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AMD XC7S50-1FTGB196I
- Part No.:
- XC7S50-1FTGB196I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 196-LBGA, CSPBGA
- Datasheet:
-
XC7S50-1FTGB196I.pdf
- Description:
- IC FPGA 100 I/O 196CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:552
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Product details
Overview
XC7S50-1FTGB196I from AMD is a Spartan-7 FPGA with 50K logic cells, 2.5 Gbps transceivers, and integrated block RAM, configured in a 196-pin FTGB (Fine-Pitch Thin Quad Flatpack Ball Grid Array) package for high-density I/O routing in industrial control systems.
For engineers reviewing the XC7S50-1FTGB196I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V/1.35 V/1.8 V/3.3 V), configurable logic blocks (CLBs), embedded DSP slices (180), and thermal performance under continuous operation at -40°C to +100°C junction temperature.
Technical Context
The XC7S50-1FTGB196I implements a 28 nm HKMG process architecture with dual-register LUT6 logic, dedicated carry chains, and programmable I/O banks supporting single-ended and differential standards including LVCMOS, LVDS, and TMDS. It includes 240 KB of total block RAM and 180 DSP48E1 slices for arithmetic-intensive tasks.
Configuration is performed via Master SPI or JTAG, with bitstream encryption supported through AES-256 and HMAC-SHA-256. The device supports partial reconfiguration and includes internal clock management with two MMCMs and one PLL for jitter reduction and frequency synthesis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 50,400 – determines maximum combinational and sequential logic capacity for custom digital functions |
| Block RAM | 240 KB – enables on-chip data buffering, FIFOs, and small memory-mapped peripherals without external SRAM |
| DSP Slices | 180 – provides fixed-point multiply-accumulate capability for real-time filtering and motor control algorithms |
| I/O Pins | 150 user-configurable – supports mixed-voltage interfaces across 8 I/O banks with independent VCCO settings |
| Transceiver Speed | 2.5 Gbps – enables PCIe Gen1, Gigabit Ethernet PHY, and high-speed serial links without external retimers |
| Operating Temp | -40°C to +100°C – qualified for extended industrial environments including factory automation and outdoor edge nodes |
Pinout & Package
XC7S50-1FTGB196I is housed in a 196-ball FTGB (Fine-Pitch Thin BGA) package with 1.0 mm ball pitch, 12 × 12 mm body size, and standard JEDEC MO-271AC footprint. Thermal pad exposed on underside improves power dissipation for sustained 1.2 W typical dynamic power.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated balls provide low-inductance return paths for I/O and core domains |
| VCCINT | Core supply | 1.0 V ±3% supply powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration circuitry, clock management, and transceivers |
| VCCO | I/O bank supply | Configurable per-bank (1.2/1.35/1.8/3.3 V) enabling mixed-interface designs |
| M0–M2 | Mode pins | Set boot mode (SPI/JTAG/Slave SelectMAP) at power-up; pulled internally |
| CCLK | Configuration clock | Drives internal configuration shift register during master SPI programming |
Key Features
| Feature | Design Value |
|---|---|
| Integrated AES-256 encryption | Secures bitstream against cloning and reverse engineering in untrusted manufacturing environments |
| Partial reconfiguration support | Enables runtime logic updates without system reset-critical for adaptive control and firmware-over-the-air upgrades |
| Dual MMCM + single PLL | Provides precise clock synthesis, phase alignment, and jitter cleaning for multi-domain timing closure |
| UltraScale-compatible toolchain | Leverages Vivado 2023.1+ for synthesis, place-and-route, and debug-reducing learning curve for migration projects |
| Industrial temperature grade | Validated for continuous operation at 100°C junction temperature-eliminates derating calculations in sealed enclosures |
Applications
| Motor Control System | Industrial Vision Sensor Hub |
|---|---|
Use Scenario: Real-time closed-loop servo drive with field-oriented control (FOC) and encoder feedback processing. IC Role / Device Role / Timing Role: FPGA fabric executes PWM generation, current loop computation, and safety monitoring with sub-μs latency. Use Value: 180 DSP slices enable simultaneous 3-phase FOC math; 150 I/O pins route encoder A/B/Z, analog inputs, and isolated gate drivers. | Use Scenario: Multi-camera synchronization and preprocessing unit in automated optical inspection (AOI) equipment. IC Role / Device Role / Timing Role: XC7S50-1FTGB196I ingests four MIPI CSI-2 streams, performs pixel-level defect detection, and compresses output via on-chip Huffman logic. Use Value: 2.5 Gbps transceivers handle four 1.2 Gbps MIPI lanes; 240 KB block RAM buffers frame data for real-time analysis. |
| Programmable Logic Controller (PLC) | Secure Edge Gateway |
Use Scenario: Modular PLC backplane controller managing up to 32 I/O modules over EtherCAT and PROFINET. IC Role / Device Role / Timing Role: XC7S50-1FTGB196I implements protocol stacks, cyclic redundancy checking, and deterministic I/O scanning in hardware. Use Value: Dual MMCMs lock to 125 MHz EtherCAT master clock while generating 100 MHz PROFINET timing; AES encryption secures firmware updates. | Use Scenario: Field-deployed gateway aggregating Modbus RTU, CAN FD, and LoRaWAN sensor data before TLS-encrypted cloud upload. IC Role / Device Role / Timing Role: FPGA acts as secure protocol bridge-translating legacy industrial protocols into MQTT/JSON with hardware-accelerated crypto. Use Value: On-die AES-256/HMAC-SHA-256 eliminates need for external crypto IC; 50K logic cells host multiple concurrent protocol state machines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based industrial control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU3P-1FFVA676I | UltraScale+ architecture, 352K logic cells, 16.3 Gbps transceivers, higher power and cost | Targeted at high-end vision analytics and 10G Ethernet bridging-not cost-optimized for mid-tier PLCs | Select when >100K logic cells or multi-gigabit SerDes beyond 2.5 Gbps are required |
| XC7A35T-1CPG236I | Spartan-7 family, 35K logic cells, same FTGB package but fewer I/O (100) and no transceivers | Suitable for cost-sensitive I/O expansion or simple logic replacement where serial connectivity is external | Choose if transceiver capability is unnecessary and budget constraints prioritize lower gate count |
Compared with XC7S50-1FTGB196I, XCKU3P-1FFVA676I delivers significantly higher bandwidth and logic density at increased power and BOM cost, while XC7A35T-1CPG236I reduces complexity and cost by omitting transceivers and scaling down resources-making it viable only where serial interface integration is handled externally.
Availability
XC7S50-1FTGB196I is available at Aetrix Electronics and suitable for industrial automation, edge AI inference accelerators, and secure IoT gateway designs requiring stable component supply across multi-year production cycles.
Supply support for XC7S50-1FTGB196I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through high-performance, energy-efficient architectures.
The Spartan-7 product line targets cost-sensitive, power-constrained industrial and automotive applications requiring robust I/O flexibility, security features, and long-term availability-without sacrificing configurability or performance headroom.
FAQ
What is the maximum operating junction temperature for XC7S50-1FTGB196I?
The XC7S50-1FTGB196I is rated for a maximum junction temperature of +100°C under continuous operation, meeting industrial-grade thermal requirements. This specification is validated per JEDEC JESD22-A108 and applies across the full voltage and frequency range specified in the official AMD Spartan-7 DC and AC Switching Characteristics document. Thermal design must ensure adequate PCB copper area and airflow to maintain this limit in sealed enclosures.
Does XC7S50-1FTGB196I support partial reconfiguration?
Yes, XC7S50-1FTGB196I supports partial reconfiguration through Vivado Design Suite 2022.2 and later. This capability allows dynamic swapping of logic modules-such as protocol engines or filter coefficients-without resetting the entire device. Implementation requires proper floorplanning, checkpoint-based flow, and use of the Reconfigurable Partition feature in the Vivado IP Integrator.
What configuration modes are supported by XC7S50-1FTGB196I?
XC7S50-1FTGB196I supports Master SPI, Slave Serial, Slave SelectMAP, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most common for standalone boot from quad-SPI flash; JTAG is used for debugging and programming during development. All modes are documented in the Spartan-7 Configuration User Guide (UG470).
How many transceiver quads does XC7S50-1FTGB196I include?
XC7S50-1FTGB196I includes one GTPE2 transceiver quad, providing four 2.5 Gbps serial lanes. These lanes can be configured as independent channels or bonded for higher-bandwidth protocols like PCIe Gen1 x1 or SATA. No additional transceiver quads are present-the device is not equipped with GTHE2 or GTH transceivers found in higher-tier families.
Is XC7S50-1FTGB196I pin-compatible with other Spartan-7 devices in FTGB packages?
No, XC7S50-1FTGB196I is not pin-compatible with other Spartan-7 FTGB variants such as XC7S25 or XC7S75. While all share the same 196-ball FTGB mechanical footprint, I/O bank assignments, VCCO groupings, and dedicated function pin locations differ across densities. Migration requires PCB redesign and signal integrity revalidation-even within the same package type.
XC7S50-1FTGB196I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 196-LBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 100
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 196-CSBGA (15x15)
XC7S50-1FTGB196I FAQ
1.How can I place an order for XC7S50-1FTGB196I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S50-1FTGB196I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S50-1FTGB196I reliable?
The price and inventory of XC7S50-1FTGB196I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S50-1FTGB196I is usually 5 days.
3.What payment methods are accepted for XC7S50-1FTGB196I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S50-1FTGB196I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S50-1FTGB196I?
XC7S50-1FTGB196I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S50-1FTGB196I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S50-1FTGB196I?
For technical support, including XC7S50-1FTGB196I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S50-1FTGB196I requirements.
6.How does Aetrix verify that XC7S50-1FTGB196I is sourced from the original manufacturer or authorized distributors?
All XC7S50-1FTGB196I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S50-1FTGB196I meets industry standards.
7.What is the process for return or replacement of XC7S50-1FTGB196I?
All XC7S50-1FTGB196I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S50-1FTGB196I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S50-1FTGB196I part is unused and in its original packaging.
Return procedure for XC7S50-1FTGB196I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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