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AMD XC7S25-L1FTGB196I
- Part No.:
- XC7S25-L1FTGB196I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 196-LBGA, CSPBGA
- Datasheet:
-
XC7S25-L1FTGB196I.pdf
- Description:
- IC FPGA 100 I/O 196CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:108
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Product details
Overview
XC7S25-L1FTGB196I from AMD is a Spartan-7 FPGA with 23,000 logic cells, 1.2V core voltage, -1 speed grade, and 196-pin FTGBGA package. It integrates block RAM, DSP slices, and I/O banks supporting LVCMOS, LVDS, and SSTL standards for embedded control and industrial interface applications.
For engineers reviewing the XC7S25-L1FTGB196I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O voltage flexibility, thermal performance in extended temperature range, and availability of configuration interfaces (e.g., JTAG, SPI).
Technical Context
The XC7S25-L1FTGB196I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 18 Kb block RAMs, and 18×27 multipliers for arithmetic-intensive tasks. It supports SelectIO™ technology with programmable drive strength and slew rate per bank.
Configuration is performed via Master SPI or JTAG, with support for fallback mode and bitstream encryption. The device operates across –40°C to +100°C junction temperature and requires dedicated configuration power supplies (VCCO, VCCAUX, VCCINT).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 23,000 - usable LUTs + flip-flops for combinational and sequential logic implementation |
| Block RAM | 1,800 Kb - distributed across 90 × 20 Kb blocks for data buffering and FIFOs |
| DSP Slices | 120 - each supports 25×18 signed multiplication and accumulation in one cycle |
| I/O Pins | 145 user-configurable - supports mixed-voltage operation across 12 I/O banks |
| Speed Grade | -1 - specifies maximum operating frequency for timing-critical paths at rated voltage/temperature |
| Operating Temp | –40°C to +100°C - qualified for industrial and extended-temperature embedded systems |
| Core Voltage | 1.2 V ±3% - requires low-noise regulation and decoupling per Xilinx/AMD power guidelines |
Pinout & Package
XC7S25-L1FTGB196I is housed in a 196-ball Fine-Pitch Thin BGA (FTGBGA) package with 0.8 mm pitch, 12 mm × 12 mm body size, and exposed thermal pad. Pin assignment follows AMD Xilinx UG475 v1.14 for Spartan-7 pinout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input requiring local ceramic decoupling |
| K1 | VCCAUX | 1.8 V auxiliary supply for configuration and I/O reference |
| M1 | VCCO_0 | 1.2–3.3 V I/O bank 0 output supply - sets voltage level for associated pins |
| T1 | PROGRAM_B | Active-low asynchronous reset initiating configuration reload from SPI flash |
| R2 | INIT_B | Open-drain status signal indicating configuration memory readiness |
| P3 | CCLK | Configuration clock input during Master SPI mode - driven by FPGA or external source |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale-inspired CLB architecture | Each CLB contains four 6-input LUTs and eight FFs - enables high-density logic mapping with predictable timing |
| SelectIO™ technology | Per-bank I/O voltage control and programmable termination - eliminates external resistors for DDR3/SSTL-15 interfaces |
| Integrated configuration security | Bitstream encryption using AES-256 and HMAC authentication - prevents unauthorized cloning or firmware extraction |
| Thermal management support | Thermal sensor and dedicated THERM trip pin - enables automatic shutdown before junction exceeds 125°C |
| Low static power design | Typical static current < 25 mA at 85°C - reduces heatsink requirements in fanless industrial enclosures |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time digital I/O expansion with deterministic response under cyclic scan execution. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines and parallel I/O controllers synchronized to 10 kHz scan clock. Use Value: XC7S25-L1FTGB196I provides sufficient logic density and I/O count to replace multiple ASICs while supporting hot-swap detection via dedicated I/O banks. | Use Scenario: High-speed pattern generation and response capture for semiconductor device validation. IC Role / Device Role / Timing Role: XC7S25-L1FTGB196I acts as a timing engine and protocol translator between PXIe controller and DUT interface. Use Value: On-chip DSP slices enable real-time pass/fail analysis of captured waveforms without host CPU intervention. |
| Motor Drive Control Board | Medical Imaging Interface |
Use Scenario: Field-oriented control (FOC) execution with PWM generation and current sensing feedback loop closure. IC Role / Device Role / Timing Role: XC7S25-L1FTGB196I hosts FOC algorithm, 3-phase PWM modulator, and ADC interface logic with sub-microsecond latency. Use Value: Integrated block RAM allows dual-port access for concurrent control loop update and telemetry logging at 20 kHz update rate. | Use Scenario: Bridging legacy analog video signals (e.g., PAL/NTSC) to modern digital imaging processors. IC Role / Device Role / Timing Role: XC7S25-L1FTGB196I performs pixel clock domain crossing, line buffering, and chroma/luma separation. Use Value: SelectIO™ support for 1.8 V and 3.3 V I/O enables direct connection to both legacy video DACs and MIPI CSI-2 receivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7S15-L1FTGB196I | 16,000 logic cells, 1,200 Kb block RAM, same package and speed grade | Limited DSP slice count (80 vs. 120) and reduced I/O count (100 vs. 145) | Preferred when cost-sensitive designs require lower gate count and fewer high-speed interfaces |
| XC7S50-L1FTGB196I | 50,000 logic cells, 2,700 Kb block RAM, identical package and speed grade | Higher thermal dissipation (up to 4.2 W vs. 2.8 W) and increased configuration memory footprint | Selected when additional logic resources are needed for multi-protocol bridging or larger control algorithms |
Compared with XC7S25-L1FTGB196I, the XC7S15-L1FTGB196I offers lower cost and power but constrains complex peripheral integration, while the XC7S50-L1FTGB196I enables higher system integration at the expense of thermal management complexity and BOM cost.
Availability
XC7S25-L1FTGB196I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XC7S25-L1FTGB196I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and ACAPs for high-performance embedded and datacenter applications.
The Spartan-7 family, including XC7S25-L1FTGB196I, is designed for cost-sensitive, power-efficient industrial control, vision, and connectivity applications with extended temperature support and integrated configuration security.
FAQ
What is the maximum supported I/O standard for XC7S25-L1FTGB196I?
XC7S25-L1FTGB196I supports LVCMOS (1.2 V to 3.3 V), LVDS, BLVDS, RSDS, and SSTL-15 across its 12 I/O banks. Each bank is independently configurable for voltage and termination, enabling mixed-standard interfaces on a single device without level shifters.
Does XC7S25-L1FTGB196I support JTAG boundary-scan testing?
Yes, XC7S25-L1FTGB196I includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, programming, and debug. Pins TCK, TMS, TDI, TDO, and TRST are dedicated and mapped to package balls G14, H14, J14, K14, and L14 respectively per UG475.
What configuration modes does XC7S25-L1FTGB196I support?
XC7S25-L1FTGB196I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Master SPI is most common for standalone boot from quad-SPI flash; JTAG is used for development and in-system programming.
Is XC7S25-L1FTGB196I qualified for automotive applications?
No, XC7S25-L1FTGB196I is specified for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. For automotive use, AMD recommends the XA Spartan-7 family with explicit automotive qualification and enhanced reliability screening.
How much configuration memory does XC7S25-L1FTGB196I require in Master SPI mode?
In Master SPI mode, XC7S25-L1FTGB196I requires approximately 5.2 Mb of configuration bitstream storage for full configuration. This corresponds to ~650 KB of compressed bitstream when using iMPACT or Vivado tools with default settings.
XC7S25-L1FTGB196I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 196-LBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1825
- Number of Logic Elements/Cells:
- 23360
- Total RAM Bits:
- 1658880
- Number of I/O:
- 100
- Number of Gates:
- -
- Voltage - Supply:
- 0.92V ~ 0.98V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 196-CSBGA (15x15)
XC7S25-L1FTGB196I FAQ
1.How can I place an order for XC7S25-L1FTGB196I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S25-L1FTGB196I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S25-L1FTGB196I reliable?
The price and inventory of XC7S25-L1FTGB196I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S25-L1FTGB196I is usually 5 days.
3.What payment methods are accepted for XC7S25-L1FTGB196I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S25-L1FTGB196I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S25-L1FTGB196I?
XC7S25-L1FTGB196I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S25-L1FTGB196I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S25-L1FTGB196I?
For technical support, including XC7S25-L1FTGB196I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S25-L1FTGB196I requirements.
6.How does Aetrix verify that XC7S25-L1FTGB196I is sourced from the original manufacturer or authorized distributors?
All XC7S25-L1FTGB196I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S25-L1FTGB196I meets industry standards.
7.What is the process for return or replacement of XC7S25-L1FTGB196I?
All XC7S25-L1FTGB196I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S25-L1FTGB196I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S25-L1FTGB196I part is unused and in its original packaging.
Return procedure for XC7S25-L1FTGB196I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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