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AMD XC7S50-1FGA484I

Part No.:
XC7S50-1FGA484I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BGA
Datasheet:
AetrixXC7S50-1FGA484I.pdf
Description:
IC FPGA 250 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:615

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Product details

Overview

XC7S50-1FGA484I from AMD is a Spartan-7 FPGA with 50K logic cells, 2.5 Gbps transceivers, and integrated block RAM, configured in a 484-pin FCBGA package for industrial temperature operation (–40°C to +100°C). It serves as a programmable logic fabric in embedded vision preprocessing pipelines, supporting real-time image filtering and interface bridging between MIPI CSI-2 sensors and ARM-based application processors.

For engineers reviewing the XC7S50-1FGA484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.8V/2.5V/3.3V), total RAM capacity (2.5 Mb), transceiver count (4), and industrial-grade thermal performance.

Technical Context

The XC7S50-1FGA484I implements a synchronous, SRAM-based configurable logic architecture with dedicated DSP slices (180 units), clock management tiles (CMTs) featuring PLLs and MMCMs, and SelectIO technology supporting source-synchronous interfaces up to 1.25 Gbps. It includes hardened PCIe Gen2 x1 endpoint capability and AXI4-compliant interconnect infrastructure.

Configuration occurs via quad-SPI flash or JTAG, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and includes dual-boot capability using external configuration memory.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells50,400 LUTs + flip-flops - provides gate count equivalent to ~250K ASIC gates for medium-complexity control and datapath logic
Block RAM2.5 Mb total - enables on-chip buffering for video line buffers, FIFOs, or firmware storage without external memory
Transceivers4 × 2.5 Gbps GTs - supports MIPI D-PHY, SATA, or custom high-speed serial links with built-in 8b/10b encoding
I/O StandardsSupports LVCMOS, SSTL, HSTL, TMDS, MIPI D-PHY - allows direct interfacing to DDR3, image sensors, and display controllers
Operating Temp–40°C to +100°C - qualified for extended industrial environments including factory automation and outdoor edge nodes
ConfigurationQuad-SPI or JTAG - enables secure, field-upgradable bitstreams with AES-256 decryption and HMAC verification

Pinout & Package

XC7S50-1FGA484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FCBGA) package with 21 mm × 21 mm body size, 0.8 mm ball pitch, and thermal lid. The package supports standard reflow profiles and provides dedicated power/ground ball arrays for noise suppression and signal integrity.

Pin/TerminalCircuit RoleDesign Meaning
M1CONFIG_DONEOpen-drain status output confirming successful configuration loading and initialization completion
P15INIT_BActive-low open-drain signal indicating configuration memory readiness and internal initialization state
R14PROGRAM_BActive-low input that triggers full reconfiguration and clears current configuration memory contents
T12CCLKConfiguration clock input used during master SPI or JTAG programming; drives internal configuration logic timing
Y16VCCO_0I/O bank 0 supply voltage - sets output voltage level and drive strength for pins in Bank 0
U13GNDDedicated ground reference for analog and digital sections - critical for jitter reduction in transceiver lanes

Key Features

FeatureDesign Value
Hardened PCIe Gen2 x1 EndpointReduces integration effort for host-attached acceleration by eliminating soft-core PCIe stack implementation and PHY tuning
Dual-Boot Configuration SupportEnables fail-safe firmware updates and A/B partitioning for zero-downtime field upgrades in mission-critical systems
Integrated AES-256 Bitstream EncryptionProtects intellectual property against reverse engineering and unauthorized cloning of programmable logic functionality
AXI4-Compliant InterconnectProvides plug-and-play connectivity with ARM Cortex-A/M series processors and Xilinx IP cores without protocol translation layers
Partial Reconfiguration CapabilityAllows dynamic logic module swapping during runtime - essential for multi-mode sensor fusion or adaptive signal processing

Applications

Industrial Machine VisionAutomated Test Equipment

Use Scenario: Real-time preprocessing of 1080p@60fps camera streams in robotic guidance systems.

IC Role / Device Role / Timing Role: FPGA fabric performs pixel-level filtering, histogram equalization, and MIPI-to-parallel bridging before CPU ingestion.

Use Value: Offloads 75% of CPU vision workload while maintaining sub-5ms end-to-end latency through deterministic hardware pipelines.

Use Scenario: High-precision stimulus generation and response capture in semiconductor wafer probe stations.

IC Role / Device Role / Timing Role: Serves as pattern generator and comparator engine synchronized to 200 MHz system clock with <150 ps skew across 128 I/Os.

Use Value: Enables parallel test vector execution at 200 Mbps per pin with cycle-accurate timing control and on-chip result aggregation.

Edge AI Inference AcceleratorSecure Industrial Gateway

Use Scenario: Low-latency inference for anomaly detection on vibration sensor data in predictive maintenance gateways.

IC Role / Device Role / Timing Role: Implements quantized CNN accelerator with DMA-controlled weight streaming from external QSPI flash.

Use Value: Delivers 12 GOPS peak throughput at 1.2W, enabling real-time classification without GPU dependency or cloud round-trip delay.

Use Scenario: Protocol translation and secure tunneling between Modbus RTU field devices and TLS-secured MQTT cloud endpoints.

IC Role / Device Role / Timing Role: Performs cryptographic offload (AES-GCM, ECDSA), packet inspection, and dual-interface bridging (RS-485 ↔ Ethernet).

Use Value: Meets IEC 62443-3-3 SL2 requirements with hardware-enforced isolation between untrusted field bus and trusted network domains.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCKU3P-1FFVA676IUltraScale+ architecture, 352K logic cells, 16.3 Gbps transceivers, higher power and costTargeted at high-bandwidth radar processing and 4K video encode - overqualified for mid-tier industrial controlSelect when >100K LUTs, PCIe Gen3, or 10G Ethernet MAC are required; not suitable for cost-sensitive volume deployments
XC7A35T-1CPG236ISpartan-7 family, 35K logic cells, no transceivers, smaller 236-pin CSBGA packageUsed in low-I/O motor control and sensor aggregation where serial link support is unnecessaryChoose for space-constrained designs with <30K LUT needs and no high-speed serial I/O; lacks GT transceivers and PCIe hard IP

Compared with XC7S50-1FGA484I, the XCKU3P-1FFVA676I delivers significantly higher bandwidth and logic density but requires more PCB area, thermal management, and power budget; the XC7A35T-1CPG236I reduces footprint and cost but sacrifices transceiver capability and logic capacity needed for vision or secure gateway use cases.

Availability

XC7S50-1FGA484I is available at Aetrix Electronics and suitable for industrial machine vision, automated test equipment, and edge AI inference acceleration requiring stable component supply across multi-year production cycles.

Supply support for XC7S50-1FGA484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency and heterogeneous integration.

The Spartan-7 product line targets cost-optimized, power-efficient FPGA applications in industrial automation, automotive ADAS front-end processing, and IoT edge nodes where reliability and long-term availability are critical.

FAQ

What is the maximum supported I/O standard voltage for XC7S50-1FGA484I?

XC7S50-1FGA484I supports I/O voltages ranging from 1.2 V to 3.3 V across its 240 user I/O pins, with bank-specific VCCO settings enabling mixed-voltage operation. Each I/O bank can be independently configured for LVCMOS12, LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, SSTL15, or HSTL_I standards, allowing direct interface to DDR3 memory, image sensors, and legacy industrial peripherals without level-shifting circuitry.

Does XC7S50-1FGA484I include hardened PCIe Gen2 support?

Yes, XC7S50-1FGA484I integrates a hardened PCIe Gen2 x1 endpoint block compliant with PCI Express Base Specification Revision 2.1. This includes physical layer (PHY), data link layer, and transaction layer logic, supporting enumeration, memory-mapped I/O, and MSI interrupts. The hard IP eliminates the need for soft-core PCIe implementations and reduces design risk in host-attached acceleration applications.

What configuration modes does XC7S50-1FGA484I support?

XC7S50-1FGA484I supports master SPI, slave SPI, JTAG, and BPI configuration modes. Primary boot uses quad-SPI flash with AES-256 decryption and HMAC authentication. JTAG is used for debugging, boundary scan, and fallback programming. Dual-boot capability allows switching between two independent bitstreams stored in external flash, enabling robust field updates and fail-safe recovery in deployed systems.

Is XC7S50-1FGA484I qualified for industrial temperature operation?

Yes, XC7S50-1FGA484I is rated for industrial temperature range (–40°C to +100°C) and undergoes extended burn-in and thermal cycling validation per JEDEC JESD22-A104. Its FCBGA package and silicon process are qualified for continuous operation in factory automation, outdoor edge nodes, and transportation infrastructure where ambient temperatures exceed commercial grade limits.

How much block RAM is available in XC7S50-1FGA484I?

XC7S50-1FGA484I provides 2.5 Mb of total block RAM distributed across 160 BRAM primitives (each 36 Kb), configurable as true dual-port RAM, single-port RAM, or shift register. This capacity supports frame buffers for 720p video, deep FIFOs for high-speed data acquisition, or on-chip firmware storage - reducing reliance on external memory and improving system determinism.

XC7S50-1FGA484I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-7
Package/Case:
484-BGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
4075
Number of Logic Elements/Cells:
52160
Total RAM Bits:
2764800
Number of I/O:
250
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FPBGA (23x23)

XC7S50-1FGA484I FAQ

1.How can I place an order for XC7S50-1FGA484I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC7S50-1FGA484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC7S50-1FGA484I reliable?

The price and inventory of XC7S50-1FGA484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S50-1FGA484I is usually 5 days.

3.What payment methods are accepted for XC7S50-1FGA484I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S50-1FGA484I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC7S50-1FGA484I?

XC7S50-1FGA484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC7S50-1FGA484I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC7S50-1FGA484I?

For technical support, including XC7S50-1FGA484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S50-1FGA484I requirements.

6.How does Aetrix verify that XC7S50-1FGA484I is sourced from the original manufacturer or authorized distributors?

All XC7S50-1FGA484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S50-1FGA484I meets industry standards.

7.What is the process for return or replacement of XC7S50-1FGA484I?

All XC7S50-1FGA484I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S50-1FGA484I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC7S50-1FGA484I part is unused and in its original packaging.

Return procedure for XC7S50-1FGA484I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC7S50-1FGA484I Tags

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