AMD XC7S100-2FGGA676I
- Part No.:
- XC7S100-2FGGA676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7S100-2FGGA676I.pdf
- Description:
- IC FPGA 400 I/O 676FPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:120
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Product details
Overview
XC7S100-2FGGA676I from AMD (Xilinx) is a Spartan-7 FPGA featuring 100K logic cells, 4.5 Gb/s transceiver capability, -2 speed grade, and 676-pin FCBGA package with industrial temperature range (-40°C to +100°C). It serves as a programmable logic fabric for high-speed I/O bridging in industrial vision systems.
For engineers reviewing the XC7S100-2FGGA676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/O), LVDS support, embedded block RAM (3.8 Mb), and configuration via SPIx4 or JTAG.
Technical Context
The XC7S100-2FGGA676I implements a 28 nm HKMG process-based architecture with integrated SelectIO technology supporting SSTL, HSTL, LVCMOS, and LVDS standards. It includes 240 DSP slices and 360 dedicated clock routing resources for deterministic timing closure.
Configuration is performed through Master SPI or JTAG modes, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and AXI4-Stream interfaces for real-time data path integration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 100,000 – determines maximum combinational/sequential logic capacity for custom IP implementation |
| User I/O Pins | 400 – supports high-density parallel interface routing including camera sensor buses and industrial Ethernet PHYs |
| Block RAM | 3.8 Mb – enables on-chip frame buffering for image processing pipelines without external memory |
| DSP Slices | 240 – provides fixed-point arithmetic throughput for real-time filtering and motor control algorithms |
| Transceiver Speed | 4.5 Gb/s – enables direct connection to MIPI CSI-2 receivers and Gigabit Ethernet PHYs |
| Speed Grade | -2 – guarantees timing performance at maximum operating frequency under industrial temperature conditions |
| Operating Temp | -40°C to +100°C – qualified for deployment in uncooled factory automation enclosures |
Pinout & Package
XC7S100-2FGGA676I uses a 676-ball Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 0.8 mm ball pitch and 27 × 27 mm body size. Thermal pad is exposed on underside for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for FPGA fabric and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, PCIe blocks, and I/O banks |
| VCCO_0 | I/O bank voltage | Configurable 1.2–3.3V per bank; sets signaling standard for connected peripherals |
| M0–M2 | Mode pins | Determine boot source (SPI/JTAG/BPI) during power-up initialization |
| CCLK | Configuration clock | Drives internal configuration shift register; sourced externally in Master SPI mode |
| INIT_B | Configuration status | Active-low open-drain signal indicating bitstream loading progress and CRC pass/fail |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ compatible I/O | Supports mixed-voltage operation across 12 I/O banks with independent VCCO per bank |
| Integrated AES encryption | Enables secure bitstream loading using 256-bit keys stored in eFUSE |
| Partial reconfiguration | Allows dynamic logic module swapping without full device reset or system interruption |
| AXI4-Stream interface | Provides standardized high-throughput data path for connecting custom IP to processor subsystems |
| Industrial temp qualification | Validated for continuous operation at 100°C junction temperature per AEC-Q100 Class 0 |
Applications
| Machine Vision Edge Node | Programmable Industrial Gateway |
|---|---|
Use Scenario: Real-time preprocessing of 1080p60 camera streams before transmission over EtherCAT. IC Role / Device Role / Timing Role: FPGA fabric executes pixel-level filtering and ROI extraction; transceivers serialize output to industrial network PHY. Use Value: Eliminates need for external frame buffer and reduces latency by 12.4 µs versus ASIC-based pipeline. | Use Scenario: Protocol translation between Modbus RTU field devices and OPC UA cloud interface. IC Role / Device Role / Timing Role: Configurable logic implements dual-port FIFOs and state machines for deterministic protocol conversion. Use Value: Enables field-upgradable firmware and supports 32 concurrent device connections without host CPU intervention. |
| Embedded Test Equipment | Motor Drive Control Unit |
Use Scenario: High-precision waveform generation and response capture in automated PCB functional testers. IC Role / Device Role / Timing Role: FPGA generates synchronized 100 MHz digital stimulus patterns while sampling responses with 5 ns resolution. Use Value: Achieves <10 ppm timing accuracy across temperature drift, meeting IEEE 1149.1 boundary-scan compliance. | Use Scenario: Field-oriented control (FOC) execution for 3-phase PMSM motors in HVAC compressors. IC Role / Device Role / Timing Role: Dedicated DSP slices compute Park/Clarke transforms and PWM modulation in ≤2.1 µs loop time. Use Value: Enables torque ripple reduction below 1.8% THD and supports SIL-2 functional safety via lockstep monitoring logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676I | Ultrascale Kintex with 350K logic cells, higher transceiver count (20× 12.5 Gb/s), larger package (676-pin FCBGA same footprint) | Targeted at multi-camera aggregation and 10G Ethernet backhaul; exceeds XC7S100-2FGGA676I capacity by 3.5× | Select when >150K LUTs or >6 Gb/s serial bandwidth required; higher cost and power draw |
| XC7A100T-2FGG484I | Artix-7 with 100K logic cells but only 285 user I/O, no transceivers, 484-pin FGG package (smaller footprint) | Suitable for cost-sensitive control logic without high-speed serial I/O; lacks MIPI/GigE interface capability | Select when transceiver-free design suffices and board space is constrained; lower thermal envelope |
Compared with XC7S100-2FGGA676I, XCKU035-2FFVA676I delivers scalable bandwidth for future-proofing, while XC7A100T-2FGG484I trades serial I/O for reduced BOM cost and simpler thermal management-both require PCB redesign due to non-identical pinouts and power delivery requirements.
Availability
XC7S100-2FGGA676I is available at Aetrix Electronics and suitable for industrial automation, machine vision edge nodes, and embedded test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC7S100-2FGGA676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) designs adaptive computing platforms for data centers, AI, and industrial applications, with leadership in FPGA, ACAP, and heterogeneous SoC architectures.
The Spartan-7 family, including XC7S100-2FGGA676I, targets cost-optimized, high-reliability industrial and automotive applications where power efficiency, small form factor, and extended temperature operation are critical.
FAQ
What is the maximum supported I/O standard voltage for XC7S100-2FGGA676I?
XC7S100-2FGGA676I supports I/O voltages from 1.2 V to 3.3 V across its 12 configurable I/O banks. Each bank operates independently, enabling mixed-voltage interfaces such as 1.8 V MIPI D-PHY receivers alongside 3.3 V industrial GPIOs. This flexibility eliminates level-shifter components in multi-standard systems.
Does XC7S100-2FGGA676I support JTAG-based boundary scan testing?
Yes, XC7S100-2FGGA676I fully complies with IEEE 1149.1 (JTAG) and includes dedicated TDI, TDO, TMS, and TCK pins. Its boundary-scan chain covers all user I/Os and internal logic, enabling in-circuit verification and fault isolation during manufacturing and field diagnostics.
Can XC7S100-2FGGA676I be configured via SD card or USB interface?
No, XC7S100-2FGGA676I does not natively support SD card or USB configuration. It boots exclusively from SPI flash (Master SPI mode), BPI flash, or JTAG. External microcontrollers may emulate SPI flash over USB, but that requires custom firmware-not a built-in feature of XC7S100-2FGGA676I.
What is the total embedded memory capacity of XC7S100-2FGGA676I?
XC7S100-2FGGA676I contains 3.8 Mb of total block RAM, distributed across 280 BRAM primitives (each 36 Kb). This memory supports dual-port read/write operations and can be configured as FIFOs, caches, or frame buffers-enabling standalone image processing without external DDR.
Is XC7S100-2FGGA676I qualified for automotive applications?
XC7S100-2FGGA676I carries industrial temperature qualification (-40°C to +100°C) and meets AEC-Q100 Class 0 stress testing, but it is not officially certified for automotive safety standards like ISO 26262 ASIL-B. For automotive use, AMD recommends the XA Spartan-7 variant (e.g., XA7S100), which includes full ASIL-B documentation and safety libraries.
XC7S100-2FGGA676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 8000
- Number of Logic Elements/Cells:
- 102400
- Total RAM Bits:
- 4423680
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FPBGA (27x27)
XC7S100-2FGGA676I FAQ
1.How can I place an order for XC7S100-2FGGA676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S100-2FGGA676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S100-2FGGA676I reliable?
The price and inventory of XC7S100-2FGGA676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S100-2FGGA676I is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S100-2FGGA676I?
For technical support, including XC7S100-2FGGA676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S100-2FGGA676I requirements.
6.How does Aetrix verify that XC7S100-2FGGA676I is sourced from the original manufacturer or authorized distributors?
All XC7S100-2FGGA676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S100-2FGGA676I meets industry standards.
7.What is the process for return or replacement of XC7S100-2FGGA676I?
All XC7S100-2FGGA676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S100-2FGGA676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S100-2FGGA676I part is unused and in its original packaging.
Return procedure for XC7S100-2FGGA676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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