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AMD XC7K70T-2FBG484I
- Part No.:
- XC7K70T-2FBG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC7K70T-2FBG484I.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,262
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Product details
Overview
XC7K70T-2FBG484I from AMD is a Kintex-7 FPGA featuring 70,350 logic cells, 340 I/O pins, and -2 speed grade operation at junction temperatures up to 100°C. It integrates 285 DSP slices, 4.2 MB of block RAM, and supports transceivers up to 6.6 Gb/s - deployed in high-throughput industrial imaging and real-time signal processing systems.
For engineers reviewing the XC7K70T-2FBG484I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V), transceiver compliance (PCIe Gen2, SATA, SRIO), and thermal performance under sustained 2.5W dynamic power.
Technical Context
The XC7K70T-2FBG484I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and dual-port block RAM with byte-write enable. It supports partial reconfiguration and AXI4-Stream interfaces for pipeline-optimized data flow.
Its transceiver banks include GTX transceivers compliant with PCIe Gen2 (5.0 GT/s), SATA 3.0 (6 Gb/s), and SRIO 2.1 (5.0 GT/s), each with programmable equalization and clock-data recovery. Configuration occurs via Master SPI or JTAG, with bitstream encryption supported through AES-256.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 70,350 - determines maximum combinational and sequential logic capacity for RTL implementation |
| I/O Pins | 340 - supports high-pin-count interface bridging (e.g., parallel CMOS image sensors, DDR3 memory) |
| Block RAM | 4,224 kbits - enables on-chip buffering for video frame stores or protocol packet queues |
| DSP Slices | 285 - delivers 228 GMAC/s peak multiply-accumulate throughput for filtering and FFT kernels |
| Transceiver Speed | 6.6 Gb/s - meets line-rate requirements for 10G Ethernet PHY and CPRI fronthaul links |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock with 100°C junction temperature margin |
| Configuration Interface | Master SPI / JTAG - enables field-upgradable bitstreams without external processor dependency |
Pinout & Package
XC7K70T-2FBG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free solder balls. Thermal pad on underside supports conduction cooling in high-power-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M2 | Mode Select | Determines configuration mode (SPI/JTAG/BPI) at power-on reset |
| CCLK | Configuration Clock | Drives serial bitstream loading during master SPI configuration |
| DONE | Configuration Status | Open-drain output signals successful bitstream load completion |
| INIT_B | Configuration Initialization | Active-low input indicating FPGA readiness to accept configuration data |
| GTXREFCLK0/1 | Transceiver Reference Clock | Accepts differential 100 MHz–625 MHz inputs for GTX PLL lock and jitter cleanup |
| VRP/VRN | Reference Voltage | Provides termination reference for differential I/O standards (LVDS, TMDS) |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic swapping without full device reset - critical for multi-mode radar waveform adaptation |
| AES-256 Bitstream Encryption | Prevents IP theft by securing configuration memory against readback and cloning attacks |
| AXI4-Stream Interface Integration | Reduces handshake overhead in DMA-based data pipelines - improves throughput in video preprocessing engines |
| UltraScale-Compatible Toolflow | Allows migration path to UltraScale+ devices using same Vivado design environment and constraints |
| Thermal Monitoring Diode | On-die sensor feeds analog voltage to external ADC for real-time junction temperature tracking |
Applications
| Industrial Machine Vision | Medical Ultrasound Beamforming |
|---|---|
Use Scenario: Real-time pixel-level correction and ROI extraction from 12-bit CMOS image sensors running at 120 fps. IC Role / Device Role / Timing Role: FPGA fabric processes raw sensor data; GTX transceivers stream processed frames to host GPU over PCIe Gen2 x4. Use Value: 340 I/O pins accommodate parallel sensor bus + DDR3 controller + PCIe interface simultaneously without multiplexing. | Use Scenario: Digital beam synthesis and dynamic focusing across 256-channel ultrasound probe arrays. IC Role / Device Role / Timing Role: XC7K70T-2FBG484I executes time-aligned delay calculations per channel using 285 DSP slices and on-chip RAM buffers. Use Value: 4.2 MB block RAM stores 16-sample delay profiles per channel, enabling sub-microsecond latency updates. |
| Avionics Data Concentrators | 5G Wireless Fronthaul Gateways |
Use Scenario: Aggregation and protocol translation between ARINC 429, MIL-STD-1553, and AFDX endpoints in flight control systems. IC Role / Device Role / Timing Role: Configurable I/O banks interface with multiple legacy avionics buses; deterministic timing ensures <1 µs jitter on time-critical control loops. Use Value: -2 speed grade guarantees timing closure across all I/O standards under extended temperature range (-40°C to +100°C). | Use Scenario: CPRI-to-eCPRI conversion and packetized IQ data transport between radio units and baseband units. IC Role / Device Role / Timing Role: GTX transceivers handle 6.144 Gb/s CPRI lanes; logic fabric performs header insertion, CRC, and timestamp alignment. Use Value: 6.6 Gb/s transceiver capability exceeds CPRI Option 7 line rate, supporting future bandwidth upgrades. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7K160T-2FBG676I | Higher logic density (162,250 CLBs), larger FBGA-676 package, 400 I/O pins, increased power consumption (~4.1W typical) | Required when >70K logic cells or >340 I/Os needed for multi-sensor fusion or expanded PCIe root complex | Select only if design requires additional resources beyond XC7K70T-2FBG484I capacity |
| XCKU035-2FFVA676I | UltraScale architecture, 220K logic cells, 324 I/O, 16.3 Gb/s transceivers, higher static power but better DSP efficiency | Suitable for next-generation designs targeting 25G Ethernet, coherent optics, or AI inference acceleration | Choose for migration path requiring higher bandwidth or advanced features not available in 7-series |
Compared with XC7K70T-2FBG484I, XC7K160T-2FBG676I offers scalable resource headroom within the same 7-series toolchain, while XCKU035-2FFVA676I provides architectural advancement for bandwidth-constrained or compute-intensive upgrades - both require PCB redesign and timing revalidation.
Availability
XC7K70T-2FBG484I is available at Aetrix Electronics and suitable for industrial imaging, medical diagnostics, and avionics systems requiring stable component supply across extended product lifecycles.
Supply support for XC7K70T-2FBG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace applications, with deep expertise in FPGA architecture and system-on-module integration.
The Kintex-7 family targets cost-optimized high-performance applications including real-time video processing, software-defined radio, and deterministic industrial control - balancing logic density, transceiver bandwidth, and power efficiency.
FAQ
What is the maximum operating junction temperature for XC7K70T-2FBG484I?
The XC7K70T-2FBG484I is rated for a maximum junction temperature of 100°C under continuous operation. This specification is validated per AMD's thermal characterization reports and applies to all speed grades within the Kintex-7 T-grade family. The device includes an on-die thermal diode that outputs a voltage proportional to die temperature, enabling closed-loop thermal monitoring in deployed systems using XC7K70T-2FBG484I.
Does XC7K70T-2FBG484I support PCIe Gen3?
No, XC7K70T-2FBG484I supports PCIe Gen2 (5.0 GT/s) via its GTX transceivers, not PCIe Gen3 (8.0 GT/s). Its transceiver architecture is limited to 6.6 Gb/s line rates, which aligns with PCIe Gen2 x4 and SATA 3.0. For PCIe Gen3 compatibility, AMD recommends migrating to Kintex UltraScale devices such as XC7K70T-2FBG484I's successor families, where the XC7K70T-2FBG484I remains optimal for Gen2-constrained applications.
Can XC7K70T-2FBG484I be configured using JTAG only, without external flash?
Yes, XC7K70T-2FBG484I supports JTAG-based configuration for debugging and prototyping without external flash memory. In this mode, configuration bitstream is loaded directly from a host PC or debugger via the JTAG chain. However, for production deployment, external SPI flash is required to store the bitstream for autonomous power-on initialization - JTAG-only operation does not persist across power cycles unless actively driven by an external controller managing XC7K70T-2FBG484I.
What I/O standards are supported by XC7K70T-2FBG484I?
XC7K70T-2FBG484I supports LVCMOS, LVTTL, SSTL, HSTL, Differential SSTL, Differential HSTL, LVDS, Mini-LVDS, RSDS, BLVDS, and TMDS across its 340 user I/O pins. Each bank operates independently with selectable VCCO voltages (1.2V to 3.3V), allowing mixed-voltage interfacing - for example, connecting DDR3 memory (1.5V SSTL) alongside a 3.3V UART peripheral on the same XC7K70T-2FBG484I device.
Is bitstream encryption enabled by default on XC7K70T-2FBG484I?
No, bitstream encryption is not enabled by default on XC7K70T-2FBG484I. It must be explicitly activated during bitstream generation in Vivado using AES-256 key programming and eFUSE provisioning. Once enabled and fused, the XC7K70T-2FBG484I will reject unencrypted or incorrectly encrypted bitstreams - providing hardware-enforced IP protection without runtime software overhead.
XC7K70T-2FBG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5125
- Number of Logic Elements/Cells:
- 65600
- Total RAM Bits:
- 4976640
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC7K70T-2FBG484I FAQ
1.How can I place an order for XC7K70T-2FBG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K70T-2FBG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K70T-2FBG484I reliable?
The price and inventory of XC7K70T-2FBG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K70T-2FBG484I is usually 5 days.
3.What payment methods are accepted for XC7K70T-2FBG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K70T-2FBG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K70T-2FBG484I?
XC7K70T-2FBG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K70T-2FBG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K70T-2FBG484I?
For technical support, including XC7K70T-2FBG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K70T-2FBG484I requirements.
6.How does Aetrix verify that XC7K70T-2FBG484I is sourced from the original manufacturer or authorized distributors?
All XC7K70T-2FBG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K70T-2FBG484I meets industry standards.
7.What is the process for return or replacement of XC7K70T-2FBG484I?
All XC7K70T-2FBG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K70T-2FBG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K70T-2FBG484I part is unused and in its original packaging.
Return procedure for XC7K70T-2FBG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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