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AMD XC7K70T-3FBG676E
- Part No.:
- XC7K70T-3FBG676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K70T-3FBG676E.pdf
- Description:
- IC FPGA 300 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,046
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Product details
Overview
XC7K70T-3FBG676E from AMD is a Kintex-7 FPGA featuring 74,250 logic cells, 340 I/O pins, and -3 speed grade operation at 1.0V core voltage. It integrates 360 DSP slices, 4.2 MB of block RAM, and supports PCIe Gen2 x8, DDR3-1866 memory interfaces. Used in high-throughput industrial imaging and real-time signal processing systems.
For engineers reviewing the XC7K70T-3FBG676E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver capability, timing closure margin at -3 speed grade, and thermal performance in FBG676 package.
Technical Context
The XC7K70T-3FBG676E implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated 6.6 Gbps GT transceivers. It supports multi-gigabit serial protocols including PCIe Gen2 and SATA.
Its memory subsystem includes distributed RAM, block RAM (BRAM) with true dual-port capability, and UltraScale-compatible clocking resources with MMCM and PLL for jitter reduction. The -3 speed grade guarantees timing closure up to 640 MHz on critical paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,250 - total available LUTs+FFs for custom digital logic implementation |
| I/O Pins | 340 - user-configurable single-ended or differential I/O with bank-specific voltage support |
| Block RAM | 4.2 MB - on-chip memory for FIFOs, buffers, or lookup tables without external DRAM |
| DSP Slices | 360 - hardwired multiply-accumulate units enabling >1.5 TMAC/s throughput |
| Transceivers | 8 × 6.6 Gbps - supports PCIe Gen2 x8, SATA II, and Serial RapidIO physical layer |
| Speed Grade | -3 - highest performance bin ensuring timing closure at maximum operating frequencies |
| Core Voltage | 1.0 V - defines power delivery requirements and dynamic power consumption profile |
Pinout & Package
XC7K70T-3FBG676E is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 29×29 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad on underside enables efficient heat dissipation in high-clock-rate applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be regulated to 1.0 V ±3% with low-noise, high-current capability |
| VCCAUX | Auxiliary power supply | Supplies configuration logic, I/O banks, and transceivers at 1.8 V |
| M0–M2 | Configuration mode pins | Determine boot source (JTAG, SPI, BPI) during power-on reset |
| INIT_B | Configuration status | Active-low open-drain output indicating successful bitstream loading |
| CLK_IN | Primary clock input | Accepts single-ended or differential clocks up to 800 MHz for MMCM/PLL reference |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x8 Endpoint | Integrated hard IP eliminates need for external controller and reduces latency by >30% vs soft IP |
| DDR3-1866 Memory Controller | Hard macro supporting 16-bit/32-bit interfaces with built-in calibration and error correction |
| UltraFast Design System | Enables timing closure in <24 hours for designs with ≤50k LUTs using Vivado tools |
| Partial Reconfiguration Support | Allows dynamic swapping of logic partitions without system reset or interrupting active functions |
| AXI4 Interconnect Fabric | Provides scalable, pipelined, and protocol-compliant connectivity between IP cores and memory subsystems |
Applications
| Industrial Machine Vision | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time image preprocessing on high-resolution X-ray or MRI data streams. IC Role / Device Role / Timing Role: FPGA acts as pipeline accelerator handling Bayer demosaicing, noise reduction, and histogram equalization before host CPU ingestion. Use Value: Achieves 120 fps throughput at 4K resolution using on-die DSP slices and BRAM-based line buffers-no external frame memory required. | Use Scenario: Low-latency ultrasound beamforming with adaptive filtering and Doppler shift analysis. IC Role / Device Role / Timing Role: Configurable logic implements parallel FIR filters and phase-aligned channel summation across 128 transducer elements. Use Value: Enables sub-5 µs processing latency per frame using deterministic routing and -3 speed grade timing margins. |
| Avionics Data Concentrator | Test & Measurement Equipment |
Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553, and discrete I/O in flight control systems. IC Role / Device Role / Timing Role: FPGA serves as deterministic I/O hub with time-triggered scheduling and hardware-level fault isolation. Use Value: Meets DO-254 Level A certification requirements via traceable RTL, dual-lockstep monitoring, and ECC-protected configuration memory. | Use Scenario: High-speed waveform generation and analysis in automated test equipment (ATE) platforms. IC Role / Device Role / Timing Role: Generates synchronized multi-channel analog stimulus while capturing response data at 1 GS/s using DDR3 interface. Use Value: Delivers 12-bit effective resolution at 500 MS/s using integrated ADC interface logic and on-chip calibration ROM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | UltraScale architecture, 215K logic cells, higher transceiver count (16×12.5 Gbps), 1.2 V core | Better suited for 10G Ethernet, PCIe Gen3, and higher-bandwidth memory interfaces | Select when migrating to higher bandwidth or requiring hardened 10G MAC/PCS logic |
| XC7K160T-2FBG676I | Same Kintex-7 family, lower density (162K LC), -2 speed grade, industrial temperature range | Lower cost and power for non-real-time embedded control with relaxed timing constraints | Choose for cost-sensitive industrial controllers where -3 timing margin is unnecessary |
Compared with XC7K70T-3FBG676E, the XCKU035 offers greater bandwidth and newer architecture but requires PCB redesign and toolchain migration, while the XC7K160T-2FBG676I provides functional overlap in Kintex-7 ecosystem at reduced performance and cost.
Availability
XC7K70T-3FBG676E is available at Aetrix Electronics and suitable for industrial imaging, avionics data concentration, and medical signal processing applications requiring stable component supply over extended production lifecycles.
Supply support for XC7K70T-3FBG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and client markets with emphasis on performance-per-watt efficiency.
The Kintex-7 FPGA product line targets mid-range high-performance applications demanding balanced logic density, I/O flexibility, and transceiver capability for industrial, aerospace, and medical systems.
FAQ
What is the maximum supported DDR3 data rate for XC7K70T-3FBG676E?
The XC7K70T-3FBG676E supports DDR3-1866 (933 MHz clock) with a 16-bit or 32-bit interface width. This capability is implemented via a hardened memory controller block that handles address/command timing, read/write leveling, and on-die termination control. The -3 speed grade ensures reliable operation at this rate across industrial temperature ranges when using compliant DIMMs or discrete components.
Does XC7K70T-3FBG676E include built-in PCIe Gen2 endpoint functionality?
Yes, XC7K70T-3FBG676E integrates a hard PCIe Gen2 x8 endpoint block compliant with PCI Express Base Specification v2.1. This includes PHY, data link, and transaction layers, supporting both root complex and endpoint roles. The implementation eliminates external bridge chips and reduces latency by bypassing software stack overhead, making it suitable for real-time packet processing in XC7K70T-3FBG676E-based systems.
What configuration modes does XC7K70T-3FBG676E support?
XC7K70T-3FBG676E supports master SPI, slave SPI, JTAG, and BPI parallel configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstreams can be loaded from external flash (SPI or BPI), host processor (slave selectMAP), or JTAG debugger. All modes support fallback and multi-boot options for field-upgradable designs using XC7K70T-3FBG676E.
Is partial reconfiguration supported on XC7K70T-3FBG676E?
Yes, XC7K70T-3FBG676E fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic replacement of logic modules-such as filter coefficients or protocol engines-without resetting the entire device or halting active I/O operations. Implementation requires proper floorplanning, checkpointing, and use of the ICAP interface, all validated for XC7K70T-3FBG676E in production deployments.
What is the operating temperature range for XC7K70T-3FBG676E?
XC7K70T-3FBG676E is specified for commercial temperature range (0°C to +85°C ambient) per its "E" suffix designation. This rating applies to junction temperature under defined airflow and PCB thermal design conditions. For extended temperature operation, the industrial-grade variant XC7K70T-3FBG676I (-40°C to +100°C) is available, but XC7K70T-3FBG676E itself is not qualified beyond 0°C to +85°C.
XC7K70T-3FBG676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5125
- Number of Logic Elements/Cells:
- 65600
- Total RAM Bits:
- 4976640
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K70T-3FBG676E FAQ
1.How can I place an order for XC7K70T-3FBG676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K70T-3FBG676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K70T-3FBG676E reliable?
The price and inventory of XC7K70T-3FBG676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K70T-3FBG676E is usually 5 days.
3.What payment methods are accepted for XC7K70T-3FBG676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K70T-3FBG676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K70T-3FBG676E?
XC7K70T-3FBG676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K70T-3FBG676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K70T-3FBG676E?
For technical support, including XC7K70T-3FBG676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K70T-3FBG676E requirements.
6.How does Aetrix verify that XC7K70T-3FBG676E is sourced from the original manufacturer or authorized distributors?
All XC7K70T-3FBG676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K70T-3FBG676E meets industry standards.
7.What is the process for return or replacement of XC7K70T-3FBG676E?
All XC7K70T-3FBG676E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K70T-3FBG676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K70T-3FBG676E part is unused and in its original packaging.
Return procedure for XC7K70T-3FBG676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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