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AMD XC7K70T-1FB676I
- Part No.:
- XC7K70T-1FB676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K70T-1FB676I.pdf
- Description:
- IC FPGA 300 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,365
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Product details
Overview
XC7K70T-1FB676I from AMD is a Kintex-7 FPGA featuring 74,250 logic cells, 340 I/O pins, and a -1 speed grade (1.0 ns CLB delay), housed in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package. It integrates 285 DSP slices, 4.3 MB of block RAM, and supports transceivers up to 6.6 Gb/s for high-throughput data processing in reconfigurable computing systems.
For engineers reviewing the XC7K70T-1FB676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver lane count, block RAM depth, DSP slice availability, and thermal performance under sustained 1.0V core voltage operation.
Technical Context
The XC7K70T-1FB676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry chains. It supports SelectIO standards including LVDS, SSTL, HSTL, and MIPI D-PHY at up to 1.33 Gb/s per pin.
Its transceiver subsystem includes 8 GTP transceivers (6.6 Gb/s max), each with TX/RX phase alignment, 8B/10B encoding, and built-in PRBS generators/checkers. Configuration occurs via JTAG, SPIx4, or BPI parallel interfaces with AES-256 bitstream encryption support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,250 - total available LUTs + flip-flops for combinational and sequential logic implementation |
| I/O Pins | 340 - user-configurable single-ended or differential I/Os with programmable drive strength and slew rate |
| Block RAM | 4,320 kbits - organized as 36 Kb dual-port RAM primitives usable as FIFOs or memory buffers |
| DSP Slices | 285 - 25×18-bit multiply-accumulate units with pre-adder and cascade capability for signal processing |
| GTP Transceivers | 8 × 6.6 Gb/s - serial I/O lanes supporting PCIe Gen2, SATA, CPRI, and custom protocols |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns CLB propagation delay under industrial temperature (-40°C to +100°C) |
| Package | FB676 - 676-ball FCBGA, 27×27 mm, 1.0 mm ball pitch, RoHS-compliant, thermal pad exposed on underside |
Pinout & Package
The XC7K70T-1FB676I uses a 676-ball Flip-Chip BGA (FBGA) package with thermal pad and defined power/ground ball map per UG475 v1.14. Pin functions are configured at runtime via configuration bitstream; no fixed analog/dedicated pins exist outside configuration and boundary-scan signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0V ±3% regulated input powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary supply | 1.8V ±3% for configuration, clocking, and transceiver reference circuitry |
| VCCO | I/O bank supply | Programmable 1.2–3.3V per bank enabling mixed-voltage interface support |
| M0–M2 | Mode pins | Three-pin strap defining configuration mode (JTAG, Master SPI, Slave SelectMAP, etc.) at power-up |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1 boundary-scan test and programming access independent of configuration state |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset-critical for adaptive radio and real-time protocol stacks |
| Integrated PCI Express® Endpoint | Gen2 x4 hard IP block with AXI streaming interface, reducing soft-core overhead and latency |
| UltraScale-Compatible Configuration | Uses same bitstream format and tools flow as later UltraScale devices, easing migration paths |
| Advanced Clock Management | Includes 24 MMCMs and 12 PLLs with sub-100 fs jitter for multi-domain clock synthesis and deskew |
| Security Features | AES-256 bitstream encryption, HMAC authentication, and tamper-detect circuitry for secure boot and IP protection |
Applications
| Wireless Baseband Processing | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time LTE/5G PHY layer acceleration with adaptive modulation and MIMO beamforming. IC Role / Device Role / Timing Role: Configurable baseband processor handling channel estimation, FFT/IFFT, and LDPC decoding pipelines. Use Value: 285 DSP slices and 8 GTP transceivers enable concurrent multi-carrier processing at ≤100 µs latency. | Use Scenario: High-speed inspection of PCB assemblies using multi-camera synchronized capture and defect classification. IC Role / Device Role / Timing Role: Frame synchronizer, image preprocessor, and AI inference accelerator interfacing with CMOS sensors and DDR3 memory. Use Value: 340 I/O pins support 12+ camera inputs with precise sub-nanosecond inter-channel skew control. |
| Avionics Data Concentrator | Medical Imaging Backend |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 bus aggregation in flight control systems. IC Role / Device Role / Timing Role: Deterministic packet router and protocol translator with time-triggered scheduling. Use Value: -1 speed grade ensures guaranteed timing closure across -40°C to +100°C operating range under EMI stress. | Use Scenario: Real-time reconstruction pipeline for CT and MRI raw data streams before GPU rendering. IC Role / Device Role / Timing Role: High-bandwidth data concentrator, FIR filter engine, and DMA controller feeding GPU memory over PCIe Gen2 x4. Use Value: 4.3 MB block RAM provides on-chip buffering for 16 simultaneous 12-bit ADC channels at 100 MSPS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable computing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K160T-1FB676I | 162,240 logic cells, 500 I/O, same package and speed grade but higher resource density | Better suited for larger algorithm partitions and multi-protocol convergence requiring >100k LUTs | Select when design requires ≥120k LUTs or >400 I/Os while retaining identical thermal and mechanical footprint |
| XCKU035-1FBVA676I | UltraScale architecture, 225k logic cells, 324 I/O, 20 Gb/s GTY transceivers, different pinout and voltage rails | Targeted at next-gen 10G+ Ethernet, radar, and AI edge inference with higher bandwidth demands | Choose for new designs needing >10 Gb/s serial I/O or migration path to UltraScale toolchain and IP libraries |
Compared with XC7K70T-1FB676I, XC7K160T-1FB676I offers scalable logic density within identical packaging and thermal envelope, whereas XCKU035-1FBVA676I delivers architectural advancement at the cost of board redesign and voltage rail changes.
Availability
XC7K70T-1FB676I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, avionics, and medical imaging systems requiring stable component supply and long-term lifecycle support.
Supply support for XC7K70T-1FB676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets through FPGA, adaptive SoC, and CPU/GPU technologies.
The Kintex-7 family targets cost-optimized high-performance applications demanding balanced logic, I/O, memory, and transceiver resources-designed for reconfigurable acceleration in communications, test & measurement, and aerospace systems.
FAQ
What is the maximum supported transceiver data rate for XC7K70T-1FB676I?
The XC7K70T-1FB676I integrates eight GTP transceivers, each supporting a maximum line rate of 6.6 Gb/s. This enables compliance with PCIe Gen2, SATA III, and CPRI standards. The actual achievable rate depends on board layout, reference clock stability, and signal integrity margins-verified per UG476 v1.12. XC7K70T-1FB676I does not support GTY or GTH transceivers found in later families.
Does XC7K70T-1FB676I support partial reconfiguration?
Yes, XC7K70T-1FB676I fully supports partial reconfiguration using Vivado Design Suite. This allows dynamic swapping of logic modules without resetting the entire device-essential for applications like protocol adaptation or runtime feature activation. Implementation requires proper floorplanning, checkpointing, and bitstream generation workflows documented in UG909 v2023.1. XC7K70T-1FB676I's configuration logic enables secure, authenticated partial bitstream loading.
What are the power supply requirements for XC7K70T-1FB676I?
XC7K70T-1FB676I requires three primary supplies: VCCINT = 1.0V ±3%, VCCAUX = 1.8V ±3%, and bank-specific VCCO ranging from 1.2V to 3.3V. Power sequencing must follow Tfail < Tinit < Tconfig per UG470 v1.15. Decoupling capacitors must be placed per ball group as specified in the package drawing. XC7K70T-1FB676I's power consumption varies with utilization-typical active power is 4.2W at 50% logic toggle rate and 200 MHz clocking.
Is XC7K70T-1FB676I qualified for automotive or aerospace applications?
XC7K70T-1FB676I is rated for industrial temperature range (–40°C to +100°C) and features enhanced reliability mechanisms including SEU mitigation, ECC on configuration memory, and burn-in screening. While not AEC-Q100 or DO-254 certified out-of-box, it is widely deployed in avionics data concentrators and railway signaling systems where customers perform system-level qualification. XC7K70T-1FB676I supports traceable lot tracking and extended lifecycle notifications per AMD's long-term support policy.
Can XC7K70T-1FB676I be configured via JTAG only?
No-XC7K70T-1FB676I supports multiple configuration modes: JTAG (for debugging and programming), Master SPI (using on-board flash), Slave SelectMAP (parallel interface), and BPI. JTAG is mandatory for initial programming and boundary-scan testing but cannot sustain runtime configuration updates. For field updates, Master SPI with QSPI flash is most common. XC7K70T-1FB676I's configuration logic also supports dual-boot and fallback images stored in external memory.
XC7K70T-1FB676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5125
- Number of Logic Elements/Cells:
- 65600
- Total RAM Bits:
- 4976640
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K70T-1FB676I FAQ
1.How can I place an order for XC7K70T-1FB676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K70T-1FB676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K70T-1FB676I reliable?
The price and inventory of XC7K70T-1FB676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K70T-1FB676I is usually 5 days.
3.What payment methods are accepted for XC7K70T-1FB676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K70T-1FB676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K70T-1FB676I?
XC7K70T-1FB676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K70T-1FB676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K70T-1FB676I?
For technical support, including XC7K70T-1FB676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K70T-1FB676I requirements.
6.How does Aetrix verify that XC7K70T-1FB676I is sourced from the original manufacturer or authorized distributors?
All XC7K70T-1FB676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K70T-1FB676I meets industry standards.
7.What is the process for return or replacement of XC7K70T-1FB676I?
All XC7K70T-1FB676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K70T-1FB676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K70T-1FB676I part is unused and in its original packaging.
Return procedure for XC7K70T-1FB676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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