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AMD XC7S50-2FTGB196I
- Part No.:
- XC7S50-2FTGB196I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 196-LBGA, CSPBGA
- Datasheet:
-
XC7S50-2FTGB196I.pdf
- Description:
- IC FPGA 100 I/O 196CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:316
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Product details
Overview
XC7S50-2FTGB196I from AMD is a Spartan-7 FPGA with 50K logic cells, 2.5 Gbps transceivers, and integrated block RAM, configured in a 196-pin FTGB (Fine-Pitch Thin Quad Flatpack Ball Grid Array) package for high-density I/O routing in industrial control and embedded vision systems.
For engineers reviewing the XC7S50-2FTGB196I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.8V/2.5V/3.3V), -2 speed grade timing closure, thermal performance in extended temperature range (-40°C to +100°C), and configuration via SPIx4 or JTAG.
Technical Context
The XC7S50-2FTGB196I implements a 6-input LUT-based logic fabric with dedicated carry chains and distributed RAM, supporting synchronous design flows with Vivado Design Suite. It integrates 240 DSP48E1 slices for fixed-point arithmetic and supports partial reconfiguration for dynamic function swapping.
Configuration is performed through Master SPI or JTAG modes, with bitstream authentication via AES-256 encryption and HMAC-SHA256 integrity checking. The device includes hardened PCIe Gen2 x1 endpoint logic and supports DDR3L memory interfaces up to 800 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 50,400 LUTs + flip-flops for combinational and sequential logic implementation |
| Block RAM | 2.1 Mb total distributed across 120 BRAM blocks (18 Kb each) |
| DSP Slices | 240 DSP48E1 units supporting 25×18 multiply-accumulate at 450 MHz |
| I/O Standards | Supports LVCMOS, LVDS, TMDS, RSDS, and differential SSTL up to 1.2 Gbps |
| Speed Grade | -2 grade guarantees timing closure at 667 MHz system clock with worst-case process/voltage/temperature |
| Operating Temp | -40°C to +100°C junction temperature for industrial-grade reliability |
| Configuration | Single 32-bit wide SPIx4 interface or IEEE 1149.1 JTAG boundary scan |
Pinout & Package
XC7S50-2FTGB196I is housed in a 196-ball Fine-Pitch Thin BGA (FTGB) package with 0.8 mm ball pitch, designed for thermal dissipation and signal integrity in space-constrained PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated balls for analog/digital power domain separation and noise reduction |
| VCCO_0 | I/O bank supply | Configurable 1.2V–3.3V output driver voltage per bank, enabling mixed-voltage interfacing |
| VCCAUX | Auxiliary supply | 1.8V supply for configuration logic, transceivers, and PLLs |
| M0/M1/M2 | Mode pins | Set boot mode (SPI/JTAG/Slave SelectMAP) at power-up; pulled internally |
| CCLK | Configuration clock | Drives internal configuration shift register during SPI master mode |
| INIT_B | Configuration status | Active-low open-drain signal indicating bitstream loading success or failure |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale-compatible architecture | Enables migration path to higher-density Xilinx/AMD families without RTL rewrite |
| Integrated AES-256 bitstream encryption | Prevents IP theft by blocking unauthorized readback and cloning of configuration data |
| Hardened PCIe Gen2 x1 endpoint | Reduces integration effort for host communication without external bridge IC or soft IP overhead |
| DDR3L memory controller | Supports 16-bit wide interfaces at 800 Mbps with on-die termination calibration |
| Partial reconfiguration support | Allows runtime swapping of logic partitions to adapt functionality without full reset |
Applications
| Industrial PLC I/O Module | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time digital input/output conditioning and protocol translation in modular automation controllers. IC Role / Device Role / Timing Role: FPGA fabric executes deterministic I/O state machines and fieldbus gateways (e.g., EtherCAT slave stack). Use Value: 50K logic cells enable concurrent handling of 32+ isolated digital channels with cycle times under 100 µs. | Use Scenario: On-camera image enhancement before transmission to host processor in smart surveillance cameras. IC Role / Device Role / Timing Role: XC7S50-2FTGB196I performs real-time Bayer demosaicing, gamma correction, and edge sharpening using pipelined DSP slices. Use Value: 240 DSP48E1 slices deliver 120 GOPS peak throughput for 1080p@30fps processing at <50 mW dynamic power. |
| Test Equipment Pattern Generator | Avionics Data Concentrator |
Use Scenario: High-speed digital stimulus generation for semiconductor ATE with precise timing alignment. IC Role / Device Role / Timing Role: XC7S50-2FTGB196I implements multi-channel parallel pattern engines synchronized to a common 200 MHz reference clock. Use Value: -2 speed grade ensures sub-100 ps skew across 128 I/O pins driving LVDS test loads. | Use Scenario: ARINC 429 and MIL-STD-1553B bus aggregation in flight control subsystems. IC Role / Device Role / Timing Role: FPGA serves as deterministic time-triggered gateway between legacy avionics buses and modern Ethernet backbone. Use Value: Extended temperature rating (-40°C to +100°C) meets DO-160 Section 22 Category D environmental requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676I | UltraScale Kintex family, 350K logic cells, 16.3 Gbps GTY transceivers, larger package (676-ball FCBGA) | Higher bandwidth and compute density for radar signal processing or AI inference acceleration | Select when >100K LUTs, PCIe Gen3, or 10G Ethernet MAC are required; not drop-in compatible |
| XC7A35T-2CPG236I | Artix-7 family, 33K logic cells, no hardened PCIe, lower I/O count (170 pins), same -2 speed grade | Cost-sensitive motor control or sensor fusion where PCIe and high-speed transceivers are unnecessary | Choose for simpler designs with tighter BOM cost targets and reduced thermal footprint |
Compared with XC7S50-2FTGB196I, XCKU035-2FFVA676I offers 7× more logic and advanced transceivers but requires board redesign and higher power budget; XC7A35T-2CPG236I reduces logic capacity and removes PCIe while maintaining industrial temp rating and pin-compatible I/O voltage flexibility.
Availability
XC7S50-2FTGB196I is available at Aetrix Electronics and suitable for industrial automation, embedded vision, and avionics data concentrators requiring stable component supply and long-term lifecycle assurance.
Supply support for XC7S50-2FTGB196I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Spartan-7 product line delivers cost-optimized, low-power FPGA platforms targeting industrial control, IoT edge nodes, and embedded vision systems with robust security and extended temperature operation.
FAQ
What is the maximum supported I/O standard voltage for XC7S50-2FTGB196I?
XC7S50-2FTGB196I supports I/O voltages from 1.2 V to 3.3 V across its 12 configurable I/O banks. Each bank operates independently, allowing mixed-voltage interfaces such as 1.8 V LVCMOS for sensors and 3.3 V TTL for legacy peripherals simultaneously on the same device.
Does XC7S50-2FTGB196I include built-in security features for bitstream protection?
Yes, XC7S50-2FTGB196I integrates AES-256 encryption and HMAC-SHA256 authentication for configuration bitstreams. This prevents unauthorized readback, cloning, or modification of the programmed logic, ensuring intellectual property protection in deployed systems.
Can XC7S50-2FTGB196I be used with DDR3L memory interfaces?
Yes, XC7S50-2FTGB196I includes a hardened DDR3L memory controller supporting 16-bit wide interfaces at data rates up to 1600 MT/s. It provides on-die termination calibration and write-leveling to meet JEDEC DDR3L-1066/1333 specifications.
What configuration modes does XC7S50-2FTGB196I support?
XC7S50-2FTGB196I supports Master SPI (x1/x2/x4), JTAG, and Slave SelectMAP modes. Configuration is initiated via M0/M1/M2 pins at power-up, with INIT_B signaling successful bitstream loading or CRC error detection.
Is XC7S50-2FTGB196I qualified for extended temperature operation?
Yes, XC7S50-2FTGB196I is rated for industrial temperature range (-40°C to +100°C junction). Its thermal design and packaging meet requirements for deployment in harsh environments including factory floors, outdoor vision systems, and avionics enclosures.
XC7S50-2FTGB196I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 196-LBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4075
- Number of Logic Elements/Cells:
- 52160
- Total RAM Bits:
- 2764800
- Number of I/O:
- 100
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 196-CSBGA (15x15)
XC7S50-2FTGB196I FAQ
1.How can I place an order for XC7S50-2FTGB196I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S50-2FTGB196I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S50-2FTGB196I reliable?
The price and inventory of XC7S50-2FTGB196I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S50-2FTGB196I is usually 5 days.
3.What payment methods are accepted for XC7S50-2FTGB196I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S50-2FTGB196I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S50-2FTGB196I?
XC7S50-2FTGB196I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S50-2FTGB196I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S50-2FTGB196I?
For technical support, including XC7S50-2FTGB196I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S50-2FTGB196I requirements.
6.How does Aetrix verify that XC7S50-2FTGB196I is sourced from the original manufacturer or authorized distributors?
All XC7S50-2FTGB196I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S50-2FTGB196I meets industry standards.
7.What is the process for return or replacement of XC7S50-2FTGB196I?
All XC7S50-2FTGB196I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S50-2FTGB196I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S50-2FTGB196I part is unused and in its original packaging.
Return procedure for XC7S50-2FTGB196I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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