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AMD XC7S25-1CSGA324I
- Part No.:
- XC7S25-1CSGA324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7S25-1CSGA324I.pdf
- Description:
- IC FPGA 150 I/O 324CSGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,507
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Product details
Overview
XC7S25-1CSGA324I from AMD (formerly Xilinx) is a Spartan-7 FPGA with 25K logic cells, 1.2V core voltage, -1 speed grade, and 324-pin CSP BGA package. It integrates block RAM, DSP slices, and I/O banks supporting LVCMOS, LVDS, and SSTL standards for embedded control and industrial interface applications.
For engineers reviewing the XC7S25-1CSGA324I datasheet, pinout, applications, or equivalent options, key selection factors include logic capacity, I/O voltage flexibility, thermal performance in compact CSP packaging, and support for industrial temperature operation (-40°C to +100°C).
Technical Context
The XC7S25-1CSGA324I implements a 28 nm HKMG process FPGA architecture with configurable logic blocks (CLBs), 18 Kb block RAMs, and 18×25-bit multiplier-accumulator DSP slices. It supports SelectIO technology with programmable I/O standards across 200 user I/O pins.
Configuration is performed via Master SPI or JTAG, and it includes integrated configuration memory with fallback support. The device operates at industrial temperature range and requires external configuration PROM or processor-controlled initialization.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 25,850 LUTs + flip-flops - sufficient for mid-complexity control logic or protocol bridging |
| Block RAM | 1,800 Kb - enables local data buffering or FIFO implementation without external memory |
| DSP Slices | 120 - supports real-time filtering, motor control math, or sensor fusion algorithms |
| User I/O Pins | 200 - supports multi-protocol interface consolidation (e.g., UART, SPI, I2C, parallel bus) |
| Core Voltage | 1.2 V ±3% - mandates tight regulation; compatible with standard 1.2 V PMICs |
| Operating Temp | -40°C to +100°C - qualified for industrial and extended-temperature embedded systems |
| Speed Grade | -1 - defines maximum clock frequency for timing-critical paths (e.g., 450 MHz BUFG output) |
Pinout & Package
XC7S25-1CSGA324I uses a 324-ball fine-pitch CSP BGA (15×15 mm, 0.8 mm pitch) with 200 user I/Os distributed across 8 I/O banks. Power and ground balls are arranged per Xilinx SP700/SP701 layout guidelines to minimize noise and support simultaneous switching.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for CLBs, interconnect, and configuration logic; requires low-noise decoupling |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration, JTAG, and certain I/O banks; shared with transceivers if present |
| VCCO_0 | I/O bank 0 power | Programmable 1.2–3.3 V supply for bank-specific I/O standards; sets voltage for all pins in bank 0 |
| M0/M1/M2 | Mode configuration pins | Determine boot source (SPI, BPI, JTAG) and configuration mode at power-up |
| CCLK | Configuration clock | Output-only clock during master SPI configuration; not used in JTAG or processor-initiated modes |
| PROGRAM_B | Global reset input | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale-inspired architecture | Enables higher logic density and routing efficiency vs. Spartan-6, reducing area for equivalent functions |
| SelectIO technology | Supports mixed-voltage I/O on single device - e.g., 1.8 V sensors and 3.3 V microcontrollers interfaced simultaneously |
| Integrated configuration memory | Reduces BOM count by eliminating external configuration PROM in many designs |
| Industrial temperature qualification | Validated for continuous operation at +100°C junction temperature - suitable for sealed enclosures without active cooling |
| Low static power | Typical 15 mW static power at 85°C - extends thermal margin in space-constrained industrial modules |
Applications
| Industrial PLC I/O Module | Motor Drive Control Unit |
|---|---|
Use Scenario: Real-time digital I/O expansion with fieldbus interface (e.g., CANopen, Modbus TCP) and diagnostics. IC Role / Device Role / Timing Role: FPGA acts as protocol bridge and deterministic logic sequencer between microcontroller and isolated I/O channels. Use Value: 200 user I/Os enable direct connection to 32-channel digital input/output banks; -1 speed grade ensures <200 ns logic path timing for safety-critical response. | Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase PMSM motors with encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA implements high-frequency PWM modulators, encoder interpolation, and current sampling synchronization. Use Value: 120 DSP slices execute FOC math at 20 kHz loop rate; 1.2 V core reduces thermal load in compact drive housings. |
| Medical Imaging Front-End | Test & Measurement Signal Generator |
Use Scenario: Time-of-flight ultrasound beamforming with channel calibration and echo digitization control. IC Role / Device Role / Timing Role: FPGA manages ADC/DAC timing, channel delay alignment, and real-time FIR filtering before data transfer to ARM host. Use Value: Block RAM provides 1.8 Mb local buffer for 128-channel echo data; industrial temp rating supports sterilizable enclosure environments. | Use Scenario: Arbitrary waveform generation with jitter-free clock synthesis and pattern sequencing. IC Role / Device Role / Timing Role: FPGA generates precise trigger edges, controls DAC update timing, and sequences stimulus patterns via parallel I/O. Use Value: SelectIO supports 3.3 V LVCMOS pattern outputs synchronized to internal 450 MHz clock; CSP package minimizes board space in portable testers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7S15-1CSGA225I | 15K logic cells, 145 user I/Os, smaller 225-ball CSP package | Limited for multi-protocol consolidation or large state machines | Choose when design fits within 15K LUTs and requires lower cost or smaller footprint |
| XC7S50-1CSGA324C | 50K logic cells, same 324-ball package, commercial temp range (0°C to +85°C) | Not rated for industrial ambient or extended thermal cycling | Choose only for non-industrial environments where higher logic density justifies loss of extended temperature support |
Compared with XC7S25-1CSGA324I, XC7S15-1CSGA225I trades logic and I/O headroom for cost and size reduction, while XC7S50-1CSGA324C offers scalability at the expense of industrial temperature qualification - making XC7S25-1CSGA324I the balanced choice for thermally demanding embedded control.
Availability
XC7S25-1CSGA324I is available at Aetrix Electronics and suitable for industrial automation, motor control, medical imaging front-ends, and test equipment requiring stable component supply across long production lifecycles.
Supply support for XC7S25-1CSGA324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools.
The Spartan-7 family, including XC7S25-1CSGA324I, was designed for cost-sensitive, power-efficient, industrial-grade embedded applications requiring reliability and long-term availability.
FAQ
What is the maximum operating junction temperature for XC7S25-1CSGA324I?
The XC7S25-1CSGA324I is rated for industrial temperature operation with a maximum junction temperature of +100°C. This specification is validated per Xilinx DS191 and applies under specified thermal conditions using recommended PCB layout and airflow. The XC7S25-1CSGA324I maintains timing compliance and configuration integrity up to this limit.
Does XC7S25-1CSGA324I support JTAG boundary-scan testing?
Yes, XC7S25-1CSGA324I fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing. The TAP controller is accessible via dedicated TCK, TMS, TDI, and TDO pins, and supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions. This capability is documented in the XC7S25-1CSGA324I Configuration User Guide (UG470).
Can XC7S25-1CSGA324I be configured using an external microcontroller?
Yes, XC7S25-1CSGA324I supports processor configuration mode (Slave Parallel or Slave SelectMAP) where an external microcontroller writes configuration data to the FPGA's configuration pins. This method requires proper handshaking via INIT_B and DONE signals and is supported in the XC7S25-1CSGA324I configuration documentation.
What I/O standards are supported on XC7S25-1CSGA324I bank 1?
XC7S25-1CSGA324I bank 1 supports LVCMOS, LVDS, BLVDS, and RSDS I/O standards, subject to VCCO_1 voltage setting (1.2 V to 3.3 V). Differential standards require adjacent pin pairing and termination matching. Full compatibility is defined in the XC7S25-1CSGA324I SelectIO Resources User Guide (UG471).
Is there integrated flash memory inside XC7S25-1CSGA324I for configuration storage?
No, XC7S25-1CSGA324I does not contain integrated non-volatile configuration memory. It relies on external configuration devices (e.g., SPI Flash) or processor-controlled loading. However, it includes integrated configuration logic and fallback support - the XC7S25-1CSGA324I can manage dual-image updates and error recovery when paired with appropriate external memory.
XC7S25-1CSGA324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1825
- Number of Logic Elements/Cells:
- 23360
- Total RAM Bits:
- 1658880
- Number of I/O:
- 150
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSGA (15x15)
XC7S25-1CSGA324I FAQ
1.How can I place an order for XC7S25-1CSGA324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S25-1CSGA324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S25-1CSGA324I reliable?
The price and inventory of XC7S25-1CSGA324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S25-1CSGA324I is usually 5 days.
3.What payment methods are accepted for XC7S25-1CSGA324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S25-1CSGA324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S25-1CSGA324I?
XC7S25-1CSGA324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S25-1CSGA324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S25-1CSGA324I?
For technical support, including XC7S25-1CSGA324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S25-1CSGA324I requirements.
6.How does Aetrix verify that XC7S25-1CSGA324I is sourced from the original manufacturer or authorized distributors?
All XC7S25-1CSGA324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S25-1CSGA324I meets industry standards.
7.What is the process for return or replacement of XC7S25-1CSGA324I?
All XC7S25-1CSGA324I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S25-1CSGA324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S25-1CSGA324I part is unused and in its original packaging.
Return procedure for XC7S25-1CSGA324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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