AMD XC7K70T-1FBV484C
- Part No.:
- XC7K70T-1FBV484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC7K70T-1FBV484C.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,713
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Product details
Overview
XC7K70T-1FBV484C from AMD is a Kintex-7 FPGA with 70,350 logic cells, 340 I/O pins, and 285 DSP slices, fabricated on 28 nm process technology and operating at -1 speed grade (1.0 ns CLB delay). It is used in high-throughput data acquisition systems requiring deterministic latency and multi-gigabit serial connectivity.
For engineers reviewing the XC7K70T-1FBV484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver line rates up to 6.6 Gb/s, thermal performance in FBGA484 packaging, and configuration interface options (SPI, SelectMAP, JTAG).
Technical Context
The XC7K70T-1FBV484C integrates 220 Block RAMs (each 36 Kb), 340 user I/Os with programmable slew rate and drive strength, and 24 GTX transceivers supporting PCIe Gen2, SATA, and CPRI protocols. Its configuration logic supports dual-boot via SPI flash and fallback recovery.
It implements a hierarchical clocking architecture with 36 CMTs (Clock Management Tiles), each containing a PLL and MMCM, enabling precise jitter filtering and phase alignment across multiple clock domains for synchronous system design.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 70,350 - determines maximum combinational/sequential logic capacity for RTL implementation |
| I/O Pins | 340 - supports high-pin-count parallel interfaces and multi-channel ADC/DAC connectivity |
| DSP Slices | 285 - enables real-time FIR filtering, FFT computation, and digital modulation at >100 MHz sample rates |
| GTX Transceivers | 24 × 6.6 Gb/s - provides native SerDes for JESD204B, CPRI, and 10G Ethernet PHY layers |
| Block RAM | 220 × 36 Kb - delivers 9.9 Mb total on-chip memory for buffering, FIFOs, and lookup tables |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns CLB propagation delay under industrial temperature range |
| Package | FBGA484 - 23×23 mm body, 1.0 mm ball pitch, RoHS-compliant, suitable for reflow assembly |
Pinout & Package
XC7K70T-1FBV484C is housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package with 340 user-configurable I/Os distributed across 12 banks. Power delivery includes dedicated VCCINT (1.0 V), VCCAUX (1.8 V), and VCCO (1.2–3.3 V) supplies per bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M18 | CCLK | Configuration clock input for master SPI and SelectMAP modes; driven by external source or internal oscillator |
| P17 | DONE | Open-drain status output indicating successful configuration completion and I/O enable assertion |
| R16 | INIT_B | Active-low open-drain output signaling configuration controller readiness and bitstream validity |
| T15 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reload sequence |
| Y16 | M0–M2 | Mode pins selecting configuration source (SPI, BPI, JTAG, or slave parallel) at power-up |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full device reset, reducing system downtime in radar and comms applications |
| AXI Interconnect Infrastructure | Integrated 64-bit AXI4-Lite and AXI4-Stream interfaces simplify SoC integration with ARM-based processors and DMA engines |
| Transceiver Calibration | Automatic analog calibration of GTX receivers compensates for PVT variation, ensuring <1.5 UI jitter at 6.6 Gb/s |
| Power-Down Modes | Selective shutdown of unused I/O banks and transceivers reduces static power by up to 40% in idle states |
| Secure Configuration | Bitstream encryption using AES-256 and HMAC authentication prevents unauthorized cloning and IP theft |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; GTX transceivers interface with ADCs and RF front-ends. Use Value: 285 DSP slices and deterministic 6.6 Gb/s SerDes enable sub-microsecond latency for adaptive waveform generation. | Use Scenario: High-speed data aggregation from multi-slice CT detector modules. IC Role / Device Role / Timing Role: XC7K70T-1FBV484C acts as a data concentrator and preprocessing engine between detectors and host CPU. Use Value: 340 I/Os support parallel LVDS links from 16+ detector ASICs; Block RAM buffers handle burst-mode acquisition. |
| 5G Wireless Baseband | Industrial Machine Vision |
Use Scenario: Layer 1 PHY processing in small-cell base stations with CPRI/eCPRI fronthaul. IC Role / Device Role / Timing Role: XC7K70T-1FBV484C implements channel coding, OFDM modulation, and MIMO precoding in real time. Use Value: 24 GTX transceivers provide native CPRI lanes at 10.1376 Gb/s; -1 speed grade ensures timing margin for 200 MHz baseband clocks. | Use Scenario: Multi-camera synchronization and pixel-level defect analysis in automated optical inspection (AOI) systems. IC Role / Device Role / Timing Role: XC7K70T-1FBV484C serves as a timing hub and image pipeline accelerator. Use Value: 36 CMTs generate phase-aligned clocks for 8+ camera sensors; AXI infrastructure enables low-latency frame transfer to GPU subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-1FBVA676E | UltraScale architecture, 354,000 logic cells, higher transceiver count (40 × 12.5 Gb/s), but larger FBGA676 package | Better suited for 5G massive MIMO and AI inference acceleration where logic density and bandwidth exceed XC7K70T-1FBV484C capacity | Select when migrating to higher throughput or requiring PCI Express Gen3 x8 root complex support |
| XC7K160T-1FBG484C | Same Kintex-7 family, 162,240 logic cells, identical FBGA484 footprint, but higher power consumption and cost | Applicable where additional LUTs and DSPs are needed without changing PCB layout or thermal design | Choose for pin-compatible upgrade path with minimal board redesign effort |
Compared with XC7K70T-1FBV484C, the XCKU035 offers significantly greater logic and SerDes bandwidth at the cost of larger size and higher power, while the XC7K160T provides direct pin-compatible scalability within the same package and thermal envelope.
Availability
XC7K70T-1FBV484C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, 5G wireless baseband, and industrial machine vision applications requiring stable component supply and long-term production support.
Supply support for XC7K70T-1FBV484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and edge devices.
The Kintex-7 FPGA product line targets cost-optimized, high-throughput applications in communications, aerospace, and medical imaging where balanced logic density, I/O flexibility, and transceiver performance are critical.
FAQ
What is the maximum supported transceiver line rate for XC7K70T-1FBV484C?
The XC7K70T-1FBV484C supports GTX transceivers with a maximum line rate of 6.6 Gb/s. This is verified in the Kintex-7 Data Sheet (DS182 v2.7) and applies to all 24 GTX channels. The rate is achievable under industrial temperature conditions with proper reference clock jitter and PCB interconnect design meeting Xilinx IBIS-AMI models.
Does XC7K70T-1FBV484C support partial reconfiguration?
Yes, XC7K70T-1FBV484C supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic replacement of logic modules without resetting the entire device. The feature is documented in UG909 and requires specific HDL partitioning and configuration controller firmware compatible with the XC7K70T-1FBV484C's configuration interface.
What configuration modes are supported by XC7K70T-1FBV484C?
XC7K70T-1FBV484C supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The device also supports dual-boot via SPI flash with fallback to secondary bitstream if CRC check fails during primary load.
Is XC7K70T-1FBV484C qualified for industrial temperature operation?
Yes, the "C" suffix in XC7K70T-1FBV484C denotes commercial temperature grade (0°C to +85°C ambient), not industrial. For industrial operation (-40°C to +100°C), the equivalent part is XC7K70T-1FBV484I. The "C" grade is suitable for controlled-environment applications such as lab equipment and indoor base stations.
What is the total on-chip Block RAM capacity of XC7K70T-1FBV484C?
XC7K70T-1FBV484C contains 220 Block RAM primitives, each configurable as 36 Kb (two 18 Kb simple dual-port RAMs). This yields 7,920 Kb (7.73 Mb) of total addressable Block RAM. Actual usable capacity depends on memory width configuration and parity usage, as defined in UG474.
XC7K70T-1FBV484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5125
- Number of Logic Elements/Cells:
- 65600
- Total RAM Bits:
- 4976640
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC7K70T-1FBV484C FAQ
1.How can I place an order for XC7K70T-1FBV484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K70T-1FBV484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K70T-1FBV484C reliable?
The price and inventory of XC7K70T-1FBV484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K70T-1FBV484C is usually 5 days.
3.What payment methods are accepted for XC7K70T-1FBV484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K70T-1FBV484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K70T-1FBV484C?
XC7K70T-1FBV484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K70T-1FBV484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K70T-1FBV484C?
For technical support, including XC7K70T-1FBV484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K70T-1FBV484C requirements.
6.How does Aetrix verify that XC7K70T-1FBV484C is sourced from the original manufacturer or authorized distributors?
All XC7K70T-1FBV484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K70T-1FBV484C meets industry standards.
7.What is the process for return or replacement of XC7K70T-1FBV484C?
All XC7K70T-1FBV484C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K70T-1FBV484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K70T-1FBV484C part is unused and in its original packaging.
Return procedure for XC7K70T-1FBV484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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