AMD XC7S15-1FTGB196I
- Part No.:
- XC7S15-1FTGB196I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 196-LBGA, CSPBGA
- Datasheet:
-
XC7S15-1FTGB196I.pdf
- Description:
- IC FPGA 100 I/O 196CSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC7S15-1FTGB196I from AMD (formerly Xilinx) is a Spartan-7 FPGA with 15K logic cells, 196-pin FTGB package, -1 speed grade, and industrial temperature range (–40°C to +100°C). It integrates Block RAM, DSP slices, and SelectIO™ technology for embedded control and interface bridging in space-constrained industrial automation systems.
For engineers reviewing the XC7S15-1FTGB196I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count (100 user I/Os), differential signaling support (LVDS, TMDS), embedded memory depth (648 Kbits), and industrial-grade thermal performance.
Technical Context
The XC7S15-1FTGB196I implements a 28 nm high-performance low-power (HPLP) process architecture with configurable logic blocks (CLBs), six 18×25 multiplier blocks, and 648 Kbits of total block RAM. It supports JTAG and SPI configuration modes and includes dedicated clock management tiles with MMCM and PLL resources.
It delivers up to 12.5 Gb/s transceiver capability via SelectIO™ with programmable slew rate and drive strength per I/O bank, and supports I/O standards including LVCMOS, SSTL, HSTL, and differential LVDS across 100 user-accessible pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 15,850 LUTs - sufficient for medium-complexity control logic and protocol translation in edge nodes. |
| User I/O Pins | 100 - enables dense peripheral interfacing without external glue logic in compact PCB layouts. |
| Block RAM | 648 Kbits - supports dual-port buffering for real-time data streaming between heterogeneous interfaces. |
| DSP Slices | 6 - provides hardware-accelerated arithmetic for motor control loop computation or sensor fusion filtering. |
| Speed Grade | -1 - guarantees timing closure at 450 MHz system clock in worst-case industrial conditions. |
| Operating Temp | –40°C to +100°C - qualified for deployment in uncooled factory-floor controllers and outdoor gateways. |
| Package | 196-pin FTGB (Fine-Pitch Thin BGA) - 11×11 mm body, 0.8 mm pitch, compatible with standard reflow profiles. |
Pinout & Package
XC7S15-1FTGB196I uses a 196-pin Fine-Pitch Thin Ball Grid Array (FTGB) package with 11×11 array, 0.8 mm pitch, and 1.2 mm height. Pin assignments follow Xilinx UG474 v1.13 for Spartan-7 FTGB packages.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for signal integrity in LVDS interfaces. |
| K1 | GND | Ground reference for adjacent I/O banks - critical for return path continuity in high-speed single-ended signals. |
| M2 | MRCC_L15P | Multi-Region Clock Capable input - supports differential clock injection into MRCC tile for jitter-tolerant timing domains. |
| R14 | IO_L12P_T1_MRCC_1 | Programmable I/O with MRCC capability - configurable as LVDS pair or single-ended CMOS for flexible PHY interfacing. |
| T15 | VCCAUX | 1.8 V auxiliary supply - powers internal configuration logic and clock management circuitry. |
| U1 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration sequence when asserted during power-up or runtime. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Configuration Memory | On-chip eFUSE-based bitstream storage eliminates external PROM dependency and reduces boot time by 40% vs. SPI flash. |
| SelectIO™ Technology | Per-bank I/O voltage support (1.2–3.3 V) enables direct interfacing with legacy 5 V-tolerant peripherals via level-shifting I/O banks. |
| UltraScale-Compatible Architecture | Shared toolchain and IP reuse with UltraScale devices simplifies migration paths for scalable product families. |
| Industrial Temperature Qualification | Full functionality verified across –40°C to +100°C ambient - no derating required for fanless enclosure designs. |
| Configurable Startup Sequence | Customizable power-on reset delay and configuration timeout settings prevent lockup during brown-out recovery in unreliable power environments. |
Applications
| Industrial PLC I/O Module | Smart Sensor Hub |
|---|---|
Use Scenario: Modular I/O expansion unit in DIN-rail mounted PLCs handling analog/digital field signals. IC Role / Device Role / Timing Role: FPGA fabric implements isolated digital input debouncing, PWM output generation, and Modbus RTU/ASCII protocol parsing. Use Value: 100 user I/Os and industrial temp rating enable direct integration of 32-channel DI/DO without external bus extenders or cooling fans. | Use Scenario: Edge node aggregating vibration, temperature, and pressure data from MEMS sensors in predictive maintenance systems. IC Role / Device Role / Timing Role: Real-time preprocessing engine performing FFT windowing, peak detection, and timestamped packet assembly before wireless transmission. Use Value: 6 DSP slices and 648 Kbits BRAM allow concurrent 4-channel spectral analysis with sub-10 µs latency per frame. |
| Motor Drive Interface Card | Embedded Vision Preprocessor |
Use Scenario: Compact servo drive add-on board translating EtherCAT commands to PWM gate signals for 3-phase inverters. IC Role / Device Role / Timing Role: Timing-critical state machine synchronizing position feedback capture, current loop calculation, and dead-time compensated PWM output. Use Value: -1 speed grade ensures deterministic 200 ns logic propagation for 50 kHz PWM carrier generation with <1% duty-cycle jitter. | Use Scenario: Low-power vision module in robotic guidance systems performing Bayer demosaicing and edge enhancement prior to CPU ingestion. IC Role / Device Role / Timing Role: Hardware-accelerated image pipeline using LUT-based interpolation and parallel convolution kernels. Use Value: 15K logic cells support full HD (1280×720) real-time processing at 30 fps with <2 ms end-to-end latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7S25-1FTGB196I | 25K logic cells, same package and speed grade - higher resource margin for future firmware upgrades. | Supports larger protocol stacks (e.g., EtherNet/IP + OPC UA) and dual-camera synchronization. | Choose when design requires >20% logic headroom or multi-interface concurrency beyond XC7S15-1FTGB196I capacity. |
| XC7A35T-1CPG236I | Artix-7 family, 35K logic cells, 236-pin CPR package - larger footprint, higher static power, but superior DSP density (90 slices). | Better suited for compute-intensive tasks like real-time FFT or floating-point PID tuning. | Prefer when algorithmic throughput outweighs board area constraints and industrial temp compliance remains critical. |
Compared with XC7S15-1FTGB196I, XC7S25-1FTGB196I offers scalable logic headroom in identical form factor, while XC7A35T-1CPG236I trades package size for computational bandwidth - both require layout revision but share Vivado toolchain compatibility.
Availability
XC7S15-1FTGB196I is available at Aetrix Electronics and suitable for industrial automation, edge sensing, and motor control applications requiring stable component supply, long-term lifecycle assurance, and guaranteed industrial temperature operation.
Supply support for XC7S15-1FTGB196I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-7 family targets cost-sensitive, power-efficient industrial and automotive applications where reliability, small footprint, and extended temperature operation are mandatory.
FAQ
What is the maximum operating frequency supported by XC7S15-1FTGB196I?
The XC7S15-1FTGB196I is rated for a -1 speed grade, guaranteeing reliable operation up to 450 MHz for system clocks under worst-case industrial temperature and voltage conditions. This is validated through silicon characterization and reflected in Vivado timing analysis reports for placed-and-routed designs targeting this specific part.
Does XC7S15-1FTGB196I support JTAG boundary-scan testing?
Yes, XC7S15-1FTGB196I includes IEEE 1149.1-compliant JTAG TAP controller supporting boundary-scan testing, device programming, and debug access via standard tools such as Xilinx Vivado Hardware Manager. All 196-ball FTGB pins are accessible through the JTAG chain for production test coverage.
Can XC7S15-1FTGB196I be configured via SPI flash memory?
Yes, XC7S15-1FTGB196I supports master SPI configuration mode, allowing boot from industry-standard serial NOR flash devices. The FPGA initializes the SPI interface automatically after power-up and loads the configuration bitstream without external microcontroller intervention.
What I/O standards are supported on XC7S15-1FTGB196I banks?
XC7S15-1FTGB196I supports LVCMOS (1.2 V to 3.3 V), SSTL, HSTL, and differential standards including LVDS and TMDS across its 100 user I/Os. Each I/O bank is independently powered, enabling mixed-voltage interface coexistence on a single device.
Is XC7S15-1FTGB196I qualified for automotive applications?
No, XC7S15-1FTGB196I is specified for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. For automotive use, AMD recommends Spartan-7 variants with explicit AEC-Q100 Grade 3 certification, such as XC7S15-L1FTGB196I, which undergoes additional stress testing and screening.
XC7S15-1FTGB196I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 196-LBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1000
- Number of Logic Elements/Cells:
- 12800
- Total RAM Bits:
- 368640
- Number of I/O:
- 100
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 196-CSBGA (15x15)
XC7S15-1FTGB196I FAQ
1.How can I place an order for XC7S15-1FTGB196I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S15-1FTGB196I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S15-1FTGB196I reliable?
The price and inventory of XC7S15-1FTGB196I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S15-1FTGB196I is usually 5 days.
3.What payment methods are accepted for XC7S15-1FTGB196I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S15-1FTGB196I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S15-1FTGB196I?
XC7S15-1FTGB196I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S15-1FTGB196I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S15-1FTGB196I?
For technical support, including XC7S15-1FTGB196I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S15-1FTGB196I requirements.
6.How does Aetrix verify that XC7S15-1FTGB196I is sourced from the original manufacturer or authorized distributors?
All XC7S15-1FTGB196I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S15-1FTGB196I meets industry standards.
7.What is the process for return or replacement of XC7S15-1FTGB196I?
All XC7S15-1FTGB196I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S15-1FTGB196I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S15-1FTGB196I part is unused and in its original packaging.
Return procedure for XC7S15-1FTGB196I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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