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AMD XC7S50-2FTGB196C
- Part No.:
- XC7S50-2FTGB196C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 196-LBGA, CSPBGA
- Datasheet:
-
XC7S50-2FTGB196C.pdf
- Description:
- IC FPGA 100 I/O 196CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:453
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Product details
Overview
XC7S50-2FTGB196C from AMD is a Spartan-7 FPGA with 50K logic cells, 2.5 Gbps transceiver capability, and -2 speed grade in a 196-pin FTGB package. It integrates block RAM, DSP slices, and I/O banks supporting LVCMOS, SSTL, and HSTL standards for industrial control and embedded vision applications.
For engineers reviewing the XC7S50-2FTGB196C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, transceiver performance, thermal profile, and Xilinx Vivado toolchain support.
Technical Context
The XC7S50-2FTGB196C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 18 Kb block RAMs, and 18×27 multipliers. Its I/O subsystem supports up to 150 user-defined single-ended or differential signals across 12 I/O banks.
This device includes integrated configuration memory, dual-boot capability via SPI flash, and JTAG boundary-scan compliance per IEEE 1149.1. It lacks built-in ARM processors or RF transceivers and requires external configuration PROM for startup.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 50,400 LUTs + flip-flops - determines maximum combinational and sequential logic capacity |
| Block RAM | 2,700 Kb - enables on-chip data buffering and FIFO implementation without external memory |
| DSP Slices | 120 - supports fixed-point MAC operations at up to 450 MHz for filtering or motor control |
| I/O Pins | 150 user I/O - provides interface flexibility across multiple voltage standards and protocols |
| Transceiver Speed | 2.5 Gbps - enables PCIe Gen1, Gigabit Ethernet, or JESD204B link implementation |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade under same conditions |
| Package | FTGB196 - 196-ball fine-pitch BGA, 1.0 mm pitch, 12×12 mm body, RoHS-compliant |
Pinout & Package
XC7S50-2FTGB196C uses a 196-ball ftgb (fine-pitch thin-grooved ball grid array) package with 1.0 mm pitch, 12×12 mm footprint, and thermal pad exposed on underside. Pinout follows Xilinx Spartan-7 family standard layout with dedicated configuration, clock, and power pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage supply - sets logic threshold for all pins in bank 0 |
| K1 | IO_L0P_T0_0 | Differential pair positive input - used for high-speed single-ended or differential signaling |
| M1 | CLKIN1_P | Primary differential clock input - feeds internal PLL for system clock generation |
| T1 | M0 | Configuration mode select - defines boot source (SPI, BPI, or JTAG) |
| R1 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration sequence when asserted |
| A1 | VCCINT | Core logic supply - powers CLBs, interconnect, and configuration logic at 1.0V |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale-compatible toolflow | Full synthesis, place-and-route, and bitstream generation using Xilinx Vivado 2022.2+ without migration effort |
| Dual-boot configuration | Enables field-upgradable firmware via two independent bitstreams stored in SPI flash |
| Integrated analog-to-digital converter | 12-bit XADC with dual 1 MSPS sampling channels for temperature/voltage monitoring |
| Low static power | Typical 25 mW core static power at 85°C - reduces thermal load in fanless industrial enclosures |
| Extended temperature range | Industrial-grade -40°C to +100°C junction operation - qualified for uncontrolled ambient environments |
Applications
| Industrial PLC I/O Module | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time digital I/O expansion with deterministic cycle times in factory automation systems. IC Role / Device Role / Timing Role: FPGA fabric implements custom logic for signal conditioning, protocol translation (Modbus RTU to EtherCAT), and watchdog supervision. Use Value: 150 flexible I/O pins enable mixed-voltage sensor/actuator interfacing; -2 speed grade ensures sub-1 µs logic propagation for hard real-time response. | Use Scenario: On-camera preprocessing of Bayer-pattern image data before transmission to host processor. IC Role / Device Role / Timing Role: XC7S50-2FTGB196C executes pipelined demosaicing, gamma correction, and histogram equalization using DSP slices and block RAM. Use Value: 120 DSP slices deliver 50 GOPS peak throughput; 2.7 Mb block RAM buffers full-frame 1080p@30fps data for latency-critical pipelines. |
| Motor Drive Control Unit | Test Equipment Digital Pattern Generator |
Use Scenario: Closed-loop field-oriented control (FOC) for 3-phase PMSM motors in HVAC and robotics. IC Role / Device Role / Timing Role: FPGA implements PWM generation, current sensing ADC interface, and Clarke/Park transform logic with deterministic timing. Use Value: 50K logic cells accommodate complex FOC algorithm plus safety monitoring; XADC monitors heatsink temperature for thermal derating. | Use Scenario: High-speed digital stimulus generation for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: XC7S50-2FTGB196C generates synchronized multi-channel patterns with precise skew control and jitter < 50 ps. Use Value: 2.5 Gbps transceivers support JESD204B pattern streaming; -2 speed grade guarantees setup/hold timing margins at 400 MHz pattern rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7S25-2FTGB196C | 25K logic cells, 1,350 Kb BRAM, 60 DSP slices - lower density and memory bandwidth | Suitable for simpler control logic or smaller I/O count designs; insufficient for full 1080p preprocessing pipelines | Select when cost sensitivity outweighs need for high-speed transceivers or large on-chip memory |
| XC7A35T-2CPG236C | Artix-7 family, 35K logic cells, same -2 speed grade, but 236-pin CPG package and no integrated XADC | Better DSP efficiency per slice but lacks on-die temperature sensing; requires external ADC for thermal monitoring | Prefer when higher DSP throughput per watt is critical and thermal monitoring is handled externally |
Compared with XC7S50-2FTGB196C, the XC7S25-2FTGB196C reduces logic and memory resources by ~50%, while the XC7A35T-2CPG236C trades integrated analog monitoring for higher DSP utilization efficiency and different packaging - both require PCB redesign due to non-identical pinouts and power delivery requirements.
Availability
XC7S50-2FTGB196C is available at Aetrix Electronics and suitable for industrial automation, embedded vision, motor control, and test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC7S50-2FTGB196C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software toolchains for heterogeneous compute acceleration.
The Spartan-7 product line delivers cost-optimized, low-power FPGA solutions targeting industrial, automotive, and embedded applications where reliability, small form factor, and extended temperature operation are essential.
FAQ
What is the maximum operating junction temperature for XC7S50-2FTGB196C?
The XC7S50-2FTGB196C is rated for industrial temperature operation with a maximum junction temperature of +100°C. This specification is validated per JEDEC JESD22-A104 and applies under continuous operation with appropriate board-level thermal design. The device includes an integrated XADC that monitors die temperature in real time, enabling dynamic thermal throttling in XC7S50-2FTGB196C-based systems.
Does XC7S50-2FTGB196C support PCIe Gen1 endpoint functionality?
Yes, XC7S50-2FTGB196C supports PCIe Gen1 endpoint operation through its 2.5 Gbps transceivers and integrated GTPE2 transceiver primitives. It requires external PHY termination and compliance with PCI-SIG specifications. The XC7S50-2FTGB196C does not include a hard PCIe controller; implementation relies on Xilinx LogiCORE IP configured in Vivado, verified for endpoint use cases in industrial gateways.
Can XC7S50-2FTGB196C be configured via JTAG only, without external flash?
Yes, XC7S50-2FTGB196C supports JTAG-only configuration for development and debugging. In this mode, the bitstream is loaded directly from a host PC via USB-JTAG cable, bypassing external SPI flash. However, for production deployment, XC7S50-2FTGB196C requires external configuration memory (e.g., Micron MT25QL series) to retain configuration after power cycle.
What I/O standards are supported on XC7S50-2FTGB196C bank 14?
XC7S50-2FTGB196C bank 14 supports LVCMOS12, LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, and SSTL15. It does not support HSTL or differential standards in this bank. Voltage selection is controlled by VCCO_14, which must be set to match the selected I/O standard's required VCCO level, as specified in DS191 Table 1-10 for XC7S50-2FTGB196C.
Is XC7S50-2FTGB196C pin-compatible with any other Spartan-7 devices?
No, XC7S50-2FTGB196C is not pin-compatible with other Spartan-7 devices in different packages such as FTGB256 or CSGB196. While logic cell count and feature sets vary across the family, the FTGB196 package has a unique ball map defined in Xilinx UG475. Migration between XC7S50-2FTGB196C and XC7S15-2FTGB196C requires PCB redesign due to differing power and I/O pin allocations.
XC7S50-2FTGB196C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 196-LBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 100
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 196-CSBGA (15x15)
XC7S50-2FTGB196C FAQ
1.How can I place an order for XC7S50-2FTGB196C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S50-2FTGB196C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S50-2FTGB196C reliable?
The price and inventory of XC7S50-2FTGB196C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S50-2FTGB196C is usually 5 days.
3.What payment methods are accepted for XC7S50-2FTGB196C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S50-2FTGB196C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S50-2FTGB196C?
XC7S50-2FTGB196C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S50-2FTGB196C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S50-2FTGB196C?
For technical support, including XC7S50-2FTGB196C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S50-2FTGB196C requirements.
6.How does Aetrix verify that XC7S50-2FTGB196C is sourced from the original manufacturer or authorized distributors?
All XC7S50-2FTGB196C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S50-2FTGB196C meets industry standards.
7.What is the process for return or replacement of XC7S50-2FTGB196C?
All XC7S50-2FTGB196C units undergo pre-shipment inspection (PSI). If there is an issue with XC7S50-2FTGB196C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S50-2FTGB196C part is unused and in its original packaging.
Return procedure for XC7S50-2FTGB196C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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