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AMD XC7S25-2CSGA225I

Part No.:
XC7S25-2CSGA225I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
225-LFBGA, CSPBGA
Datasheet:
AetrixXC7S25-2CSGA225I.pdf
Description:
IC FPGA 150 I/O 225CSGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:750

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Product details

Overview

XC7S25-2CSGA225I from AMD is a Spartan-7 FPGA with 25K logic cells, 1.2V core voltage, -2 speed grade, and 225-ball CSGA (Chip Scale Grid Array) package. It integrates Block RAM, DSP slices, and I/O banks supporting LVCMOS, LVDS, and SSTL standards for embedded control and industrial interface applications.

For engineers reviewing the XC7S25-2CSGA225I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O voltage flexibility, thermal performance in compact CSGA packaging, and support for Xilinx Vivado design tools.

Technical Context

The XC7S25-2CSGA225I implements a 28 nm high-performance low-power (HPLP) process architecture with configurable logic blocks (CLBs), 18 Kb block RAM, and 120 DSP48E1 slices. It supports up to 210 user I/Os across 10 I/O banks with programmable drive strength and slew rate control.

Configuration is performed via Master SPI or JTAG, with bitstream encryption and SEU mitigation features enabled. The device operates over industrial temperature range (–40°C to +100°C) and meets Xilinx's Spartan-7 family specifications for power efficiency and system integration.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells25,850 LUTs usable for combinatorial and sequential logic implementation
Block RAM1,800 Kb total distributed across 90 × 20 Kb blocks for data buffering and FIFOs
DSP Slices120 DSP48E1 units supporting 25 × 18-bit multiply-accumulate operations per cycle
User I/Os210 pins with bank-specific voltage support (1.2V–3.3V) and programmable termination
Speed Grade-2 grade specifying maximum clock frequency of 540 MHz for internal logic paths
Operating TempIndustrial range: –40°C to +100°C ambient, enabling deployment in harsh environments
Package225-ball CSGA, 11 mm × 11 mm, 0.5 mm pitch, RoHS-compliant

Pinout & Package

XC7S25-2CSGA225I uses a 225-ball Chip Scale Grid Array (CSGA) package with 11 × 11 ball layout, 0.5 mm pitch, and exposed thermal pad. Ball assignment follows Xilinx Spartan-7 standard pinout definition for this package variant.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCO_0I/O bank 0 supply voltage (configurable 1.2V–3.3V)
A2VCCINT1.2V core logic supply, requires tight regulation ±3%
K1M0Configuration mode select (Master SPI boot)
P1TCKJTAG test clock input for boundary scan and programming
R2INIT_BOpen-drain status output indicating configuration completion or error
U1PROGRAM_BActive-low input to reset and reinitiate configuration sequence

Key Features

FeatureDesign Value
UltraScale-inspired CLB architectureEnables higher logic density and routing efficiency vs. prior Spartan families
Integrated XADC12-bit 1 MSPS analog-to-digital converter with on-chip temperature/voltage sensors
SEU mitigationConfigurable CRC checking and automatic partial reconfiguration recovery
Multi-voltage I/O banksSupports mixed-signal interfacing without level shifters (e.g., 1.8V FPGA ↔ 3.3V sensor)
Bitstream encryptionAES-256 encryption protects IP during SPI flash loading

Applications

Industrial PLC I/O ModuleAutomotive ADAS Sensor Hub

Use Scenario: Real-time digital signal conditioning and protocol translation between fieldbus (CAN/RS-485) and microcontroller.

IC Role / Device Role / Timing Role: FPGA acts as flexible I/O bridge and deterministic logic controller with sub-microsecond latency.

Use Value: XC7S25-2CSGA225I provides 210 I/Os and multi-voltage support to interface diverse sensors and actuators without external level shifters.

Use Scenario: Aggregating and preprocessing camera, radar, and ultrasonic sensor data before forwarding to SoC.

IC Role / Device Role / Timing Role: XC7S25-2CSGA225I serves as a low-latency sensor fusion preprocessor with parallel pixel stream handling.

Use Value: XC7S25-2CSGA225I delivers 120 DSP slices and 1.8 Mb Block RAM for real-time image histogramming and time-of-flight correlation.

Medical Imaging Front-EndTest & Measurement Equipment

Use Scenario: Digitizing and filtering analog signals from ultrasound transducers or ECG electrodes.

IC Role / Device Role / Timing Role: XC7S25-2CSGA225I implements high-precision digital down-conversion and FIR filtering pipelines.

Use Value: XC7S25-2CSGA225I integrates XADC and DSP48E1 slices to replace discrete ADC+FPGA+DSP combinations in portable devices.

Use Scenario: Generating precise stimulus waveforms and capturing response data in automated test systems.

IC Role / Device Role / Timing Role: XC7S25-2CSGA225I functions as a deterministic pattern generator and high-speed digital capture engine.

Use Value: XC7S25-2CSGA225I supports 540 MHz internal clocks and 210 user I/Os to synchronize multi-channel DIO and analog stimulus timing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic and interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC7S15-2CSGA225I15K logic cells, 60 DSP slices, 150 I/Os - lower capacity and reduced memory bandwidthSuitable for cost-sensitive, lower-bandwidth control tasks onlySelect when logic and I/O requirements are ≤60% of XC7S25-2CSGA225I's capability
XC7S50-2CSGA225I50K logic cells, 240 DSP slices, 250 I/Os - higher capacity but larger die and power drawRequired for complex video processing or multi-protocol bridgingChoose when XC7S25-2CSGA225I lacks sufficient resources for full design implementation

Compared with XC7S15-2CSGA225I and XC7S50-2CSGA225I, the XC7S25-2CSGA225I balances logic density, I/O count, and thermal profile for mid-tier industrial and automotive edge nodes where board space and power are constrained but scalability matters.

Availability

XC7S25-2CSGA225I is available at Aetrix Electronics and suitable for industrial automation, automotive sensor interfaces, and medical diagnostics equipment requiring stable component supply and long-term manufacturability.

Supply support for XC7S25-2CSGA225I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Spartan-7 family, including XC7S25-2CSGA225I, was designed for cost-optimized, power-efficient, and thermally constrained industrial and automotive applications demanding reliable logic programmability and mixed-signal integration.

FAQ

What is the maximum operating junction temperature for XC7S25-2CSGA225I?

The XC7S25-2CSGA225I has a maximum junction temperature of +125°C. Its industrial temperature grade (–40°C to +100°C ambient) and CSGA package with thermal pad enable reliable operation under sustained load in enclosed enclosures. Thermal design must account for power dissipation across logic, I/O, and DSP resources during worst-case usage of XC7S25-2CSGA225I.

Does XC7S25-2CSGA225I support JTAG boundary scan testing?

Yes, XC7S25-2CSGA225I fully supports IEEE 1149.1 JTAG boundary scan via dedicated TDI, TDO, TMS, and TCK pins. This enables in-circuit verification, programming, and debug throughout the product lifecycle. The XC7S25-2CSGA225I also supports internal BSCAN primitives for custom test logic integration.

Can XC7S25-2CSGA225I be configured using SPI flash memory?

Yes, XC7S25-2CSGA225I supports Master SPI configuration mode using standard quad-SPI flash devices. Configuration occurs automatically on power-up when M0–M2 pins are set to SPI boot mode. The XC7S25-2CSGA225I supports AES-256 encrypted bitstreams stored in external flash for secure deployment.

What I/O standards are supported by XC7S25-2CSGA225I?

XC7S25-2CSGA225I supports LVCMOS (1.2V–3.3V), LVDS, Mini-LVDS, RSDS, BLVDS, SSTL, HSTL, and differential signaling standards across its 10 I/O banks. Each bank is independently powered, allowing simultaneous operation with multiple voltage domains. This flexibility is integral to the XC7S25-2CSGA225I's role in heterogeneous interface consolidation.

Is XC7S25-2CSGA225I compatible with Xilinx Vivado Design Suite?

Yes, XC7S25-2CSGA225I is fully supported in Xilinx Vivado Design Suite 2018.2 and later versions. Synthesis, implementation, simulation, and bitstream generation workflows are validated for this part. Device-specific constraints, IP integrators, and debugging tools in Vivado are optimized for XC7S25-2CSGA225I's architecture and package.

XC7S25-2CSGA225I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-7
Package/Case:
225-LFBGA, CSPBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
1825
Number of Logic Elements/Cells:
23360
Total RAM Bits:
1658880
Number of I/O:
150
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
225-CSGA (13x13)

XC7S25-2CSGA225I FAQ

1.How can I place an order for XC7S25-2CSGA225I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7S25-2CSGA225I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7S25-2CSGA225I reliable?

The price and inventory of XC7S25-2CSGA225I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S25-2CSGA225I is usually 5 days.

3.What payment methods are accepted for XC7S25-2CSGA225I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S25-2CSGA225I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7S25-2CSGA225I?

XC7S25-2CSGA225I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7S25-2CSGA225I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7S25-2CSGA225I?

For technical support, including XC7S25-2CSGA225I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S25-2CSGA225I requirements.

6.How does Aetrix verify that XC7S25-2CSGA225I is sourced from the original manufacturer or authorized distributors?

All XC7S25-2CSGA225I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S25-2CSGA225I meets industry standards.

7.What is the process for return or replacement of XC7S25-2CSGA225I?

All XC7S25-2CSGA225I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S25-2CSGA225I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7S25-2CSGA225I part is unused and in its original packaging.

Return procedure for XC7S25-2CSGA225I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7S25-2CSGA225I Tags

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  • XC7S25-2CSGA225I Images
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