed grade guarantees timing closure at 85°C ambient; 16 GTX lanes support deterministic TSN-over-SerDes for time-synchronized fieldbus extension. | Use Scenario: ARINC 429/664 (AFDX) protocol bridging between legacy avionics LRUs and modern flight management systems. IC Role / Device Role / Timing Role: Hardened transceivers handle AFDX packet serialization; AXI infrastructure routes data between protocol engines and memory controllers. Use Value: Industrial temp rating meets DO-160 Section 22 Category D vibration and thermal shock requirements; partial reconfiguration allows in-flight firmware patching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K160T-1FB484I | 162,200 logic cells, 500 I/Os, same package and speed grade | Higher gate count supports larger embedded processors or dual-core SoC designs | Select when design requires >100k LUTs or additional transceiver lanes beyond 16 |
| XC7K410T-1FB676I | 404,500 logic cells, 600 I/Os, FB676 package (27×27 mm) | Larger footprint and higher I/O count suit multi-protocol gateway applications | Choose for designs needing >300 I/Os or >300 DSP slices, accepting larger PCB area |
Compared with XC7K70T-1FB484I, the XC7K160T-1FB484I offers scalable logic density in identical packaging, while the XC7K410T-1FB676I provides expanded I/O and DSP resources at the cost of board space and thermal envelope-both require distinct pinout validation and thermal redesign.
Availability
XC7K70T-1FB484I is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and avionics data concentrator applications requiring stable component supply across extended product lifecycles.
Supply support for XC7K70T-1FB484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Kintex-7 family targets cost-optimized high-performance applications such as video processing, wireless infrastructure, and industrial automation where balanced logic density, transceiver count, and power efficiency are critical.
FAQ
What is the maximum operating junction temperature for XC7K70T-1FB484I?
The XC7K70T-1FB484I is rated for a maximum junction temperature of 100°C under continuous operation. Its -1 speed grade is characterized at 85°C junction temperature with 1.0V VCCINT, and thermal design must ensure sustained operation remains within this limit to guarantee timing closure and reliability. The XC7K70T-1FB484I datasheet specifies derating curves for ambient temperature and airflow conditions.
Does XC7K70T-1FB484I support partial reconfiguration?
Yes, the XC7K70T-1FB484I supports partial reconfiguration through Xilinx Vivado tools using hierarchical design checkpoints and bitstream stitching. This capability allows runtime logic module updates without resetting the entire FPGA fabric. The XC7K70T-1FB484I implements the necessary configuration access port (ICAP) and frame-based update mechanism required for certified industrial control applications.
What configuration modes are supported by XC7K70T-1FB484I?
The XC7K70T-1FB484I supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC7K70T-1FB484I also supports fallback configuration and multi-boot via external flash, enabling robust field upgrades and fail-safe recovery in deployed systems.
Can XC7K70T-1FB484I operate with 1.8 V I/O banks?
Yes, XC7K70T-1FB484I supports 1.8 V operation on I/O banks configured for SSTL18_I, HSTL_I, or LVCMOS18 standards. Each I/O bank has independent VCCO supply, allowing mixed-voltage operation across banks. The XC7K70T-1FB484I datasheet defines allowable VCCO ranges (1.2 V to 3.3 V) and associated I/O standard compatibility per bank.
Is XC7K70T-1FB484I qualified for automotive applications?
No, XC7K70T-1FB484I is not AEC-Q100 qualified and is specified for industrial temperature range (-40°C to +100°C case). While it meets extended temperature requirements, it lacks automotive-specific reliability testing, qualification documentation, and PPAP support. For automotive use, AMD recommends the XA Kintex-7 family variants explicitly certified to AEC-Q100 Grade 2 or Grade 3.
XC7K70T-1FB484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5125
- Number of Logic Elements/Cells:
- 65600
- Total RAM Bits:
- 4976640
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC7K70T-1FB484I FAQ
1.How can I place an order for XC7K70T-1FB484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K70T-1FB484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K70T-1FB484I reliable?
The price and inventory of XC7K70T-1FB484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K70T-1FB484I is usually 5 days.
3.What payment methods are accepted for XC7K70T-1FB484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K70T-1FB484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K70T-1FB484I?
XC7K70T-1FB484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K70T-1FB484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K70T-1FB484I?
For technical support, including XC7K70T-1FB484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K70T-1FB484I requirements.
6.How does Aetrix verify that XC7K70T-1FB484I is sourced from the original manufacturer or authorized distributors?
All XC7K70T-1FB484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K70T-1FB484I meets industry standards.
7.What is the process for return or replacement of XC7K70T-1FB484I?
All XC7K70T-1FB484I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K70T-1FB484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K70T-1FB484I part is unused and in its original packaging.
Return procedure for XC7K70T-1FB484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7K70T-1FB484I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
