AMD XC7S50-L1FGGA484I

Overview

XC7S50-L1FGGA484I from AMD is a Spartan-7 FPGA with 50K logic cells, 2.5 Gbps transceivers, and -1 speed grade in a 484-pin FCBGA package, used in industrial motor control, embedded vision preprocessing, and programmable I/O bridging.

For engineers reviewing the XC7S50-L1FGGA484I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (338 user I/O), LVDS support, integrated block RAM (2.4 Mb), and industrial temperature range (-40°C to +100°C).

Technical Context

This device implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 120 DSP slices, and dual 12-bit 1 MSPS ADCs. It supports SelectIO standards including LVCMOS, SSTL, HSTL, and differential signaling up to 1.25 Gbps.

The XC7S50-L1FGGA484I integrates hardened PCIe Gen2 x1 endpoint capability, 256 KB of on-chip boot ROM, and supports JTAG, SPI, and BPI configuration modes. Its -1 speed grade guarantees timing closure at 525 MHz for register-to-register paths.

Key Specifications

Pinout & Package

484-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) with 1.0 mm pitch, 23×23 mm body size, and thermal lid. RoHS-compliant, Pb-free, and moisture sensitivity level 3.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based control and interface applications.

Compared with XC7S50-L1FGGA484I, the XCKU035 offers significantly higher capacity but at increased cost and power, while the XC7A35T sacrifices integrated analog and high-speed I/O-making XC7S50-L1FGGA484I optimal for cost-sensitive industrial edge applications requiring mixed-signal integration.

Availability

XC7S50-L1FGGA484I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision preprocessing, and programmable I/O bridging requiring stable component supply across long-lifecycle deployments.

Supply support for XC7S50-L1FGGA484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.

The Spartan-7 product line targets cost-optimized, power-efficient FPGA implementations for industrial automation, automotive ADAS sensors, and IoT edge devices where reliability and extended temperature operation are critical.

FAQ

What is the maximum operating junction temperature for XC7S50-L1FGGA484I?

The XC7S50-L1FGGA484I has a maximum junction temperature of +125°C and is rated for industrial operation from -40°C to +100°C ambient. Thermal design must ensure junction temperature remains within this limit under worst-case power dissipation, which for XC7S50-L1FGGA484I is typically 3.8 W at full utilization. The FCBGA package includes thermal lid and recommended PCB copper pour to aid heat transfer.

Does XC7S50-L1FGGA484I support partial reconfiguration?

Yes, XC7S50-L1FGGA484I supports partial reconfiguration through Vivado Design Suite v2020.2 and later. This allows dynamic logic module swapping without resetting the entire device. Implementation requires specific floorplanning, checkpoint-based bitstream generation, and use of ICAP or PCIe-based configuration interfaces. Partial reconfiguration is validated for runtime adaptation in motor control loop updates and protocol stack switching.

What configuration modes does XC7S50-L1FGGA484I support?

XC7S50-L1FGGA484I supports four primary configuration modes: Master SPI (using on-chip 256 KB boot ROM), Slave SelectMAP, JTAG boundary scan, and BPI parallel flash. Configuration can be initiated via INIT_B deassertion or external processor command. All modes are supported across industrial temperature range and verified per Xilinx UG470 v1.12 documentation.

Is the integrated ADC in XC7S50-L1FGGA484I calibrated at factory?

Yes, the two 12-bit ADCs in XC7S50-L1FGGA484I undergo full-scale and offset calibration during manufacturing. Each channel achieves ±1 LSB integral nonlinearity (INL) and ±0.5 LSB differential nonlinearity (DNL) across -40°C to +100°C. Calibration coefficients are stored in on-chip eFUSE and automatically applied during power-up, eliminating need for external calibration routines in most industrial sensor applications.

Can XC7S50-L1FGGA484I operate with single 12 V supply?

No, XC7S50-L1FGGA484I requires multiple regulated supplies: 1.0 V core (VCCINT), 1.8 V auxiliary (VCCAUX), 1.2–3.3 V I/O (VCCO), and 1.8 V transceiver (VCCO_MGT). A single 12 V input must be converted using PMIC or discrete DC/DC regulators meeting transient response and ripple specs in Xilinx DS181 v2.5. Failure to meet rail tolerances risks configuration failure or timing violation.