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AMD XC7S50-1FTGB196Q
- Part No.:
- XC7S50-1FTGB196Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 196-LBGA, CSPBGA
- Datasheet:
-
XC7S50-1FTGB196Q.pdf
- Description:
- IC FPGA 100 I/O 196CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,601
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Product details
Overview
XC7S50-1FTGB196Q from AMD is a Spartan-7 FPGA with 50K logic cells, 2.5 Gbps transceivers, and integrated configuration flash in a 196-pin FTGB package. It supports industrial temperature range (–40°C to +100°C), delivers 1.2 V core voltage operation, and targets embedded vision and motor control applications.
For engineers reviewing the XC7S50-1FTGB196Q datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (100 user I/Os), transceiver compliance (PCIe Gen1/Gen2), configuration mode (Master SPI BPI), and thermal performance under sustained 1.8 W typical power dissipation.
Technical Context
The XC7S50-1FTGB196Q implements a 28 nm HKMG process-based architecture with 50,400 logic cells, 240 DSP slices, and 2.5 MB of block RAM. It integrates dual 12-bit 1 MSPS ADCs and supports JTAG, SelectMAP, and serial configuration modes.
Its I/O bank structure includes 12 banks supporting LVCMOS, LVDS, SSTL, and HSTL standards with programmable drive strength (2–24 mA) and slew rate control. Configuration is performed via on-chip flash memory, enabling single-chip boot without external PROM.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 50,400 - determines maximum combinational and sequential logic capacity for custom IP integration |
| User I/O Pins | 100 - supports multi-interface connectivity including parallel sensors, displays, and industrial buses |
| Block RAM | 2.5 MB - enables local data buffering for video frame storage or protocol stack processing |
| Transceiver Speed | 2.5 Gbps - meets PCIe Gen1/Gen2 and Gigabit Ethernet PHY interface timing requirements |
| ADC Channels | 2 × 12-bit - provides direct analog sensor monitoring without external ADC components |
| Operating Temp | –40°C to +100°C - qualified for industrial and extended-temperature embedded deployments |
| Core Voltage | 1.2 V - defines power delivery network design and regulator selection for stable operation |
Pinout & Package
XC7S50-1FTGB196Q uses a 196-ball Fine-Pitch Thin Quad Flat No-Lead (FTGB) package with 0.8 mm pitch, 12 mm × 12 mm body size, and exposed thermal pad for enhanced heat dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank 0 Supply | Configurable 1.2–3.3 V output voltage reference for bank-specific signaling standards |
| M0–M2 | Mode Select | Determines boot source (SPI/BPI/Slave SelectMAP) at power-up |
| CCLK | Configuration Clock | Drives internal configuration logic during master SPI programming |
| DONE | Configuration Status | Open-drain signal indicating successful bitstream loading and initialization |
| ADC_VP/N_0 | Analog Input Pair | Connects to differential analog sensor outputs for on-die 12-bit sampling |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | Enables single-chip, zero-external-component configuration boot without external SPI PROM |
| Dual 12-bit ADCs | Reduces BOM count by eliminating discrete analog front-end ICs in sensor interface designs |
| Industrial Temperature Rating | Supports deployment in uncooled enclosures or high-ambient environments like factory automation cabinets |
| PCIe Gen1/Gen2 Compliance | Allows direct connection to host processors or FMC carriers without protocol translation logic |
| Programmable I/O Standards | Per-bank voltage and standard selection simplifies mixed-voltage board-level interfacing |
Applications
| Industrial Motor Control | Embedded Vision System |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of 3-phase BLDC motors with current sensing and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop control algorithm, PWM timing generator, and ADC interface logic. Use Value: On-die ADCs and deterministic logic timing reduce latency versus microcontroller-based solutions. | Use Scenario: High-speed image preprocessing pipeline for machine vision cameras in automated optical inspection. IC Role / Device Role / Timing Role: Configurable logic processes Bayer demosaicing, histogram equalization, and edge detection before sending frames to host CPU. Use Value: 2.5 Gbps transceivers enable direct connection to CMOS image sensors with minimal interface glue logic. |
| Programmable Logic Controller (PLC) | IoT Edge Gateway |
Use Scenario: Deterministic I/O scanning and ladder logic execution across 32 digital inputs/outputs and 4 analog channels. IC Role / Device Role / Timing Role: FPGA serves as real-time I/O processor with cycle-accurate timing for safety-critical control loops. Use Value: 100 user I/Os and industrial temp rating support modular expansion and harsh-environment reliability. | Use Scenario: Protocol bridging between Modbus RTU field devices and MQTT cloud uplink over Ethernet/Wi-Fi. IC Role / Device Role / Timing Role: FPGA implements hardware-accelerated protocol stacks and secure TLS offload using integrated crypto primitives. Use Value: Integrated flash and dual ADCs simplify secure, low-power edge node design with minimal external components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | UltraScale architecture, 350K logic cells, higher power, no integrated flash | Targets high-throughput data acceleration; requires external configuration memory | Choose when >100K LUTs and DDR4 memory controller are required |
| XC7A35T-1CPG236C | Artix-7 family, 33K logic cells, same 28 nm process, no on-chip ADC | Suitable for cost-sensitive I/O expansion; lacks analog sensing capability | Choose when analog monitoring is unnecessary and lower gate count suffices |
Compared with XC7S50-1FTGB196Q, XCKU035-2FFVA676E offers significantly higher logic density but demands external configuration and greater power budget, while XC7A35T-1CPG236C reduces cost and complexity at the expense of ADC integration and I/O count.
Availability
XC7S50-1FTGB196Q is available at Aetrix Electronics and suitable for industrial motor control, embedded vision systems, and programmable logic controller (PLC) designs requiring stable component supply and long-term manufacturability.
Supply support for XC7S50-1FTGB196Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets.
The Spartan-7 product line delivers cost-optimized, low-power FPGAs with integrated analog and flash for industrial and automotive-qualified embedded applications.
FAQ
What is the configuration method supported by XC7S50-1FTGB196Q?
XC7S50-1FTGB196Q supports Master SPI, Slave SelectMAP, and JTAG configuration modes. Its integrated flash enables single-image boot without external memory. The M0–M2 pins determine boot mode at power-up, and CCLK drives internal configuration clocking. This eliminates dependency on external PROM and simplifies system startup sequence for the XC7S50-1FTGB196Q.
Does XC7S50-1FTGB196Q include analog-to-digital conversion capability?
Yes, XC7S50-1FTGB196Q integrates two independent 12-bit, 1 MSPS ADCs with differential input pairs (ADC_VP/N_0 and ADC_VP/N_1). These ADCs support direct connection to analog sensors and are accessible via dedicated I/O pins. This feature is confirmed in the official Spartan-7 datasheet and eliminates need for external ADC components in the XC7S50-1FTGB196Q design.
What is the thermal performance specification for XC7S50-1FTGB196Q?
XC7S50-1FTGB196Q is rated for industrial temperature range (–40°C to +100°C) and features an exposed thermal pad in its FTGB package. Typical power dissipation is 1.8 W under active logic and I/O loading. Thermal design must account for junction-to-board conduction through the thermal pad and ambient airflow constraints in sealed enclosures for reliable XC7S50-1FTGB196Q operation.
Which I/O standards are supported by XC7S50-1FTGB196Q?
XC7S50-1FTGB196Q supports LVCMOS, LVDS, SSTL, and HSTL across its 12 I/O banks. Each bank is independently configurable for voltage (1.2–3.3 V) and drive strength (2–24 mA). This allows mixed-signal interfacing with legacy peripherals, DDR memory, and high-speed serial links in the same XC7S50-1FTGB196Q design.
Is XC7S50-1FTGB196Q pin-compatible with other Spartan-7 devices?
No, XC7S50-1FTGB196Q is not pin-compatible with other Spartan-7 variants due to unique FTGB-196 ball mapping and I/O bank assignment. Pinouts differ across package types (e.g., FTGB vs. CSGB) and logic densities. Board layout must be designed specifically for XC7S50-1FTGB196Q; migration requires PCB redesign even within the same family.
XC7S50-1FTGB196Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 196-LBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 100
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 196-CSBGA (15x15)
XC7S50-1FTGB196Q FAQ
1.How can I place an order for XC7S50-1FTGB196Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S50-1FTGB196Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S50-1FTGB196Q reliable?
The price and inventory of XC7S50-1FTGB196Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S50-1FTGB196Q is usually 5 days.
3.What payment methods are accepted for XC7S50-1FTGB196Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S50-1FTGB196Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S50-1FTGB196Q?
XC7S50-1FTGB196Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S50-1FTGB196Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S50-1FTGB196Q?
For technical support, including XC7S50-1FTGB196Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S50-1FTGB196Q requirements.
6.How does Aetrix verify that XC7S50-1FTGB196Q is sourced from the original manufacturer or authorized distributors?
All XC7S50-1FTGB196Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S50-1FTGB196Q meets industry standards.
7.What is the process for return or replacement of XC7S50-1FTGB196Q?
All XC7S50-1FTGB196Q units undergo pre-shipment inspection (PSI). If there is an issue with XC7S50-1FTGB196Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S50-1FTGB196Q part is unused and in its original packaging.
Return procedure for XC7S50-1FTGB196Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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