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AMD XC7K70T-1FBG484C
- Part No.:
- XC7K70T-1FBG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC7K70T-1FBG484C.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,579
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Product details
Overview
XC7K70T-1FBG484C from AMD is a Kintex-7 FPGA with 71,600 logic cells, 340 I/O pins, and 250 DSP slices, operating at -1 speed grade (1.0V core, 100°C junction). It integrates PCIe Gen2 x8 endpoint capability and is used in high-throughput industrial imaging and real-time signal processing systems.
For engineers reviewing the XC7K70T-1FBG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), transceiver line rates up to 6.6 Gbps, and configuration via SPIx4 or BPI parallel interface.
Technical Context
The XC7K70T-1FBG484C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), block RAM (5,040 × 36 Kb), and 24 transceiver quads supporting GTX transceivers. It supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential signaling such as LVDS and TMDS.
Configuration is performed through Master SPI or Slave Parallel modes using external flash or processor control. The device includes hardened IP for PCIe Gen2 Endpoint, Ethernet MAC (1G/2.5G), and clock management with MMCM and PLL blocks supporting jitter filtering and frequency synthesis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 71,600 - determines maximum combinational and sequential logic capacity for custom digital functions |
| I/O Pins | 340 - supports high-density board interconnect with multi-standard voltage compliance |
| DSP Slices | 250 - enables fixed/floating-point arithmetic for filtering, FFT, and math-intensive algorithms |
| Block RAM | 5,040 × 36 Kb - provides on-chip memory for buffering, FIFOs, and lookup tables without external SRAM |
| Transceivers | 24 GTX - delivers 6.6 Gbps serial links for camera interfaces, JESD204B, or backplane connectivity |
| PCIe Interface | Gen2 x8 Endpoint - enables direct host CPU communication without bridge ICs in embedded vision systems |
| Speed Grade | -1 - specifies timing closure margin at 1.0V core supply and 100°C junction temperature |
Pinout & Package
XC7K70T-1FBG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 22×22 array, 1.0 mm ball pitch, and 19.2 mm × 19.2 mm body size. Thermal pad exposed on underside supports conduction cooling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot mode (SPI/BPI/JTAG) during power-up reset sequence |
| CCLK | Configuration Clock | Drives internal configuration shift register; sourced externally in Master SPI mode |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization completion |
| INIT_B | Configuration Control | Active-low input signaling configuration controller readiness and error detection |
| HR I/O Banks | High-Range I/O | Support 1.2V–3.3V single-ended and differential standards with programmable drive strength |
| HP I/O Banks | High-Performance I/O | Support 1.2V–1.8V standards with enhanced timing margins for DDR3/DDR4 interfaces |
Key Features
| Feature | Design Value |
|---|---|
| 28 nm HKMG Process | Enables lower dynamic power and higher gate density versus 40 nm FPGAs, critical for thermally constrained enclosures |
| Hardened PCIe Gen2 x8 Endpoint | Reduces RTL integration effort and verification time for host-connected acceleration applications |
| Multi-Voltage I/O Banks | Allows direct interfacing to legacy and modern peripherals without level-shifter components |
| Integrated Memory Controller | Supports DDR3/DDR3L/DDR2/LPDDR2 with PHY calibration, eliminating external memory controller ICs |
| MMCM + PLL Clock Management | Provides sub-100 fs jitter performance and flexible clock domain crossing for mixed-signal synchronization |
Applications
| Industrial Machine Vision | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time image preprocessing pipeline in automated optical inspection (AOI) systems with multi-camera inputs. IC Role / Device Role / Timing Role: FPGA fabric performs pixel-level filtering, edge detection, and ROI extraction before sending compressed data to host CPU. Use Value: 340 I/O pins enable simultaneous connection to four 12-bit CMOS image sensors and DDR3 memory; GTX transceivers route raw sensor streams over FMC+ mezzanine. | Use Scenario: High-speed ultrasound beamforming engine in portable diagnostic equipment. IC Role / Device Role / Timing Role: XC7K70T-1FBG484C executes time-aligned delay-and-sum operations across 128 channels with deterministic latency. Use Value: 250 DSP slices deliver >20 GOPS peak throughput for real-time RF data processing; PCIe Gen2 x8 provides low-latency transfer of processed frames to ARM-based SoC. |
| Radar Signal Processing | Test & Measurement Equipment |
Use Scenario: Digital down-conversion and pulse-Doppler processing in automotive radar ECU prototypes. IC Role / Device Role / Timing Role: Configurable logic implements matched filters, CFAR detection, and angle-of-arrival estimation in hardware. Use Value: Block RAM resources store large LUT-based FFT twiddle tables; GTX transceivers interface directly to ADC/DAC chips at 5 Gbps. | Use Scenario: Modular protocol analyzer supporting PCIe, SATA, and USB 3.0 physical layer decoding. IC Role / Device Role / Timing Role: XC7K70T-1FBG484C hosts multiple protocol-specific state machines and real-time pattern matchers. Use Value: Multi-bank I/O supports concurrent 1.8V PCIe and 3.3V legacy bus probing; hardened transceivers capture eye diagrams at native line rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-1FBVA676C | UltraScale architecture, 225K logic cells, 32 GTY transceivers (16.3 Gbps), no native PCIe Gen2 endpoint | Higher bandwidth requirements (e.g., 4K video analytics), requires soft PCIe IP or external switch | Choose when >10 Gbps serial I/O or >100K logic cells are required; migration requires full RTL and timing revalidation |
| XC7K160T-1FBG676C | Same Kintex-7 family, 162K logic cells, 400 I/O, larger 676-pin FBGA package | More complex designs needing additional CLBs or I/O count, e.g., multi-FPGA synchronization | Drop-in compatible at RTL level; requires PCB redesign due to different package and pinout |
Compared with XC7K70T-1FBG484C, XCKU035-1FBVA676C offers higher serial bandwidth but demands more design effort for PCIe integration, while XC7K160T-1FBG676C scales logic and I/O count within the same architecture-ideal for incremental feature expansion without toolchain change.
Availability
XC7K70T-1FBG484C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging acceleration, and radar signal processing requiring stable component supply across long-lifecycle deployments.
Supply support for XC7K70T-1FBG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, AI acceleration, and heterogeneous processing.
The Kintex-7 family targets cost-optimized high-performance applications including real-time video, software-defined radio, and industrial automation where balanced logic, I/O, and DSP resources are essential.
FAQ
What is the maximum supported I/O standard voltage for XC7K70T-1FBG484C?
XC7K70T-1FBG484C supports I/O voltages from 1.2 V to 3.3 V across HR and HP banks, including LVCMOS, SSTL, HSTL, and differential standards like LVDS and TMDS. Each bank is independently configurable, enabling mixed-voltage system interfacing without external level shifters. The XC7K70T-1FBG484C datasheet specifies absolute maximum ratings and DC characteristics per I/O standard under defined termination and drive strength settings.
Does XC7K70T-1FBG484C include a built-in PCIe Gen2 endpoint?
Yes, XC7K70T-1FBG484C integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.1. This eliminates the need for soft IP implementation and reduces latency in host-connected applications. The XC7K70T-1FBG484C uses dedicated routing and clocking resources to meet Gen2 timing requirements without consuming logic cells or DSP slices.
What configuration modes does XC7K70T-1FBG484C support?
XC7K70T-1FBG484C supports Master SPI, Slave SPI, Slave Parallel (BPI), and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most common for compact flash-based boot; Slave Parallel suits high-speed programming via microcontroller. The XC7K70T-1FBG484C also supports fallback configuration and multi-boot via external flash partitioning.
Can XC7K70T-1FBG484C interface directly with DDR3 memory?
Yes, XC7K70T-1FBG484C includes a hardened DDR3/DDR3L/DDR2/LPDDR2 memory controller with integrated PHY. It supports data rates up to 800 Mbps per pin (DDR3-1600) with automatic calibration for DQ/DQS timing. The XC7K70T-1FBG484C memory interface meets JEDEC specifications and is validated with commercial DDR3 SODIMMs and discrete components in reference designs.
What is the thermal design power (TDP) range for XC7K70T-1FBG484C?
XC7K70T-1FBG484C has a typical TDP between 4.5 W and 12.3 W depending on resource utilization, clock frequency, and I/O activity. Power estimates are generated using Xilinx Vivado Power Analyzer with accurate switching activity files. The XC7K70T-1FBG484C thermal pad and recommended PCB copper pour enable operation up to 100°C junction temperature under continuous load.
XC7K70T-1FBG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5125
- Number of Logic Elements/Cells:
- 65600
- Total RAM Bits:
- 4976640
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC7K70T-1FBG484C FAQ
1.How can I place an order for XC7K70T-1FBG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K70T-1FBG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K70T-1FBG484C reliable?
The price and inventory of XC7K70T-1FBG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K70T-1FBG484C is usually 5 days.
3.What payment methods are accepted for XC7K70T-1FBG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K70T-1FBG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K70T-1FBG484C?
XC7K70T-1FBG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K70T-1FBG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K70T-1FBG484C?
For technical support, including XC7K70T-1FBG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K70T-1FBG484C requirements.
6.How does Aetrix verify that XC7K70T-1FBG484C is sourced from the original manufacturer or authorized distributors?
All XC7K70T-1FBG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K70T-1FBG484C meets industry standards.
7.What is the process for return or replacement of XC7K70T-1FBG484C?
All XC7K70T-1FBG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K70T-1FBG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K70T-1FBG484C part is unused and in its original packaging.
Return procedure for XC7K70T-1FBG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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