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AMD XC7K70T-2FBG676I
- Part No.:
- XC7K70T-2FBG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K70T-2FBG676I.pdf
- Description:
- IC FPGA 300 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,204
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Product details
Overview
XC7K70T-2FBG676I from AMD is a Kintex-7 FPGA with 70,350 logic cells, 340 I/O pins, and -2 speed grade operating at junction temperatures up to 100°C in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It integrates 285 DSP slices, 4.2 MB of block RAM, and supports transceivers up to 6.6 Gb/s for high-speed serial interface applications in radar signal processing.
For engineers reviewing the XC7K70T-2FBG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver line rate, logic cell density, thermal performance, and industrial temperature qualification.
Technical Context
The XC7K70T-2FBG676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated clock management tiles (CMTs) featuring PLLs and MMCMs. It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 1.36 Gb/s.
Transceiver capability includes eight GTY transceivers (each supporting 6.6 Gb/s), AXI-4 compliant interfaces, and PCIe Gen2 x8 endpoint/root complex functionality. Configuration occurs via quad-SPI, BPI, or JTAG, with support for dual-boot and secure bitstream encryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 70,350 - determines maximum combinational/sequential logic capacity for RTL implementation |
| I/O Pins | 340 - supports high-pin-count parallel buses and multi-standard interface routing |
| DSP Slices | 285 - enables real-time FIR filtering, FFT, and matrix operations without external processors |
| Block RAM | 4.2 MB - provides on-chip memory for buffering, FIFOs, and lookup tables in streaming systems |
| Max Transceiver Rate | 6.6 Gb/s - enables 10G Ethernet, CPRI, and JESD204B interface compliance |
| Speed Grade | -2 - guarantees timing closure at higher clock frequencies than -1 grade under industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
Pinout & Package
XC7K70T-2FBG676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch, 27 × 27 array, and thermal-enhanced construction for reliable heat dissipation in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, SelectIO, and transceiver reference circuits |
| VCCO | I/O bank power | Programmable voltage per bank (1.2V–3.3V) enabling mixed-voltage interface support |
| MGTAVCC | Transceiver analog supply | 1.0V supply for GTY transceiver analog circuitry; sensitive to ripple and noise |
| CONFIG_IO | Configuration I/O | Dedicated pins for mode selection, INIT_B, PROGRAM_B, and CCLK during startup |
| HR_IO | High-range I/O bank | Supports 3.3V-tolerant standards including LVCMOS33 and SSTL18 |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 Endpoint | Reduces system-level integration effort by embedding hard IP for x8 root/endpoint operation |
| AXI4 Interconnect Support | Enables seamless integration with ARM-based processors and third-party IP via standardized bus protocol |
| Dual-Boot Configuration | Allows field-upgradable firmware with fallback to known-good bitstream upon corruption detection |
| Secure Bitstream Encryption | Prevents reverse engineering and unauthorized cloning using AES-256 and HMAC authentication |
| UltraScale-Compatible Toolflow | Supports Vivado Design Suite 2019.2+ for synthesis, place-and-route, and timing analysis |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical DSP kernels; GTY transceivers interface with ADC/DAC FMC modules at 6.6 Gb/s. Use Value: 70K logic cells and 285 DSP slices enable full pipeline implementation of CFAR and STAP algorithms within single device. | Use Scenario: High-throughput image reconstruction in MRI and CT scanner backends. IC Role / Device Role / Timing Role: Acts as data concentrator and preprocessing engine between multi-channel ADCs and GPU-accelerated compute nodes. Use Value: 340 I/O pins and AXI4 interconnect allow concurrent ingestion of 16+ ADC streams while maintaining deterministic latency. |
| Industrial Ethernet Gateway | Test & Measurement Instrumentation |
Use Scenario: Protocol translation and real-time packet switching in PROFINET IRT and EtherCAT master devices. IC Role / Device Role / Timing Role: Implements hardware-accelerated TSN time-synchronization engines and cyclic redundancy check (CRC) offload. Use Value: -2 speed grade and industrial temp rating ensure sub-microsecond jitter stability across ambient temperature swings. | Use Scenario: High-resolution waveform generation and acquisition in modular PXIe digitizers. IC Role / Device Role / Timing Role: Controls high-speed DACs/ADCs via source-synchronous LVDS interfaces and manages DMA transfers over PCIe Gen2 x8. Use Value: Integrated PCIe endpoint eliminates external switch logic, reducing board area and signal integrity risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676I | UltraScale architecture; 225K logic cells; higher transceiver count (16 GTY); 15W typical power | Better suited for multi-lane JESD204C or 25G Ethernet where XC7K70T-2FBG676I reaches resource limits | Select when migrating to higher bandwidth or requiring hardened 100G MAC/PCS blocks |
| XC7K160T-2FBG676I | Same Kintex-7 family; 162K logic cells; identical package and pinout; higher resource density | Drop-in replacement only if design fits within XC7K70T-2FBG676I footprint but requires additional LUTs or BRAM | Choose for design scalability without PCB rework-same thermal profile and I/O compatibility |
Compared with XC7K70T-2FBG676I, XCKU035-2FFVA676I offers greater bandwidth and newer architecture at higher power and cost, while XC7K160T-2FBG676I delivers direct pin-compatible headroom within the same Kintex-7 platform and thermal envelope.
Availability
XC7K70T-2FBG676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, and industrial Ethernet gateway designs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC7K70T-2FBG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace/defense applications through its Adaptive SoC and FPGA portfolio.
The Kintex-7 family, including XC7K70T-2FBG676I, was engineered for high-performance, cost-sensitive applications demanding balanced logic, DSP, memory, and I/O resources in industrial and communications infrastructure.
FAQ
What is the maximum supported transceiver data rate for XC7K70T-2FBG676I?
The XC7K70T-2FBG676I supports a maximum transceiver data rate of 6.6 Gb/s per GTY channel. This enables compliance with JESD204B subclass 1, CPRI Option 3, and 10GBASE-KR protocols. The transceiver specification is validated across the full industrial temperature range and requires proper reference clock jitter filtering and PCB impedance control.
Does XC7K70T-2FBG676I support PCIe Gen2 x8 endpoint functionality?
Yes, XC7K70T-2FBG676I includes a hardened PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification 2.1. It supports both root port and endpoint configurations, auto-negotiation, and link training. The block operates without consuming programmable logic resources and integrates with AXI4 streaming interfaces for DMA data movement.
What configuration modes are supported by XC7K70T-2FBG676I?
XC7K70T-2FBG676I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Quad-SPI flash is the most common method, enabling fast boot times and dual-image storage. BPI and SelectMAP modes are available for high-speed parallel programming in manufacturing test environments.
Is XC7K70T-2FBG676I qualified for industrial temperature operation?
Yes, the XC7K70T-2FBG676I is rated for operation from -40°C to +100°C junction temperature and carries the 'I' suffix denoting industrial temperature qualification. Thermal design must maintain junction temperature within this range using appropriate heatsinking and airflow, especially under sustained transceiver activity.
How many block RAM bits does XC7K70T-2FBG676I provide?
XC7K70T-2FBG676I provides 4.2 MB (35,328 kbits) of total block RAM distributed across 640 BRAM primitives, each configurable as 36 Kb dual-port RAM or 18 Kb single-port RAM. This supports large FIFOs, coefficient tables, and frame buffers in video and signal processing pipelines without external memory access.
XC7K70T-2FBG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5125
- Number of Logic Elements/Cells:
- 65600
- Total RAM Bits:
- 4976640
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K70T-2FBG676I FAQ
1.How can I place an order for XC7K70T-2FBG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K70T-2FBG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K70T-2FBG676I reliable?
The price and inventory of XC7K70T-2FBG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K70T-2FBG676I is usually 5 days.
3.What payment methods are accepted for XC7K70T-2FBG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K70T-2FBG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K70T-2FBG676I?
XC7K70T-2FBG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K70T-2FBG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K70T-2FBG676I?
For technical support, including XC7K70T-2FBG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K70T-2FBG676I requirements.
6.How does Aetrix verify that XC7K70T-2FBG676I is sourced from the original manufacturer or authorized distributors?
All XC7K70T-2FBG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K70T-2FBG676I meets industry standards.
7.What is the process for return or replacement of XC7K70T-2FBG676I?
All XC7K70T-2FBG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7K70T-2FBG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K70T-2FBG676I part is unused and in its original packaging.
Return procedure for XC7K70T-2FBG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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