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AMD XC7K70T-L2FBG484E
- Part No.:
- XC7K70T-L2FBG484E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA, FCBGA
- Datasheet:
-
XC7K70T-L2FBG484E.pdf
- Description:
- IC FPGA 285 I/O 484FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,248
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Product details
Overview
XC7K70T-L2FBG484E from AMD is a Kintex-7 FPGA featuring 70,350 logic cells, 340 I/O pins, and -2L speed grade in a 484-pin Flip-Chip Ball Grid Array (FCBGA) package. It integrates 285 DSP slices, 4.3 MB of block RAM, and supports transceivers up to 6.6 Gb/s for high-performance data processing in wired communications infrastructure.
For engineers reviewing the XC7K70T-L2FBG484E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver lane count, block RAM depth, and thermal performance in compact PCB layouts.
Technical Context
The XC7K70T-L2FBG484E implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), dedicated DSP48E1 slices for arithmetic-intensive tasks, and integrated SelectIO technology supporting LVDS, SSTL, HSTL, and differential signaling standards up to 1.33 Gb/s per pin. It includes dual 32-bit AXI interconnects and hardened PCIe Gen2 x4 endpoint logic.
Its -2L speed grade guarantees timing closure at 640 MHz for register-to-register paths and supports operation at junction temperatures up to 100°C. The device uses 1.0V core voltage and 1.8V/1.5V/1.35V I/O bank supplies with programmable drive strength and on-die termination calibration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 70,350 - determines maximum combinational and sequential logic capacity for RTL implementation |
| I/O Pins | 340 - supports multi-protocol interface routing with bank-wise voltage and standard assignment |
| Block RAM | 4.3 MB - enables large on-chip data buffering for video frame storage or packet buffering |
| DSP Slices | 285 - provides fixed-point multiply-accumulate capability for real-time filtering and FFT acceleration |
| Transceiver Speed | 6.6 Gb/s - enables SerDes-based protocols including CPRI, JESD204B, and Gigabit Ethernet |
| Speed Grade | -2L - specifies guaranteed timing performance at 100°C junction temperature with 1.0V core supply |
| Package | FCBGA-484 - 23×23 mm body with 1.0 mm ball pitch, requiring controlled-depth reflow and underfill for reliability |
Pinout & Package
XC7K70T-L2FBG484E is housed in a 484-ball Flip-Chip BGA (FCBGA) package with 340 user-configurable I/Os distributed across 12 I/O banks. Power and ground balls are arranged in dedicated rows/columns to minimize noise coupling and support simultaneous switching noise (SSN) mitigation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for CLBs, interconnect, and configuration logic; requires low-ESR ceramic decoupling |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration, clocking, and transceiver reference circuitry |
| VCCO | I/O bank power | Programmable 1.2–1.8V per bank; sets output swing and input threshold for each I/O standard |
| M0–M2 | Configuration mode pins | Set boot source (SPI, BPI, or JTAG) and configuration width (x1/x2/x4/x8/x16) |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness or error condition |
| CCLK | Configuration clock | Input or output clock used during master SPI/BPI configuration; frequency ≤ 50 MHz |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 x4 Hard IP | Reduces integration effort for host interface designs by eliminating soft-core PCIe stack synthesis and timing closure |
| AXI Interconnect | Enables scalable, low-latency communication between multiple masters and slaves without custom bus arbitration logic |
| UltraScale-compatible Configuration | Supports partial reconfiguration workflows using same tools and bitstream formats as later-generation devices |
| Multi-Voltage I/O Banks | Allows mixed-standard interfaces (e.g., DDR3 + LVDS + MIPI D-PHY) on single device without level-shifting components |
| On-Chip ADC (XADC) | Provides dual 12-bit, 1 MSPS analog monitoring channels for temperature, voltage, and external sensor inputs |
Applications
| Wireless Baseband Processing | Industrial Machine Vision |
|---|---|
Use Scenario: Real-time baseband signal conditioning and MIMO processing in LTE-A and 5G NR remote radio units. IC Role / Device Role / Timing Role: FPGA fabric executes channel estimation, precoding, and OFDM modulation/demodulation pipelines with deterministic latency. Use Value: 285 DSP slices and 6.6 Gb/s transceivers enable full-bandwidth CPRI over optical links with sub-microsecond loopback timing. | Use Scenario: High-speed image acquisition and defect classification in automated optical inspection (AOI) systems. IC Role / Device Role / Timing Role: Configurable I/O and logic fabric synchronize multi-camera sensors and run real-time CNN inference kernels on embedded BRAM. Use Value: 340 I/O pins support parallel CMOS/SLVS-EC sensor interfaces while 4.3 MB block RAM buffers full HD frames for pixel-level analysis. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: Digital beamforming and echo processing in portable ultrasound platforms with low-power constraints. IC Role / Device Role / Timing Role: XC7K70T-L2FBG484E implements time-aligned FIR filters and dynamic range compression in hardware-accelerated pipeline. Use Value: -2L speed grade ensures stable operation at 85°C ambient in fanless enclosures while maintaining 640 MHz control path timing. | Use Scenario: High-resolution signal generation and analysis in modular PXIe instruments with deterministic trigger distribution. IC Role / Device Role / Timing Role: FPGA serves as real-time pattern generator and digital capture engine synchronized to system backplane clocks. Use Value: Dual 32-bit AXI interconnects enable concurrent DMA transfers to host CPU and local DDR3 memory without arbitration bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | UltraScale architecture, 215K logic cells, higher transceiver count (16 lanes), 15W typical power | Better suited for multi-lane JESD204C or 10G Ethernet where XC7K70T-L2FBG484E reaches resource limits | Select when migrating to higher bandwidth protocols or requiring >340 I/Os with lower jitter transceivers |
| XC7K160T-2FBG484I | Same Kintex-7 family, 162K logic cells, industrial temperature rating (–40°C to +100°C), identical package | Offers extended thermal margin and additional logic resources for complex control-plane offload functions | Choose for harsh-environment deployments where XC7K70T-L2FBG484E may require derating above 85°C ambient |
Compared with XC7K70T-L2FBG484E, XCKU035-2FFVA676E delivers higher throughput but increases board area and power delivery complexity, while XC7K160T-2FBG484I retains pin compatibility and thermal design while expanding logic headroom for firmware co-processing.
Availability
XC7K70T-L2FBG484E is available at Aetrix Electronics and suitable for wireless infrastructure, industrial vision, medical imaging, and test equipment requiring stable component supply across long production lifecycles.
Supply support for XC7K70T-L2FBG484E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through high-performance FPGA and adaptive SoC technologies.
The Kintex-7 family targets cost-optimized, high-throughput applications such as communications infrastructure, video processing, and scientific instrumentation where balanced logic, I/O, and DSP resources are critical.
FAQ
What is the maximum supported transceiver data rate for XC7K70T-L2FBG484E?
The XC7K70T-L2FBG484E supports transceiver line rates up to 6.6 Gb/s per lane. This enables compliance with CPRI Option 7, JESD204B subclass 1, and 1000BASE-X Ethernet standards. Operation at this rate requires proper PCB layout, reference clock jitter below 100 fs RMS, and appropriate IBIS-AMI simulation validation before prototype build.
Does XC7K70T-L2FBG484E include built-in analog monitoring capability?
Yes, XC7K70T-L2FBG484E integrates the XADC (Xilinx Analog-to-Digital Converter) hard IP block. It provides two independent 12-bit, 1 MSPS analog input channels for monitoring on-die temperature, internal supply voltages (VCCINT, VCCAUX), and up to four external analog signals via dedicated pins.
What configuration modes does XC7K70T-L2FBG484E support?
XC7K70T-L2FBG484E supports master SPI, slave SPI, master BPI, slave BPI, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Bitstream loading can be performed from serial NOR flash (SPI), parallel NAND/NOR flash (BPI), or external processor via JTAG or ICAP interface.
Is XC7K70T-L2FBG484E pin-compatible with other Kintex-7 FPGAs in the FCBGA-484 package?
XC7K70T-L2FBG484E shares the same 484-ball FCBGA footprint with other Kintex-7 devices in the FBG484 package, including XC7K160T and XC7K325T. However, I/O bank assignments, power pin locations, and transceiver placement differ across densities, so direct pin-for-pin replacement requires verification of power integrity, signal routing, and bank voltage compatibility.
What is the operating temperature range specified for XC7K70T-L2FBG484E?
XC7K70T-L2FBG484E is rated for commercial temperature operation from 0°C to +85°C ambient. Its -2L speed grade guarantees timing closure up to 100°C junction temperature, making it suitable for thermally constrained environments when proper heatsinking and airflow are implemented.
XC7K70T-L2FBG484E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 484-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5125
- Number of Logic Elements/Cells:
- 65600
- Total RAM Bits:
- 4976640
- Number of I/O:
- 285
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FCBGA (23x23)
XC7K70T-L2FBG484E FAQ
1.How can I place an order for XC7K70T-L2FBG484E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K70T-L2FBG484E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K70T-L2FBG484E reliable?
The price and inventory of XC7K70T-L2FBG484E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K70T-L2FBG484E is usually 5 days.
3.What payment methods are accepted for XC7K70T-L2FBG484E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K70T-L2FBG484E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K70T-L2FBG484E?
XC7K70T-L2FBG484E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K70T-L2FBG484E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K70T-L2FBG484E?
For technical support, including XC7K70T-L2FBG484E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K70T-L2FBG484E requirements.
6.How does Aetrix verify that XC7K70T-L2FBG484E is sourced from the original manufacturer or authorized distributors?
All XC7K70T-L2FBG484E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K70T-L2FBG484E meets industry standards.
7.What is the process for return or replacement of XC7K70T-L2FBG484E?
All XC7K70T-L2FBG484E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K70T-L2FBG484E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K70T-L2FBG484E part is unused and in its original packaging.
Return procedure for XC7K70T-L2FBG484E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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