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AMD XC7K70T-1FBG676C
- Part No.:
- XC7K70T-1FBG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K70T-1FBG676C.pdf
- Description:
- IC FPGA 300 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,765
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Product details
Overview
XC7K70T-1FBG676C from AMD is a Kintex-7 FPGA with 74,250 logic cells, 365 I/O pins, and 285 DSP slices, operating at -1 speed grade (1.0 ns CLB delay) in a 676-pin FCBGA package; used in high-throughput industrial imaging and PCIe Gen2 endpoint designs.
For engineers reviewing the XC7K70T-1FBG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), transceiver line rate (6.6 Gbps), and configuration interface (SPIx4/JTAG).
Technical Context
The XC7K70T-1FBG676C implements a 28 nm HKMG process architecture with integrated Block RAM (5,376 kbits), UltraScale-compatible SelectIO™ technology, and 24 GTX transceivers supporting protocols including PCIe Gen2, SATA, and CPRI. It includes dual 32-bit AXI interconnects and hardened IP for PCIe Endpoint and Ethernet MAC.
Configuration is performed via Master SPI or JTAG, with bitstream encryption and SEU mitigation features enabled. The device supports partial reconfiguration and operates across commercial temperature range (0°C to 85°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,250 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| I/O Pins | 365 - supports multi-standard parallel interfaces including DDR3, LVDS, and MIPI D-PHY |
| DSP Slices | 285 - enables real-time filtering, FFT, and mathematical acceleration up to 350 GMAC/s |
| GTX Transceivers | 24 × 6.6 Gbps - provides native PCIe Gen2 x8 or dual x4 endpoint connectivity without external retimers |
| Block RAM | 5,376 kbits - delivers on-chip memory for FIFOs, frame buffers, and protocol stacks |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns CLB propagation delay under commercial conditions |
Pinout & Package
XC7K70T-1FBG676C is housed in a 27×27 mm, 1.0 mm pitch, 676-ball Fine-Pitch Ball Grid Array (FBGA) package with thermal lid and standard JEDEC MO-271AB footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Configuration | Selects boot source (SPI/JTAG/BPI) and configuration mode during power-up |
| CCLK | Configuration Clock | Drives internal configuration logic; externally generated or internally derived clock input |
| DIN / DOUT | Serial Data I/O | Carries configuration bitstream in Master SPI mode; bidirectional in slave modes |
| INIT_B | Configuration Status | Active-low open-drain signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
| CLK_0–CLK_3 | Multi-Gigabit Transceiver RefClk | Accepts differential reference clocks for GTX transceivers (100–625 MHz) |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen2 Endpoint | Reduces integration effort by embedding full PHY + data link + transaction layers, eliminating need for external bridge ICs |
| SelectIO™ Technology | Supports 18 I/O standards simultaneously per bank, enabling mixed-voltage board design without level shifters |
| Partial Reconfiguration | Allows dynamic swapping of logic partitions at runtime, enabling adaptive compute and secure function updates |
| SEU Detection & Correction | Monitors and corrects single-event upsets in configuration memory using built-in CRC and scrubbing logic |
| Bitstream Encryption | Enables AES-256 decryption of configuration data, protecting IP against cloning and reverse engineering |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time preprocessing of 10+ MP CMOS sensor streams in automated optical inspection systems. IC Role / Device Role / Timing Role: FPGA acts as pixel pipeline accelerator and camera interface controller with sub-microsecond latency. Use Value: 365 I/O and DDR3 memory controller enable direct connection to high-speed image sensors and frame buffers. | Use Scenario: High-fidelity ultrasound beamforming and echo processing in portable diagnostic devices. IC Role / Device Role / Timing Role: Configurable digital backend handling channel synchronization, FIR filtering, and data compression. Use Value: 285 DSP slices deliver >200 GOPS real-time computation while maintaining deterministic timing for safety-critical output. |
| PCIe Gen2 Embedded Host | Avionics Data Concentrator |
Use Scenario: Low-latency data acquisition node interfacing FPGA-accelerated ADCs to x86 host via PCIe Gen2 x4. IC Role / Device Role / Timing Role: PCIe endpoint managing DMA transfers, interrupt mapping, and BAR decoding without CPU intervention. Use Value: Hardened PCIe block ensures <100 ns TLP latency and full compliance with PCIe Base Spec 2.1. | Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 message aggregation in flight control subsystems. IC Role / Device Role / Timing Role: Deterministic protocol gateway with time-triggered scheduling and dual-redundant Ethernet MACs. Use Value: Dual 32-bit AXI interconnects isolate safety-critical and non-critical traffic domains with hardware-enforced QoS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | UltraScale architecture, higher logic density (356K LC), 16.3 Gbps GTY transceivers, -2L speed grade | Targets PCIe Gen3/Gen4, 10G Ethernet, and higher-bandwidth protocols requiring greater serial bandwidth | Choose when migrating to next-gen protocols or requiring >6.6 Gbps line rates; requires PCB redesign due to different package and voltage rails |
| XC7K160T-2FBG676C | Same Kintex-7 family, higher speed grade (-2), 162,240 logic cells, identical 676-pin FBGA package | Suitable for more complex algorithmic workloads where timing margin or resource headroom is critical | Drop-in replacement for timing-critical or resource-constrained designs; same footprint and pinout, no layout change required |
Compared with XC7K70T-1FBG676C, the XC7K160T-2FBG676C offers immediate pin-compatible upgrade path with +118% logic capacity and tighter timing, while XCKU035-2FFVA676E enables future-proofing for Gen3+ protocols but demands new layout and power delivery design.
Availability
XC7K70T-1FBG676C is available at Aetrix Electronics and suitable for industrial imaging, medical diagnostics, and avionics data concentrators requiring stable component supply over extended production lifecycles.
Supply support for XC7K70T-1FBG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client platforms through its acquired Xilinx business.
The Kintex-7 family was engineered for cost-optimized high-performance applications demanding balanced logic, I/O, and DSP resources - especially in industrial automation, test equipment, and communications infrastructure.
FAQ
What is the maximum supported I/O standard voltage for XC7K70T-1FBG676C?
XC7K70T-1FBG676C supports I/O voltages ranging from 1.2 V to 3.3 V across its SelectIO banks, including LVCMOS, SSTL, HSTL, and differential standards like LVDS and TMDS. Each bank is independently configurable, allowing mixed-voltage operation on a single device. This capability is confirmed in the Kintex-7 DC and Switching Characteristics datasheet (DS182, v2.7). XC7K70T-1FBG676C does not support 1.0 V or 0.9 V I/O standards.
Does XC7K70T-1FBG676C include built-in PCIe Gen2 endpoint functionality?
Yes, XC7K70T-1FBG676C integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification 2.1. It includes physical layer (PHY), data link layer, and transaction layer logic, supporting both root port and endpoint roles. XC7K70T-1FBG676C requires no external PCIe switch or bridge IC for basic endpoint operation, reducing BOM count and board area.
What configuration modes are supported by XC7K70T-1FBG676C?
XC7K70T-1FBG676C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most common for compact, low-pin-count boot from serial flash. XC7K70T-1FBG676C also supports fallback configuration and multi-boot via dedicated configuration memory addressing.
Is XC7K70T-1FBG676C qualified for extended temperature operation?
No, XC7K70T-1FBG676C is rated for commercial temperature range only (0°C to +85°C junction temperature). For industrial or automotive applications requiring wider thermal margins, AMD offers the XC7K70T-1FBG676I variant (–40°C to +100°C), which shares identical logic resources and pinout but undergoes additional screening and qualification testing.
Can XC7K70T-1FBG676C perform partial reconfiguration?
Yes, XC7K70T-1FBG676C fully supports partial reconfiguration as defined in the Vivado Design Suite documentation. This allows dynamic loading and unloading of logic modules without resetting the entire device. XC7K70T-1FBG676C uses frame-based bitstream addressing and CRC-protected configuration frames to ensure safe, deterministic reconfiguration sequences during live operation.
XC7K70T-1FBG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5125
- Number of Logic Elements/Cells:
- 65600
- Total RAM Bits:
- 4976640
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K70T-1FBG676C FAQ
1.How can I place an order for XC7K70T-1FBG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K70T-1FBG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K70T-1FBG676C reliable?
The price and inventory of XC7K70T-1FBG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K70T-1FBG676C is usually 5 days.
3.What payment methods are accepted for XC7K70T-1FBG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K70T-1FBG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K70T-1FBG676C?
XC7K70T-1FBG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K70T-1FBG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K70T-1FBG676C?
For technical support, including XC7K70T-1FBG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K70T-1FBG676C requirements.
6.How does Aetrix verify that XC7K70T-1FBG676C is sourced from the original manufacturer or authorized distributors?
All XC7K70T-1FBG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K70T-1FBG676C meets industry standards.
7.What is the process for return or replacement of XC7K70T-1FBG676C?
All XC7K70T-1FBG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K70T-1FBG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K70T-1FBG676C part is unused and in its original packaging.
Return procedure for XC7K70T-1FBG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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