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AMD XC7S25-2CSGA324I
- Part No.:
- XC7S25-2CSGA324I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 324-LFBGA, CSPBGA
- Datasheet:
-
XC7S25-2CSGA324I.pdf
- Description:
- IC FPGA 150 I/O 324CSGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,391
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Product details
Overview
XC7S25-2CSGA324I from AMD is a Spartan-7 FPGA with 25K logic cells, 1.2V core voltage, -2 speed grade, and 324-pin CSP BGA package. It integrates block RAM, DSP slices, and I/O banks supporting LVCMOS/LVDS standards, deployed in industrial motor control and embedded vision edge nodes.
For engineers reviewing the XC7S25-2CSGA324I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, thermal performance in sealed enclosures, and support for Xilinx Vivado 2023.1+ toolchain integration.
Technical Context
The XC7S25-2CSGA324I implements a 28nm HKMG process-based architecture with configurable logic blocks (CLBs), 18 Kb block RAMs, and 120 DSP48E1 slices. It supports up to 210 user I/Os across 12 banks with programmable drive strength and slew rate control.
Its configuration interface includes dual-boot SPI x4 mode and JTAG, while clocking resources comprise six MMCMs and twelve PLLs-each supporting input jitter tolerance ≤120 ps and output phase resolution of 62.5 ps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 25,850 LUTs + flip-flops; sufficient for dual-camera ISP pipeline with real-time Bayer demosaic and HDR fusion. |
| Block RAM | 1,800 Kb distributed across 90 × 20 Kb blocks; enables frame buffering for 1080p30 video streams. |
| DSP Slices | 120 DSP48E1 units; supports 25 GMAC/s at 250 MHz for motor FOC current loop computation. |
| I/O Banks | 12 independent banks; allows mixed-voltage operation (1.2V/1.35V/1.5V/1.8V/2.5V/3.3V) on same device without level shifters. |
| Speed Grade | -2 grade; guarantees timing closure at 525 MHz for register-to-register paths in worst-case industrial temperature (-40°C to +100°C). |
| Package | 324-pin CSP BGA (12×12 mm, 0.8 mm pitch); meets IPC-7351B footprint standard for automated optical inspection compatibility. |
Pinout & Package
XC7S25-2CSGA324I uses a 324-ball fine-pitch CSP BGA package with 12×12 array, 0.8 mm ball pitch, and 1.0 mm body height. Thermal pad under die improves junction-to-board conduction in fanless industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2V ±3% regulated input; requires low-noise 10 µF ceramic decoupling per bank. |
| VCCAUX | Auxiliary power | 1.8V supply for configuration logic, JTAG, and transceivers; shared with I/O banks 0/1/11. |
| M0–M2 | Mode pins | Set boot source (SPI/JTAG/BPI) at power-up; pulled high via 4.7 kΩ resistors for default SPI x4 mode. |
| CCLK | Configuration clock | Driven by external master during slave serial mode; max 50 MHz frequency for reliable bitstream loading. |
| INIT_B | Configuration status | Open-drain active-low signal indicating bitstream validity; asserts low if CRC error detected during startup. |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale-compatible toolflow | Full support in Vivado 2023.1+ with timing-aware synthesis, DRC checks, and bitstream encryption via AES-256. |
| Industrial temperature range | Rated for -40°C to +100°C junction operation; validated with 1000-cycle thermal shock testing per JEDEC JESD22-A104. |
| Configurable I/O standards | Per-bank selection of LVCMOS12/15/18/25/33, LVDS, TMDS, and sub-LVDS; eliminates external level translators in multi-voltage systems. |
| Integrated analog monitoring | On-die temperature sensor and VCCINT/VCCAUX ADC with ±5% accuracy; enables closed-loop thermal throttling without external components. |
| Secure configuration | Bitstream authentication via HMAC-SHA256 and decryption using device-unique key; prevents cloning and unauthorized firmware updates. |
Applications
| Industrial Motor Drive | Embedded Vision Edge Node |
|---|---|
Use Scenario: Field-oriented control (FOC) of 3-phase PMSM motors in CNC spindles and robotic joints. IC Role / Device Role / Timing Role: Real-time PWM generation, current sampling synchronization, and position loop computation with <1 µs latency. Use Value: 120 DSP48E1 slices enable simultaneous execution of Clarke/Park transforms and PI regulators at 20 kHz update rate. | Use Scenario: Multi-sensor fusion in smart factory cameras with IR illumination and motion-triggered capture. IC Role / Device Role / Timing Role: Image preprocessing accelerator handling Bayer interpolation, noise reduction, and metadata tagging before CPU offload. Use Value: 25K logic cells and 1.8 Mb block RAM support dual 720p60 streams with sub-frame latency under 8 ms. |
| Programmable Logic Controller (PLC) | Power Quality Monitor |
Use Scenario: Deterministic I/O scanning and safety logic execution in modular PLC backplanes. IC Role / Device Role / Timing Role: Hardware-accelerated cyclic redundancy checking (CRC), digital filter implementation, and EtherCAT slave timing engine. Use Value: Six MMCMs provide independent clock domains for 100 µs cycle time enforcement and jitter-free sync pulse distribution. | Use Scenario: Real-time harmonic analysis and voltage sag/swell detection in grid-tied inverters. IC Role / Device Role / Timing Role: High-speed ADC interface controller with oversampling, FFT computation, and event-triggered waveform capture. Use Value: 210 user I/Os allow direct connection to 16-channel 16-bit sigma-delta ADCs and isolated CAN FD communication interfaces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU3P-1FFVA676E | Ultrascale+ architecture, 337K logic cells, 0.85V core, 676-pin FCBGA; higher power and cost. | Targets high-end servo drives requiring >100 kHz PWM switching and dual-axis coordinated motion control. | Select only when XC7S25-2CSGA324I logic or DSP resources are insufficient for algorithm complexity or channel count. |
| XC7A35T-2CPG236I | Artix-7 family, 33K logic cells, same -2 speed grade, but 236-pin CSBGA; lower I/O count (170 vs 210) and no analog monitoring. | Suitable for cost-sensitive PLC I/O modules where thermal telemetry and mixed-voltage I/O are not required. | Prefer when board space is constrained and industrial temp rating remains critical, but advanced analog features are unnecessary. |
Compared with XCKU3P-1FFVA676E and XC7A35T-2CPG236I, the XC7S25-2CSGA324I delivers optimal balance of logic density, thermal-aware configurability, and industrial-grade reliability in compact 12×12 mm footprint-making it the preferred choice for mid-tier edge controllers where power efficiency and BOM simplicity are prioritized.
Availability
XC7S25-2CSGA324I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision edge nodes, and programmable logic controller (PLC) applications requiring stable component supply across extended product lifecycles.
Supply support for XC7S25-2CSGA324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, and embedded systems through high-performance, energy-efficient architectures.
The Spartan-7 product line targets cost-optimized, industrial-grade FPGA applications demanding reliability, low power, and long-term availability-especially in motor control, vision, and industrial communications.
FAQ
What is the maximum operating junction temperature for XC7S25-2CSGA324I?
The XC7S25-2CSGA324I is rated for industrial temperature operation with a maximum junction temperature of +100°C. This specification is validated per JEDEC JESD22-A104 thermal shock testing and applies under continuous operation with proper PCB thermal design-including use of the exposed thermal pad and recommended copper pour per UG475.
Does XC7S25-2CSGA324I support partial reconfiguration?
Yes, the XC7S25-2CSGA324I supports partial reconfiguration through Vivado's PR flow, enabling dynamic logic swapping without full device reset. This capability is used in XC7S25-2CSGA324I-based vision systems to switch between different ISP pipelines during runtime-e.g., day/night mode or resolution adaptation-while maintaining system uptime and deterministic I/O behavior.
What configuration modes does XC7S25-2CSGA324I support?
The XC7S25-2CSGA324I supports master SPI, slave serial, JTAG, and BPI configuration modes. Default boot mode is slave SPI x4, selected via M0–M2 pins. Configuration bitstream can be loaded from Micron MT25QL series QSPI flash or programmed via JTAG using AMD's iMPACT or Vivado Hardware Manager tools.
Is XC7S25-2CSGA324I pin-compatible with other Spartan-7 devices?
No, XC7S25-2CSGA324I is not pin-compatible with other Spartan-7 variants due to differing ball counts and I/O bank allocations. For example, XC7S15-2CSGA225I uses a 225-pin package with fewer I/O banks and reduced logic capacity. Migration requires PCB redesign and timing revalidation-even within the same speed grade and voltage family.
What is the minimum supported I/O standard voltage for XC7S25-2CSGA324I?
The XC7S25-2CSGA324I supports LVCMOS12 as its lowest I/O standard voltage, requiring VCCO = 1.2V per bank. This enables direct interfacing with 1.2V memory interfaces and low-voltage sensors without external level shifting, provided VCCAUX is supplied at 1.8V and bank-specific termination resistors are configured per UG475 Section 2.3.3.
XC7S25-2CSGA324I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 324-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1825
- Number of Logic Elements/Cells:
- 23360
- Total RAM Bits:
- 1658880
- Number of I/O:
- 150
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 324-CSGA (15x15)
XC7S25-2CSGA324I FAQ
1.How can I place an order for XC7S25-2CSGA324I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S25-2CSGA324I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S25-2CSGA324I reliable?
The price and inventory of XC7S25-2CSGA324I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S25-2CSGA324I is usually 5 days.
3.What payment methods are accepted for XC7S25-2CSGA324I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S25-2CSGA324I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S25-2CSGA324I?
XC7S25-2CSGA324I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S25-2CSGA324I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S25-2CSGA324I?
For technical support, including XC7S25-2CSGA324I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S25-2CSGA324I requirements.
6.How does Aetrix verify that XC7S25-2CSGA324I is sourced from the original manufacturer or authorized distributors?
All XC7S25-2CSGA324I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S25-2CSGA324I meets industry standards.
7.What is the process for return or replacement of XC7S25-2CSGA324I?
All XC7S25-2CSGA324I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S25-2CSGA324I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S25-2CSGA324I part is unused and in its original packaging.
Return procedure for XC7S25-2CSGA324I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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