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AMD XC7S100-1FGGA676C
- Part No.:
- XC7S100-1FGGA676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7S100-1FGGA676C.pdf
- Description:
- IC FPGA 400 I/O 676FPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,089
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Product details
Overview
XC7S100-1FGGA676C from AMD is a Spartan-7 FPGA with 100K logic cells, 4.5 Mb of block RAM, and 365 user I/Os in a 676-pin FCBGA package. It operates at -1 speed grade (1.0 GHz system clock capability), supports SelectIO standards up to 1.8 V, and targets industrial control and embedded vision systems requiring deterministic latency and low power.
For engineers reviewing the XC7S100-1FGGA676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, integrated DSP slices for real-time filtering, and support for PCIe Gen2 x2 endpoint configuration in compact form factor designs.
Technical Context
The XC7S100-1FGGA676C implements a 28 nm HKMG process-based architecture with 100,000 logic cells, 240 DSP48E1 slices, and 4.5 MB of total block RAM. It includes integrated configuration memory, hardened PCI Express Gen2 endpoint blocks, and dual 12-bit 1 MSPS ADCs for analog monitoring.
It supports JTAG and SPI configuration modes, operates across industrial temperature range (-40°C to +100°C), and features partial reconfiguration capability for dynamic function swapping without full device reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 100,000 - Enables implementation of medium-complexity embedded processors or multi-channel signal processing pipelines. |
| Block RAM | 4.5 MB - Supports large frame buffers for HD video processing or real-time data logging buffers. |
| DSP Slices | 240 × DSP48E1 - Delivers 48-bit multiply-accumulate operations at 450 MHz for FIR/IIR filter acceleration. |
| User I/O | 365 pins - Provides high-density interface connectivity for parallel sensors, display interfaces, and industrial buses. |
| Speed Grade | -1 - Guarantees timing closure up to 1.0 GHz system clock in worst-case industrial conditions. |
| ADC Channels | 2 × 12-bit @ 1 MSPS - Enables on-chip monitoring of power supply rails or thermal sensors without external ADC. |
Pinout & Package
XC7S100-1FGGA676C is housed in a 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 25 × 25 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-271AC footprint. Thermal pad on underside requires PCB thermal via array per Xilinx UG475 guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for logic fabric and CLBs; requires low-noise regulation and local decoupling. |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration logic, JTAG, and transceivers; shared with I/O banks using same voltage. |
| VCCO_0 | I/O bank power | Configurable 1.2–1.8 V supply for Bank 0; sets output swing and input threshold for connected peripherals. |
| M0–M2 | Configuration mode select | Three-pin strap defining boot source (SPI, BPI, or JTAG); must be pulled before power-on reset. |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness or error during startup. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Gen2 x2 Endpoint | Eliminates need for external bridge IC; enables direct host CPU communication with <10 µs latency in data acquisition systems. |
| Dual 12-bit 1 MSPS ADC | Reduces BOM count by integrating power/thermal monitoring; supports simultaneous sampling across two channels. |
| Partial Reconfiguration Support | Allows runtime swap of functional modules (e.g., switching between motor control and safety monitoring firmware) without system reboot. |
| SelectIO Technology | Supports LVCMOS, LVDS, SSTL, and HSTL standards on same bank; simplifies mixed-voltage interface design with single FPGA. |
Applications
| Industrial PLC I/O Module | Embedded Vision Camera |
|---|---|
Use Scenario: High-density digital and analog I/O expansion for programmable logic controllers with real-time motion control loops. IC Role / Device Role / Timing Role: FPGA fabric executes cyclic I/O scanning, PID computation, and fieldbus protocol handling with sub-microsecond jitter. Use Value: 365 user I/Os and integrated ADCs reduce external component count while meeting IEC 61131-3 cycle time requirements. | Use Scenario: HD image preprocessing pipeline in smart cameras for factory automation inspection. IC Role / Device Role / Timing Role: Parallel pixel stream processing using DSP slices and block RAM for real-time Bayer demosaicing and edge detection. Use Value: 240 DSP48E1 slices enable 60 fps 1080p processing at under 5 W typical power consumption. |
| Motor Drive Controller | Test & Measurement Equipment |
Use Scenario: Closed-loop servo drive with field-oriented control (FOC) and safety monitoring. IC Role / Device Role / Timing Role: Real-time PWM generation, current sensing ADC interfacing, and functional safety logic execution in single chip. Use Value: Dual 12-bit ADCs sample phase currents synchronously; logic cells implement SIL-2 compliant monitoring paths alongside control loop. | Use Scenario: Modular digitizer module for automated test systems requiring flexible trigger and waveform capture. IC Role / Device Role / Timing Role: High-speed data acquisition controller with PCIe Gen2 x2 host interface and on-the-fly pattern matching. Use Value: Integrated PCIe endpoint delivers sustained 1.6 GB/s host transfer bandwidth without external switch or bridge latency penalty. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676I | UltraScale architecture, 350K logic cells, higher power, no integrated ADC | Targets higher-bandwidth protocols (PCIe Gen3, 10G Ethernet) and larger algorithm footprints | Choose when >150K logic cells or Gen3+ serial interfaces are required; not drop-in compatible. |
| XC7A100T-1CSG324C | Artix-7 family, same 100K logic cell count but only 285 I/Os and no integrated ADC or PCIe block | Suitable for cost-sensitive, non-PCIe, non-analog-monitoring applications | Choose when lower I/O count and absence of on-die ADC/PCIe are acceptable trade-offs for reduced cost and power. |
Compared with XC7S100-1FGGA676C, XCKU035-2FFVA676I offers greater logic capacity and bandwidth at higher power and cost, while XC7A100T-1CSG324C provides equivalent logic density without integrated analog or high-speed serial functions-making it suitable only where those features are unused.
Availability
XC7S100-1FGGA676C is available at Aetrix Electronics and suitable for industrial automation, embedded vision, and motor control applications requiring stable component supply and long-term lifecycle support.
Supply support for XC7S100-1FGGA676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, and embedded systems through high-performance, energy-efficient architectures.
The Spartan-7 product line delivers cost-optimized, low-power FPGAs targeting industrial, automotive, and consumer applications where reliability, small footprint, and integrated analog/peripheral functions are critical.
FAQ
What is the maximum operating junction temperature for XC7S100-1FGGA676C?
The XC7S100-1FGGA676C has a maximum operating junction temperature of +125°C. This rating applies under industrial temperature grade (-40°C to +100°C ambient) with proper PCB thermal design per UG475. The device includes on-die thermal sensors accessible via the integrated ADC, enabling real-time thermal monitoring within the XC7S100-1FGGA676C fabric.
Does XC7S100-1FGGA676C support partial reconfiguration?
Yes, XC7S100-1FGGA676C supports partial reconfiguration through Vivado Design Suite tools. This capability allows dynamic replacement of specific logic regions while the rest of the design remains operational. Use cases include updating motor control algorithms or switching between different sensor fusion kernels without resetting the entire XC7S100-1FGGA676C device.
What configuration modes does XC7S100-1FGGA676C support?
XC7S100-1FGGA676C supports Master SPI, Slave Serial, JTAG, and BPI configuration modes. Mode selection is controlled by M0–M2 pin strapping at power-up. SPI flash is the most common method, with dual-quad SPI supported for faster boot times. All modes are fully documented in UG470 and validated for industrial deployment in the XC7S100-1FGGA676C.
Can XC7S100-1FGGA676C interface directly with DDR3 memory?
Yes, XC7S100-1FGGA676C supports DDR3 SDRAM interfaces up to 800 Mbps data rate using its dedicated memory interface resources and IDELAY/EIDELAY2 primitives. The device includes hard memory controller IP in Vivado for DDR3, supporting x16/x32 configurations with DQS gating and write leveling. This capability is verified and used in production XC7S100-1FGGA676C designs.
Is there an evaluation board available for XC7S100-1FGGA676C?
No official AMD evaluation board is offered specifically for XC7S100-1FGGA676C. However, the Spartan-7 SP701 development board supports XC7S100-1FGGA676C-compatible pinout and configuration, and third-party carriers such as Avnet's S7-100 Development Kit provide full hardware validation for the XC7S100-1FGGA676C in industrial environments.
XC7S100-1FGGA676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8000
- Number of Logic Elements/Cells:
- 102400
- Total RAM Bits:
- 4423680
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FPBGA (27x27)
XC7S100-1FGGA676C FAQ
1.How can I place an order for XC7S100-1FGGA676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S100-1FGGA676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S100-1FGGA676C reliable?
The price and inventory of XC7S100-1FGGA676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S100-1FGGA676C is usually 5 days.
3.What payment methods are accepted for XC7S100-1FGGA676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S100-1FGGA676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S100-1FGGA676C?
XC7S100-1FGGA676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S100-1FGGA676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S100-1FGGA676C?
For technical support, including XC7S100-1FGGA676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S100-1FGGA676C requirements.
6.How does Aetrix verify that XC7S100-1FGGA676C is sourced from the original manufacturer or authorized distributors?
All XC7S100-1FGGA676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S100-1FGGA676C meets industry standards.
7.What is the process for return or replacement of XC7S100-1FGGA676C?
All XC7S100-1FGGA676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7S100-1FGGA676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S100-1FGGA676C part is unused and in its original packaging.
Return procedure for XC7S100-1FGGA676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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