AMD XC7K70T-1FBG676I

Overview

XC7K70T-1FBG676I from AMD is a Kintex-7 FPGA with 70,300 logic cells, 350 I/O pins, and -1 speed grade operating at 1.0V core voltage. It integrates 285 DSP slices, 4.2 MB of block RAM, and supports PCIe Gen2 x8, DDR3-1866 memory interface, and Gigabit transceivers for high-performance embedded processing in industrial vision systems.

For engineers reviewing the XC7K70T-1FBG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver lane count, block RAM depth, DSP slice availability, and thermal performance under sustained 100°C junction conditions.

Technical Context

The XC7K70T-1FBG676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated carry chains, and hierarchical clock routing. It supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential signaling up to 1.25 Gbps.

Its transceiver subsystem includes 8 GTP transceivers rated for 1.25–3.75 Gb/s operation, compliant with PCIe Gen2, SATA, and CPRI protocols. The device uses a 676-pin FCBGA package with 0.8 mm pitch and 32×32 array configuration.

Key Specifications

Pinout & Package

The XC7K70T-1FBG676I is housed in a 676-pin Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm ball pitch, thermal lid, and exposed thermal pad. Pinout follows Xilinx/AMD Kintex-7 family standard layout with dedicated configuration, clock, and transceiver banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based acceleration applications.

Compared with XC7K70T-1FBG676I, the XC7K160T offers scalable logic density within identical thermal and board footprint constraints, while the XCKU035 enables architectural upgrades to higher-speed serial and memory standards at the cost of migration effort and increased power supply complexity.

Availability

XC7K70T-1FBG676I is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging acceleration, and avionics data concentrator applications requiring stable component supply over extended production lifecycles.

Supply support for XC7K70T-1FBG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, with leadership in FPGA, adaptive SoC, and AI acceleration technologies.

The Kintex-7 family was designed for cost-optimized high-performance applications including wired communications, video processing, and industrial automation where balanced logic, I/O, and transceiver resources are critical.

FAQ

What is the maximum supported DDR3 data rate for XC7K70T-1FBG676I?

The XC7K70T-1FBG676I supports DDR3 memory interfaces up to 1866 Mbps using its integrated hard memory controller. This capability is verified across all I/O banks compatible with SSTL15 standards and applies to 8-, 16-, and 32-bit wide configurations. The XC7K70T-1FBG676I achieves this rate with built-in write leveling, read leveling, and training sequences to ensure signal integrity at high speeds.

Does XC7K70T-1FBG676I include hardened PCIe Gen2 endpoint logic?

Yes, the XC7K70T-1FBG676I integrates a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification 2.1. This includes physical layer (PHY), data link layer, and transaction layer logic. The XC7K70T-1FBG676I supports both root complex and endpoint roles and delivers full 5 GT/s throughput with integrated DMA engines and MSI-X interrupt handling.

What is the operating junction temperature range for XC7K70T-1FBG676I?

The XC7K70T-1FBG676I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This specification is validated under worst-case voltage and frequency conditions defined by the -1 speed grade. Thermal management must maintain junction temperature within this range during sustained operation to ensure timing compliance and long-term reliability of the XC7K70T-1FBG676I.

How many GTP transceivers does XC7K70T-1FBG676I provide?

The XC7K70T-1FBG676I includes eight GTP transceivers, each supporting data rates from 1.25 Gb/s to 3.75 Gb/s. These transceivers are grouped into two quads and support protocols including CPRI, SATA, and PCIe Gen2. All eight transceivers are accessible and functional in the FBG676 package variant of the XC7K70T-1FBG676I.

Is partial reconfiguration supported on XC7K70T-1FBG676I?

Yes, partial reconfiguration is fully supported on the XC7K70T-1FBG676I using Vivado Design Suite tools and associated configuration infrastructure. This allows dynamic replacement of logic modules without resetting the entire device. The XC7K70T-1FBG676I implements dedicated configuration ports and frame-based update mechanisms to enable secure, low-latency reconfiguration of designated regions during active operation.