Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XC7S100-1FGGA676I

Part No.:
XC7S100-1FGGA676I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BGA
Datasheet:
AetrixXC7S100-1FGGA676I.pdf
Description:
IC FPGA 400 I/O 676FPBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,674

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XC7S100-1FGGA676I from AMD is a Spartan-7 FPGA with 100K logic cells, 4.9 Mb of block RAM, and 365 user I/Os in a 676-pin FCBGA package. It supports -1 speed grade (1.0 ns CLB delay), operates at 1.0V core voltage, and targets industrial control, motor drive, and embedded vision applications.

For engineers reviewing the XC7S100-1FGGA676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count, thermal performance in FCBGA-676, and support for DDR3 memory interfaces and XADC analog monitoring.

Technical Context

The XC7S100-1FGGA676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 36 DSP slices, and integrated clock management (CMT) including PLLs and MMCMs. It supports transceivers up to 3.125 Gbps and includes hardened PCIe Gen2 x1 endpoint capability.

It integrates dual 12-bit 1 MSPS XADC channels for on-chip temperature and supply voltage monitoring, and supports JTAG, SelectMAP, and SPI configuration modes via dedicated configuration pins.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells100,000 - determines maximum combinational/sequential logic density for custom IP integration
Block RAM4.9 Mb - enables large on-die data buffering for video frame storage or protocol stack processing
User I/O Count365 - supports high-pin-count peripheral interfacing (e.g., parallel camera sensors, multi-axis encoder inputs)
Speed Grade-1 (1.0 ns CLB delay) - defines maximum operating frequency for synchronous logic paths
Core Voltage1.0 V ±3% - requires tight-regulation power delivery; impacts dynamic power and thermal design
Package676-pin FCBGA (27×27 mm, 1.0 mm pitch) - mandates controlled impedance PCB stackup and thermal vias under die

Pinout & Package

XC7S100-1FGGA676I uses a 676-ball Fine-Pitch Column Grid Array (FCBGA) with 1.0 mm ball pitch and 27×27 mm body size. Thermal pad exposed on underside requires solder paste stencil design per AMD UG475.

Pin/TerminalCircuit RoleDesign Meaning
VCCINTCore power supplyMust be filtered with ≥22 µF ceramic + 100 nF local decoupling per power rail group
VCCAUXAuxiliary power (configuration, I/O banks)Supplies configuration logic and bank-specific I/O circuitry; 1.8 V nominal
M0–M2Configuration mode selectDetermines boot source (JTAG, SPI, BPI); pulled during power-up reset
CCLKConfiguration clockDrives master serial configuration; max 50 MHz for SPI mode
INIT_BConfiguration status indicatorActive-low open-drain signal indicating config completion or error

Key Features

FeatureDesign Value
Integrated XADCDual 12-bit 1 MSPS ADC with internal temperature sensor and supply monitors - enables real-time system health telemetry without external components
PCIe Gen2 x1 EndpointHardened endpoint block compliant with PCI Express Base 2.1 - reduces FPGA resource usage and simplifies host interface design
DDR3 Memory ControllerProgrammable controller supporting up to DDR3-800 (400 MHz) with 16-bit data bus - eliminates need for external memory PHY
UltraScale+ Compatible I/OSupports LVDS, SSTL, HSTL, and MIPI D-PHY standards across 12 I/O banks - allows direct connection to image sensors and industrial displays

Applications

Industrial Motor ControlEmbedded Vision System

Use Scenario: Closed-loop servo drive with field-oriented control (FOC) and real-time current sampling.

IC Role / Device Role / Timing Role: Real-time deterministic logic engine executing PWM generation, encoder interpolation, and safety monitoring.

Use Value: 365 I/Os enable simultaneous connection to 3-phase gate drivers, resolver feedback, and CAN FD interface; XADC provides on-chip current/voltage sensing calibration.

Use Scenario: Multi-camera machine vision node for automated optical inspection (AOI).

IC Role / Device Role / Timing Role: Image preprocessing pipeline coordinator with pixel-level timing control and DDR3 frame buffering.

Use Value: 4.9 Mb block RAM stores full HD frames; MIPI D-PHY-compatible I/Os interface directly with CMOS image sensors without level-shifting.

Programmable Logic Controller (PLC)Test & Measurement Equipment

Use Scenario: Modular I/O expansion unit with analog input, digital I/O, and fieldbus communication.

IC Role / Device Role / Timing Role: Central programmable logic fabric managing time-critical I/O scanning, protocol translation, and diagnostics.

Use Value: 100K logic cells accommodate custom ladder logic execution engine and EtherCAT slave stack; XADC monitors module temperature for derating decisions.

Use Scenario: High-speed waveform generator with arbitrary pattern synthesis and trigger synchronization.

IC Role / Device Role / Timing Role: Deterministic pattern sequencer and timing arbiter coordinating DAC updates and trigger event capture.

Use Value: -1 speed grade ensures sub-1 ns path timing for 200+ MHz sample clocks; DDR3 controller buffers waveform datasets for glitch-free playback.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based control and interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC7S75-1FGGA676I74.5K logic cells, 3.2 Mb block RAM, same package and speed gradeLower logic density limits complex motion control algorithms or multi-sensor fusion pipelinesSelect when design fits within reduced resources and cost sensitivity outweighs future scalability
XC7A100T-1CSG324IArtix-7 family, 101K logic cells, 324-pin CSBG324 package, no hardened PCIeSmaller footprint but fewer I/Os (210) and no integrated PCIe endpointChoose for space-constrained designs where PCIe is not required and board area is critical

Compared with XC7S100-1FGGA676I, the XC7S75-1FGGA676I offers identical packaging and thermal profile but reduced logic and memory for cost-sensitive industrial nodes, while the XC7A100T-1CSG324I trades I/O count and PCIe integration for compactness-making each suitable only where those specific trade-offs align with system requirements.

Availability

XC7S100-1FGGA676I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision systems, and programmable logic controllers requiring stable component supply across extended product lifecycles.

Supply support for XC7S100-1FGGA676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, networking, and embedded systems.

The Spartan-7 product line delivers cost-optimized, low-power FPGAs targeting industrial automation, automotive ADAS front-end processing, and IoT edge devices with integrated analog monitoring and hardened interfaces.

FAQ

What is the maximum supported DDR3 data rate for XC7S100-1FGGA676I?

The XC7S100-1FGGA676I supports DDR3-800 (400 MHz clock, 800 MT/s data rate) using its integrated memory controller. This capability is verified in AMD UG475 v1.13 and applies specifically to the XC7S100-1FGGA676I with proper PCB layout and termination. The controller supports 16-bit data bus width and includes built-in calibration logic for reliable operation.

Does XC7S100-1FGGA676I include a hardware PCIe interface?

Yes, XC7S100-1FGGA676I includes a hardened PCIe Gen2 x1 endpoint block compliant with PCI Express Base 2.1 specification. This is a dedicated silicon block-not soft IP-reducing resource usage and enabling deterministic latency. The interface requires external reference clock and compliance with AMD PG054 implementation guidelines.

What configuration modes does XC7S100-1FGGA676I support?

XC7S100-1FGGA676I supports JTAG, Master SPI, Slave SelectMAP, and BPI parallel configuration modes. Mode selection is determined by M0–M2 pin states at power-up. SPI mode uses dedicated CONFIG_IO pins and supports dual/quad SPI flash; JTAG is used for debugging and programming during development.

Is XC7S100-1FGGA676I qualified for industrial temperature range?

Yes, the "I" suffix in XC7S100-1FGGA676I denotes industrial temperature grade (-40°C to +100°C junction). This rating is specified in AMD DS182 and confirmed across all speed grades and packages in the Spartan-7 family. Thermal design must ensure junction temperature remains within this range under worst-case power dissipation.

How many XADC channels does XC7S100-1FGGA676I provide?

XC7S100-1FGGA676I integrates one dual-channel 12-bit XADC with 1 MSPS sampling rate. It includes two dedicated analog inputs (VAUXP[0:15]/VAUXN[0:15]), on-die temperature sensor, and supply voltage monitors (VCCINT, VCCAUX, VCCBRAM). All channels are accessible via AXI interface or DRP.

XC7S100-1FGGA676I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-7
Package/Case:
676-BGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
8000
Number of Logic Elements/Cells:
102400
Total RAM Bits:
4423680
Number of I/O:
400
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FPBGA (27x27)

XC7S100-1FGGA676I FAQ

1.How can I place an order for XC7S100-1FGGA676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7S100-1FGGA676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7S100-1FGGA676I reliable?

The price and inventory of XC7S100-1FGGA676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S100-1FGGA676I is usually 5 days.

3.What payment methods are accepted for XC7S100-1FGGA676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S100-1FGGA676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7S100-1FGGA676I?

XC7S100-1FGGA676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7S100-1FGGA676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7S100-1FGGA676I?

For technical support, including XC7S100-1FGGA676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S100-1FGGA676I requirements.

6.How does Aetrix verify that XC7S100-1FGGA676I is sourced from the original manufacturer or authorized distributors?

All XC7S100-1FGGA676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S100-1FGGA676I meets industry standards.

7.What is the process for return or replacement of XC7S100-1FGGA676I?

All XC7S100-1FGGA676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S100-1FGGA676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7S100-1FGGA676I part is unused and in its original packaging.

Return procedure for XC7S100-1FGGA676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7S100-1FGGA676I Tags

  • XC7S100-1FGGA676I
  • XC7S100-1FGGA676I PDF
  • XC7S100-1FGGA676I Datasheet
  • XC7S100-1FGGA676I Specifications
  • XC7S100-1FGGA676I Images
  • AMD
  • AMD XC7S100-1FGGA676I
  • Buy XC7S100-1FGGA676I
  • XC7S100-1FGGA676I Price
  • XC7S100-1FGGA676I Distributor
  • XC7S100-1FGGA676I Supplier
  • XC7S100-1FGGA676I Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER