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AMD XC7K70T-L2FBG676E
- Part No.:
- XC7K70T-L2FBG676E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC7K70T-L2FBG676E.pdf
- Description:
- IC FPGA 300 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,128
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Product details
Overview
XC7K70T-L2FBG676E from AMD is a Kintex-7 FPGA with 74,250 logic cells, 365 I/O pins, and 2.5 Gbps transceivers, fabricated on 28 nm process technology and operating at -2 speed grade. It serves as a high-performance programmable logic fabric in PCIe Gen2 endpoint designs for industrial vision systems.
For engineers reviewing the XC7K70T-L2FBG676E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), transceiver lane count (8 GT lanes), block RAM capacity (4,920 kbits), and thermal design power (12.5 W typical).
Technical Context
The XC7K70T-L2FBG676E implements a heterogeneous architecture with Configurable Logic Blocks (CLBs), 18x25 DSP slices, and integrated PCI Express® v2.1 hard IP blocks. It supports SelectIO™ standards including LVCMOS, SSTL, HSTL, and differential signaling such as LVDS and TMDS.
Its clocking system includes 24 Clock Management Tiles (CMTs) with MMCM and PLL resources, enabling multi-phase clock synthesis and jitter reduction. The device supports partial reconfiguration and AXI4-compliant interconnect for SoC-style integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,250 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| I/O Pins | 365 - supports high-pin-count interface bridging between sensors, memory, and host processors |
| Transceiver Speed | 2.5 Gbps - enables PCIe Gen2 x4 or dual-lane Gigabit Ethernet physical layer connectivity |
| Block RAM | 4,920 kbits - provides on-die memory for frame buffering, FIFOs, and lookup tables without external SRAM |
| Speed Grade | -2 - specifies timing closure margin for 200 MHz system clocks and 800 Mbps DDR3 interfaces |
| TDP | 12.5 W typical - defines thermal envelope requiring active cooling in dense industrial enclosures |
Pinout & Package
XC7K70T-L2FBG676E is housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 27 × 27 array configuration. Thermal and mechanical data comply with JEDEC MO-271AB standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | Core supply input (1.0 V) powering CLBs, interconnect, and configuration logic |
| A15 | VCCAUX | 1.8 V auxiliary supply for configuration, clocking, and transceiver reference circuitry |
| M20 | VCCO_13 | I/O bank 13 output supply (1.2–3.3 V configurable) setting signal voltage levels |
| P17 | MRCC_115 | Main reference clock input for MMCM/PLL in clock management tile CMT_115 |
| R14 | GTGREFCLK0_112 | Reference clock input dedicated to GT transceiver quad GTQ_112 |
| Y16 | PERST_B | PCIe reset assertion line - active-low, synchronous to PCIe link initialization sequence |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen2 Hard IP | Integrated endpoint controller supporting x1/x2/x4 widths with full configuration space access |
| SelectIO Technology | Single-ended and differential I/O standards per bank, enabling mixed-voltage board-level interfacing |
| Partial Reconfiguration | Runtime logic module swap without full device reboot - critical for field-upgradable vision algorithms |
| AXI4 Interconnect | On-chip interconnect supporting up to 64-bit data width and 4K address space for processor-FPGA coherency |
| MMCM + PLL | Dual clock synthesis units per CMT enabling independent frequency/phase control for video pixel clock and system bus clock |
Applications
| Industrial Machine Vision | PCIe-Based Data Acquisition |
|---|---|
Use Scenario: Real-time image preprocessing on factory-floor cameras with sub-millisecond latency requirements. IC Role / Device Role / Timing Role: Programmable logic fabric executing Sobel edge detection and Bayer demosaicing pipelines synchronized to sensor pixel clock. Use Value: Eliminates need for external frame grabber ASIC while maintaining deterministic timing via dedicated clock routing. | Use Scenario: High-throughput analog-to-digital sampling at 10 MS/s across 16 channels with direct host memory mapping. IC Role / Device Role / Timing Role: PCIe Gen2 endpoint bridging ADC parallel bus to host CPU via DMA-accessible BAR regions. Use Value: Achieves 2 GB/s sustained transfer using x4 link width and AXI4-to-PCIe translation logic. |
| Medical Imaging Interface | Test & Measurement Equipment |
Use Scenario: Ultrasound beamforming engine interfacing with 128-channel echo digitizers and display controllers. IC Role / Device Role / Timing Role: Time-critical signal processing core managing channel delay alignment and RF envelope detection in real time. Use Value: Enables 100 ns inter-channel skew control using deterministic I/O delay calibration and phase-aligned clocks. | Use Scenario: Modular oscilloscope front-end with simultaneous analog capture, trigger analysis, and waveform streaming. IC Role / Device Role / Timing Role: Real-time pattern generator and digital acquisition controller synchronizing ADC, DAC, and memory subsystems. Use Value: Supports 1 GS/s sampling with on-device FIFO buffering and PCIe streaming to host PC memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | UltraScale architecture, 215K logic cells, 16.3 Gbps transceivers, higher static power | Supports PCIe Gen3 and 10G Ethernet; requires updated PCB stackup and power delivery | Choose when upgrading bandwidth beyond 2.5 Gbps or requiring hardened 10G MAC |
| XC7K160T-2FBG676E | Same Kintex-7 family, 162K logic cells, identical -2 speed grade and FBG676 package | Higher resource count enables larger algorithm partitions but increases cost and TDP | Choose when additional CLBs or DSP slices are required for expanded functionality |
Compared with XC7K70T-L2FBG676E, XCKU035-2FFVA676E delivers higher serial bandwidth at greater power and layout complexity, while XC7K160T-2FBG676E offers scalable logic density within the same footprint and timing ecosystem.
Availability
XC7K70T-L2FBG676E is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and PCIe-based data acquisition requiring stable component supply across extended product lifecycles.
Supply support for XC7K70T-L2FBG676E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on adaptive computing, AI acceleration, and high-performance processing solutions for data centers, embedded systems, and client devices.
The Kintex-7 FPGA family targets cost-optimized, high-throughput applications in industrial automation, test equipment, and communications infrastructure where balanced logic density, I/O flexibility, and transceiver performance are essential.
FAQ
What is the maximum supported I/O standard voltage for XC7K70T-L2FBG676E?
XC7K70T-L2FBG676E supports I/O voltages from 1.2 V to 3.3 V per bank, configurable independently. This allows direct interfacing with legacy 3.3 V peripherals and modern low-voltage memory or sensors without level-shifting circuitry. The XC7K70T-L2FBG676E datasheet specifies VCCO tolerance of ±3% and supports SSTL-18, HSTL-I, and LVCMOS33 standards under these conditions.
Does XC7K70T-L2FBG676E include hardened PCIe Gen2 endpoints?
Yes, XC7K70T-L2FBG676E integrates a hardened PCIe Gen2 x4 endpoint block compliant with PCI Express Base Specification v2.1. It handles link training, transaction layer packet (TLP) generation, and configuration space access without consuming logic resources. The XC7K70T-L2FBG676E uses dedicated GT transceivers and AXI4-lite interface for host communication.
Can XC7K70T-L2FBG676E operate with a single 1.0 V supply?
No, XC7K70T-L2FBG676E requires three distinct supply domains: VCCINT (1.0 V), VCCAUX (1.8 V), and VCCO (1.2–3.3 V, per I/O bank). Omitting VCCAUX prevents configuration and clock management operation. The XC7K70T-L2FBG676E power sequencing specification mandates VCCAUX ramp before or simultaneously with VCCINT.
What is the block RAM capacity of XC7K70T-L2FBG676E in usable bits?
XC7K70T-L2FBG676E contains 2,460 total 36-kbit Block RAM primitives, yielding 4,920 kbits (4.8 Mbits) of addressable memory. Each block supports true dual-port operation, byte-write enable, and parity generation. The XC7K70T-L2FBG676E permits configuration as 18-kbit or 36-kbit modes depending on data width requirements.
Is partial reconfiguration supported on XC7K70T-L2FBG676E?
Yes, XC7K70T-L2FBG676E supports dynamic partial reconfiguration (PR) through Vivado Design Suite, allowing runtime swapping of logical modules without resetting the entire device. This capability is validated for Kintex-7 devices and used in applications like adaptive filtering or protocol switching. The XC7K70T-L2FBG676E requires PR-enabled bitstream generation and configuration port access via ICAP or PCIe.
XC7K70T-L2FBG676E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Kintex®-7
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5125
- Number of Logic Elements/Cells:
- 65600
- Total RAM Bits:
- 4976640
- Number of I/O:
- 300
- Number of Gates:
- -
- Voltage - Supply:
- 0.97V ~ 1.03V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC7K70T-L2FBG676E FAQ
1.How can I place an order for XC7K70T-L2FBG676E through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7K70T-L2FBG676E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7K70T-L2FBG676E reliable?
The price and inventory of XC7K70T-L2FBG676E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7K70T-L2FBG676E is usually 5 days.
3.What payment methods are accepted for XC7K70T-L2FBG676E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7K70T-L2FBG676E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7K70T-L2FBG676E?
XC7K70T-L2FBG676E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7K70T-L2FBG676E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7K70T-L2FBG676E?
For technical support, including XC7K70T-L2FBG676E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7K70T-L2FBG676E requirements.
6.How does Aetrix verify that XC7K70T-L2FBG676E is sourced from the original manufacturer or authorized distributors?
All XC7K70T-L2FBG676E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7K70T-L2FBG676E meets industry standards.
7.What is the process for return or replacement of XC7K70T-L2FBG676E?
All XC7K70T-L2FBG676E units undergo pre-shipment inspection (PSI). If there is an issue with XC7K70T-L2FBG676E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7K70T-L2FBG676E part is unused and in its original packaging.
Return procedure for XC7K70T-L2FBG676E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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