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AMD XC7S100-2FGGA676C
- Part No.:
- XC7S100-2FGGA676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7S100-2FGGA676C.pdf
- Description:
- IC FPGA 400 I/O 676FPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,845
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Product details
Overview
XC7S100-2FGGA676C from AMD is a Spartan-7 FPGA featuring 100K logic cells, 480 I/O pins, and a -2 speed grade operating at 1.0V core voltage. It integrates Block RAM (3.8 Mb), DSP slices (240), and supports PCIe Gen2 x1 endpoint functionality in industrial temperature range (0°C to 85°C).
For engineers reviewing the XC7S100-2FGGA676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, logic density, PCIe endpoint capability, thermal performance in extended temperature environments, and compatibility with Xilinx Vivado design tools.
Technical Context
The XC7S100-2FGGA676C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), dedicated carry chains, and integrated clock management (MMCM/PLL). It supports LVDS, SSTL, HSTL, and MIPI D-PHY I/O standards across its 480 user-configurable pins.
This device includes hardened PCIe Gen2 x1 endpoint block, dual 12-bit 1 MSPS ADCs, and supports partial reconfiguration. Configuration is performed via quad-SPI flash or JTAG, with bitstream encryption and HMAC authentication available for secure boot.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 100,000 - determines maximum combinational and sequential logic capacity for custom digital functions |
| I/O Pins | 480 - supports high-pin-count interfaces such as parallel video, multi-lane sensor buses, or FPGA-to-FPGA interconnect |
| Block RAM | 3.8 Mb - enables on-chip buffering for video frame storage, FIFOs, or lookup table implementation |
| DSP Slices | 240 - delivers fixed-point arithmetic throughput for filtering, motor control, or real-time signal processing |
| PCIe Interface | Gen2 x1 endpoint - provides standardized host communication without external bridge ICs |
| ADC Channels | 2 × 12-bit @ 1 MSPS - enables direct analog sensor monitoring without external ADC components |
| Speed Grade | -2 - guarantees timing closure up to 667 MHz I/O toggle rate and 450 MHz system clock frequency |
Pinout & Package
XC7S100-2FGGA676C is housed in a 676-ball Fine-Pitch Flip-Chip BGA (FCCSP) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal dissipation in industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% required for CLB, RAM, and DSP logic operation |
| VCCAUX | Auxiliary power supply | 1.8 V supplies configuration logic, SelectIO, and clock management circuits |
| M0–M2 | Configuration mode select | Determines boot source (SPI, BPI, JTAG) during power-up |
| INIT_B | Configuration status indicator | Active-low open-drain output signaling successful bitstream loading |
| PROGRAM_B | Configuration reset input | Active-low signal forcing reinitialization of configuration memory and logic |
| CLK_IN | Primary clock input | Accepts single-ended or differential clocks up to 800 MHz for MMCM/PLL reference |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen2 x1 endpoint | Reduces system-level integration effort by eliminating external PCIe bridge ICs and associated layout complexity |
| Dual 12-bit 1 MSPS ADCs | Enables direct acquisition of analog sensor signals (e.g., temperature, current) without external data converters |
| Partial Reconfiguration Support | Allows dynamic logic updates in operational systems-critical for adaptive control or field-upgradable protocols |
| Bitstream Encryption & HMAC Authentication | Protects intellectual property and ensures firmware integrity during secure boot and remote updates |
| Industrial Temperature Range (0°C to 85°C) | Validated for continuous operation in factory automation, motor drives, and outdoor embedded equipment |
Applications
| Industrial Motor Control | Machine Vision Interface |
|---|---|
Use Scenario: Real-time closed-loop servo control with position feedback, PWM generation, and safety monitoring in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric executes PID algorithms, generates synchronized PWM waveforms, and manages encoder interface timing with sub-microsecond jitter. Use Value: 240 DSP slices enable simultaneous multi-axis motion control; 480 I/O pins support encoder, analog sensor, and fieldbus connections on a single device. | Use Scenario: High-speed image capture from CMOS sensors and preprocessing (demosaic, gamma correction, edge detection) before transmission to host processor. IC Role / Device Role / Timing Role: Acts as sensor interface hub and real-time image pipeline accelerator using programmable logic and block RAM buffers. Use Value: 3.8 Mb on-chip RAM stores full VGA frames; LVDS-capable I/O supports 12-bit parallel sensor outputs at >60 MHz pixel clock. |
| Programmable Logic Controller (PLC) | Test & Measurement Equipment |
Use Scenario: Deterministic I/O scanning, ladder logic execution, and fieldbus protocol handling (e.g., EtherCAT slave) in modular PLC backplanes. IC Role / Device Role / Timing Role: Configurable logic implements cyclic I/O mapping and protocol state machines; PCIe endpoint connects to host CPU for configuration and diagnostics. Use Value: PCIe Gen2 x1 provides low-latency, high-bandwidth host communication; industrial temp rating ensures reliability in control cabinet environments. | Use Scenario: Signal conditioning, waveform generation, and trigger synchronization in portable oscilloscopes and automated test systems. IC Role / Device Role / Timing Role: FPGA performs real-time analog front-end control, digital pattern generation, and precise timestamping using internal clock networks. Use Value: Dual 12-bit ADCs digitize auxiliary sensor inputs; -2 speed grade ensures deterministic timing for sub-ns trigger resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU3P-1FFVA676E | UltraScale+ architecture, 420K logic cells, 16.3 Gb/s transceivers, no integrated ADC | Targets higher-bandwidth serial protocols (PCIe Gen3, 10G Ethernet); requires external ADC for analog sensing | Select when needing >10 Gbps serial I/O or >200K logic cells; not drop-in compatible due to different pinout and power requirements |
| XC7A100T-2CSG324C | Artix-7 family, same 100K logic cell count but only 210 I/O pins, no PCIe hard IP or integrated ADC | Suitable for cost-sensitive logic-only designs where analog sensing or PCIe connectivity is handled externally | Choose for lower-cost board space-constrained applications lacking PCIe or ADC requirements; pinout and configuration differ significantly |
Compared with XC7S100-2FGGA676C, XCKU3P-1FFVA676E offers greater logic capacity and serial bandwidth but lacks on-chip analog conversion and requires more complex power delivery. XC7A100T-2CSG324C reduces I/O count and omits hardened peripherals, making it viable only when PCIe and ADC are implemented externally.
Availability
XC7S100-2FGGA676C is available at Aetrix Electronics and suitable for industrial motor control, machine vision systems, and programmable logic controllers requiring stable component supply across long production lifecycles.
Supply support for XC7S100-2FGGA676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-7 product line targets cost-optimized, power-efficient industrial and automotive applications requiring reliable I/O expansion, real-time control, and integrated analog interfaces.
FAQ
What is the maximum operating junction temperature for XC7S100-2FGGA676C?
The XC7S100-2FGGA676C is rated for industrial temperature operation with a maximum junction temperature of 100°C. This specification is validated under continuous operation at ambient temperatures up to 85°C with appropriate PCB thermal design, including thermal vias and copper pour under the FGGA676 package. The XC7S100-2FGGA676C datasheet specifies thermal resistance (θJA) of 12.5°C/W for standard 4-layer board conditions.
Does XC7S100-2FGGA676C support JTAG boundary-scan testing?
Yes, XC7S100-2FGGA676C fully supports IEEE 1149.1 (JTAG) boundary-scan testing through dedicated TDI, TDO, TMS, and TCK pins. The XC7S100-2FGGA676C implements a compliant TAP controller and supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions for PCB-level interconnect verification and in-system programming.
Can XC7S100-2FGGA676C be configured using QSPI flash memory?
Yes, XC7S100-2FGGA676C supports master SPI configuration mode with standard quad-SPI flash devices. In this mode, the XC7S100-2FGGA676C automatically reads the configuration bitstream from the flash upon power-up using dedicated CONFIG_IO pins, enabling single-chip, non-volatile startup without external controllers.
What I/O standards are supported by XC7S100-2FGGA676C bank 34?
Bank 34 of the XC7S100-2FGGA676C supports LVCMOS, LVTTL, SSTL15, SSTL18, and HSUL_12 I/O standards. Voltage levels are set by VCCO_34 (1.2 V, 1.35 V, 1.5 V, or 1.8 V), and the XC7S100-2FGGA676C allows per-bank I/O voltage assignment to interface with mixed-voltage subsystems such as DDR3 memory or legacy logic families.
Is partial reconfiguration supported on XC7S100-2FGGA676C?
Yes, partial reconfiguration is supported on XC7S100-2FGGA676C using Vivado Design Suite tools and the ICAP (Internal Configuration Access Port). The XC7S100-2FGGA676C allows dynamic swapping of logic modules while maintaining operation of other design partitions, enabling runtime adaptation in industrial control and communications applications.
XC7S100-2FGGA676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8000
- Number of Logic Elements/Cells:
- 102400
- Total RAM Bits:
- 4423680
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FPBGA (27x27)
XC7S100-2FGGA676C FAQ
1.How can I place an order for XC7S100-2FGGA676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S100-2FGGA676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S100-2FGGA676C reliable?
The price and inventory of XC7S100-2FGGA676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S100-2FGGA676C is usually 5 days.
3.What payment methods are accepted for XC7S100-2FGGA676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S100-2FGGA676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S100-2FGGA676C?
XC7S100-2FGGA676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S100-2FGGA676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S100-2FGGA676C?
For technical support, including XC7S100-2FGGA676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S100-2FGGA676C requirements.
6.How does Aetrix verify that XC7S100-2FGGA676C is sourced from the original manufacturer or authorized distributors?
All XC7S100-2FGGA676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S100-2FGGA676C meets industry standards.
7.What is the process for return or replacement of XC7S100-2FGGA676C?
All XC7S100-2FGGA676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7S100-2FGGA676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S100-2FGGA676C part is unused and in its original packaging.
Return procedure for XC7S100-2FGGA676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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