AMD XC7K70T-2FB484I

Overview

XC7K70T-2FB484I from AMD is a Kintex-7 FPGA with 70,350 logic cells, 350 I/O pins, and -2 speed grade in a 484-pin Flip-Chip Ball Grid Array (FCBGA) package. It integrates 288 DSP slices, 4.2 MB of block RAM, and supports transceivers up to 6.6 Gb/s for high-performance serial connectivity in embedded vision and industrial control systems.

For engineers reviewing the XC7K70T-2FB484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver lane count, block RAM depth, DSP slice availability, and thermal performance in constrained industrial enclosures.

Technical Context

The XC7K70T-2FB484I implements a synchronous, SRAM-based programmable logic architecture with configurable logic blocks (CLBs), distributed RAM, and shift registers. It includes 24 GTX transceiver quads supporting protocols including PCIe Gen2, SATA, and CPRI at up to 6.6 Gb/s per lane.

Configuration is performed via JTAG, SelectMAP, or SPI x4 interface using external configuration memory. The device supports partial reconfiguration and offers dual-boot capability with fallback support for field-upgradable designs.

Key Specifications

Pinout & Package

XC7K70T-2FB484I is housed in a 484-pin Flip-Chip Ball Grid Array (FCBGA) package with 29×29 mm body size, 1.0 mm ball pitch, and thermal lid for industrial-grade thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC7K70T-2FB484I, the XC7K160T-2FBG484I offers 2.3× more logic and RAM while maintaining mechanical and electrical compatibility, whereas the XCKU035-2FFVA676I introduces architectural improvements for next-generation serial protocols but requires new PCB design and toolchain migration.

Availability

XC7K70T-2FB484I is available at Aetrix Electronics and suitable for industrial automation, medical imaging, and test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC7K70T-2FB484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client applications through its FPGA, adaptive SoC, and GPU technologies.

The Kintex-7 family targets high-performance, cost-optimized applications demanding balanced logic, I/O, and transceiver resources-designed specifically for industrial, aerospace, and medical systems requiring long-term availability and deterministic timing.

FAQ

What is the maximum operating junction temperature for XC7K70T-2FB484I?

The XC7K70T-2FB484I is rated for industrial temperature operation with a maximum junction temperature of +100°C. This specification is validated under worst-case voltage and thermal conditions defined in AMD's DS182 datasheet. Thermal design must ensure adequate heatsinking and airflow to maintain junction temperature within this limit during sustained logic and transceiver activity. The XC7K70T-2FB484I includes on-die temperature sensors accessible via JTAG for runtime monitoring.

Does XC7K70T-2FB484I support partial reconfiguration?

Yes, the XC7K70T-2FB484I fully supports partial reconfiguration as documented in UG908 and UG474. This capability allows dynamic replacement of logic modules without resetting the entire device, enabling runtime protocol switching or feature updates. Implementation requires Vivado Design Suite 2018.3 or later and adherence to specific floorplanning and routing constraints. The XC7K70T-2FB484I's configuration logic and frame-based bitstream architecture make it compatible with standard PR workflows.

What configuration modes are supported by XC7K70T-2FB484I?

The XC7K70T-2FB484I supports multiple configuration modes including Master SPI x4, Slave SelectMAP, JTAG, and Master BPI. Mode selection is controlled by M0–M2 pins at power-up. Each mode defines how the bitstream is loaded-e.g., SPI x4 uses quad I/O for fast flash-based boot, while JTAG enables debugging and programming via boundary scan. The XC7K70T-2FB484I also supports dual-boot with fallback using two separate bitstreams stored in external memory.

Can XC7K70T-2FB484I interface directly with DDR3 memory?

Yes, the XC7K70T-2FB484I includes dedicated hard memory controller IP supporting DDR3 SDRAM at data rates up to 800 Mbps per pin. This controller handles timing calibration, read/write leveling, and refresh management. Implementation requires proper PCB layout matching for address/control and data groups, and use of Xilinx Memory Interface Generator (MIG) v3.5 or later. The XC7K70T-2FB484I's I/O banks support 1.5V VCCO for DDR3-compatible signaling.

Is XC7K70T-2FB484I pin-compatible with other Kintex-7 devices in the FBG484 package?

No-XC7K70T-2FB484I uses the FB484 package variant, not FBG484. While both are 484-pin FCBGA packages, FB484 and FBG484 differ in ball pitch (1.0 mm vs. 0.8 mm), ball map, and thermal lid specifications. XC7K70T-2FB484I is only mechanically and electrically compatible with other FB484-packaged Kintex-7 parts such as XC7K70T-1FB484C and XC7K70T-3FB484E. Pin compatibility must be verified using the official AMD Kintex-7 pinout files for FB484.