My Inquiry
My Account
AMD XC7K70T-2FBG676C
- Part No.:
- XC7K70T-2FBG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K70T-2FBG676C.pdf
- Description:
- IC FPGA 300 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,919
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7K70T-2FBG676C from AMD is a Kintex-7 FPGA with 70,350 logic cells, 340 I/O pins, and -2 speed grade, packaged in a 676-pin FCBGA. It integrates 285 DSP slices, 4.2 MB of block RAM, and supports transceivers up to 6.6 Gb/s, used in high-throughput industrial imaging and real-time signal processing systems.
For engineers reviewing the XC7K70T-2FBG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver lane count, block RAM depth, and thermal envelope for convection-cooled embedded vision platforms.
Technical Context
The XC7K70T-2FBG676C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices, and 12–24 transceiver quads supporting PCIe Gen2, SATA, and SRIO protocols. It includes integrated clock management tiles (CMT) with MMCM and PLL for jitter reduction and multi-phase clock synthesis.
Configuration is performed via Master SPI or JTAG, with support for dual-boot and encrypted bitstream loading. The device operates across commercial temperature range (0°C to 85°C) and requires separate VCCINT (1.0V), VCCAUX (1.8V), and VCCO (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V) supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 70,350 - determines maximum combinational/sequential logic capacity for HDL implementation |
| I/O Pins | 340 - supports high-density interface routing including DDR3, LVDS, and MIPI CSI-2 |
| DSP Slices | 285 - enables parallel multiply-accumulate operations for FIR filters and FFT engines |
| Block RAM | 4.2 MB - provides on-chip memory for frame buffering and coefficient storage |
| Transceiver Speed | 6.6 Gb/s - enables serial protocols including PCIe Gen2 x4 and CPRI over 4 lanes |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock with typical static timing margins |
| Package | FBG676 - 27×27 mm fine-pitch flip-chip BGA with 1.0 mm ball pitch and thermal lid |
Pinout & Package
XC7K70T-2FBG676C uses a 676-ball flip-chip BGA (FBG676) with 27×27 array, 1.0 mm pitch, and integrated thermal lid. Ball map follows Xilinx/AMD Kintex-7 package drawing DS182 (v2.7), with dedicated configuration, JTAG, and power delivery banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M19 | CCLK | Configuration clock input for Master SPI mode; must be driven externally during bitstream load |
| P20 | DIN | Serial configuration data input for Master SPI; connects to flash memory DO line |
| T19 | PROGRAM_B | Active-low asynchronous reset for configuration state machine; initiates reconfiguration |
| R18 | INIT_B | Open-drain status output indicating configuration progress and CRC pass/fail |
| V17 | DONE | Open-drain output signaling completion of configuration and readiness for user logic |
| G17 | TCK | JTAG test clock input; required for boundary scan and debug access to internal TAP controller |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic module swapping without full FPGA reset, reducing system downtime in radar beamforming applications |
| PCIe Gen2 Endpoint Logic | Hard IP block delivering 5 GT/s per lane with integrated PHY, eliminating external SerDes and simplifying board layout |
| AXI Interconnect Fabric | Configurable 64-/128-bit AXI4 interconnect supporting up to 8 masters and 16 slaves for SoC-style subsystem integration |
| UltraScale-Compatible Toolflow | Uses Vivado 2022.2+ for synthesis, place-and-route, and bitstream generation-same toolchain as later families |
| Power-Optimized I/O Banks | Supports mixed-voltage I/O (1.2V–3.3V) with independent bank VCCO control, enabling direct interfacing to legacy peripherals |
Applications
| Industrial Machine Vision | Medical Ultrasound Beamforming |
|---|---|
Use Scenario: Real-time image preprocessing pipeline with sub-millisecond latency requirements. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level filtering, histogram equalization, and ROI extraction before GPU transfer. Use Value: 340 I/O pins enable parallel CMOS sensor interface + DDR3 video buffer + PCIe host link, all concurrently active. | Use Scenario: Digital beamformer controlling 128-channel ultrasound transducer arrays with phase-aligned sampling. IC Role / Device Role / Timing Role: XC7K70T-2FBG676C synchronizes ADC sampling clocks, applies time-delay compensation, and aggregates channel data. Use Value: 285 DSP slices deliver >20 GOPS fixed-point throughput for real-time delay-and-sum computation. |
| Avionics Data Concentrator | Test & Measurement Signal Generator |
Use Scenario: ARINC 429/664 and MIL-STD-1553 bus aggregation into deterministic Ethernet backbone. IC Role / Device Role / Timing Role: XC7K70T-2FBG676C implements protocol translation, timestamping, and traffic shaping logic. Use Value: Integrated transceivers support 6.6 Gb/s serial links for deterministic 10G Ethernet uplink with <1 µs jitter. | Use Scenario: Arbitrary waveform generation with 16-bit resolution and 500 MS/s update rate. IC Role / Device Role / Timing Role: XC7K70T-2FBG676C drives high-speed DACs via source-synchronous LVDS interfaces and manages pattern memory. Use Value: 4.2 MB block RAM stores >2M samples for complex modulated waveforms with zero-gap replay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | Ultrascale architecture, higher logic density (356K LUTs), 16.3 Gb/s transceivers, no native PCIe Gen2 hard IP | Better suited for 100G Ethernet or AI inference acceleration where bandwidth exceeds Kintex-7 capability | Select when >10 Gb/s serial I/O or >200K logic cells are required; requires Vivado 2019.2+ and revised PCB layout |
| XC7K160T-2FBG676C | Same Kintex-7 family, 160K logic cells, identical FBG676 package and pinout, higher power consumption (12.4 W typical) | Direct drop-in replacement for designs needing more logic resources but retaining same thermal and board footprint | Choose when upgrading logic capacity without changing PCB or cooling solution; verify thermal margin with increased junction temperature |
Compared with XC7K70T-2FBG676C, XCKU035-2FFVA676E offers higher bandwidth at the cost of toolchain migration and layout changes, while XC7K160T-2FBG676C delivers scalable logic density within identical mechanical and thermal constraints.
Availability
XC7K70T-2FBG676C is available at Aetrix Electronics and suitable for industrial imaging, avionics data concentrators, and medical ultrasound systems requiring stable component supply and long-term production support.
Supply support for XC7K70T-2FBG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on adaptive computing, AI, and high-performance processing solutions for data centers, embedded, and edge applications.
The Kintex-7 FPGA family targets cost-optimized high-performance applications such as real-time video processing, software-defined radio, and industrial automation, balancing logic capacity, I/O bandwidth, and power efficiency.
FAQ
What is the maximum supported transceiver data rate for XC7K70T-2FBG676C?
The XC7K70T-2FBG676C supports transceiver line rates up to 6.6 Gb/s per lane. This enables compliance with PCIe Gen2 (5.0 GT/s), SATA III (6.0 Gb/s), and CPRI (up to 6.144 Gb/s) standards. All 16 transceiver lanes are rated for this speed under commercial temperature conditions with proper reference clock jitter specifications met.
Does XC7K70T-2FBG676C include hard IP for PCIe Gen2?
Yes, XC7K70T-2FBG676C integrates a hard PCIe Gen2 endpoint block with up to x4 lane configuration. It includes physical layer (PHY), data link layer, and transaction layer logic, supporting both root port and endpoint roles. The block is fully compliant with PCI Express Base Specification v2.1 and requires no external SerDes components.
What configuration modes does XC7K70T-2FBG676C support?
XC7K70T-2FBG676C supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Master SPI is most common for single-flash boot; JTAG is used for debugging and programming during development. Configuration is initiated by asserting PROGRAM_B and monitored via INIT_B and DONE signals, all accessible on dedicated package balls.
Is XC7K70T-2FBG676C pin-compatible with other Kintex-7 devices in FBG676 package?
XC7K70T-2FBG676C shares the same FBG676 package footprint and ball map with XC7K160T-2FBG676C and XC7K325T-2FBG676C. Power, configuration, and dedicated transceiver balls are identical. However, I/O bank voltage assignments and unused ball states differ-designers must validate I/O standards and termination per target device's datasheet.
What is the block RAM capacity of XC7K70T-2FBG676C in usable bits?
XC7K70T-2FBG676C provides 4,300,800 bits of total block RAM, organized as 336 × 12 Kb BRAM primitives. When configured as true dual-port RAM, each 36 Kb block delivers 32K × 1, 16K × 2, or 8K × 4 addressing. Total usable memory is 4.2 MB assuming standard 8-bit byte addressing with no parity overhead.
XC7K70T-2FBG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5125
- Number of Logic Elements/Cells:
- 65600
- Total RAM Bits:
- 4976640
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K70T-2FBG676C FAQ
1.How can I place an order for XC7K70T-2FBG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K70T-2FBG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K70T-2FBG676C reliable?
The price and inventory of XC7K70T-2FBG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K70T-2FBG676C is usually 5 days.
3.What payment methods are accepted for XC7K70T-2FBG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K70T-2FBG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K70T-2FBG676C?
XC7K70T-2FBG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K70T-2FBG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K70T-2FBG676C?
For technical support, including XC7K70T-2FBG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K70T-2FBG676C requirements.
6.How does Aetrix verify that XC7K70T-2FBG676C is sourced from the original manufacturer or authorized distributors?
All XC7K70T-2FBG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K70T-2FBG676C meets industry standards.
7.What is the process for return or replacement of XC7K70T-2FBG676C?
All XC7K70T-2FBG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7K70T-2FBG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K70T-2FBG676C part is unused and in its original packaging.
Return procedure for XC7K70T-2FBG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7K70T-2FBG676C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
