AMD XC7S75-1FGGA484C

Overview

XC7S75-1FGGA484C from AMD is a Spartan-7 FPGA with 74,694 logic cells, 3.2 Gb/s transceiver capability, and 210 I/O pins in a 484-pin FCBGA package. It integrates dual ARM Cortex-A9 MPCore processors, 2.5 MB block RAM, and supports PCIe Gen2 x4 endpoint operation for embedded vision and industrial control applications.

For engineers reviewing the XC7S75-1FGGA484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, transceiver speed, embedded processor presence, block RAM capacity, and PCIe Gen2 endpoint compliance.

Technical Context

The XC7S75-1FGGA484C implements a hard dual-core ARM Cortex-A9 MPCore subsystem with NEON and Jazelle extensions, coupled with programmable logic fabric based on 6-input LUTs and distributed RAM. It includes integrated 24-bit DDR3/DDR3L memory controller supporting up to 800 MHz data rates.

Configuration is performed via quad-SPI or JTAG, with bitstream encryption and HMAC authentication enabled. The device supports partial reconfiguration and includes dedicated clock management tiles with MMCM and PLL blocks for jitter reduction and frequency synthesis.

Key Specifications

Pinout & Package

XC7S75-1FGGA484C is housed in a 22×22 mm, 0.8 mm pitch, 484-ball Fine-Pitch Chip Array Ball Grid Array (FCBGA) package with exposed thermal pad. Pin functions are organized into I/O banks, configuration banks, power/ground rings, and dedicated transceiver/power management balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XCKU035-2FFVA676E and ZU2EG-1SBVA484I, the XC7S75-1FGGA484C delivers balanced PL capacity and integrated dual-core ARM processing in a cost-optimized, thermally efficient package-ideal for deterministic real-time embedded systems where Gen2 PCIe and DDR3 bandwidth meet requirements without over-provisioning.

Availability

XC7S75-1FGGA484C is available at Aetrix Electronics and suitable for industrial machine vision, automated test equipment, and medical imaging interface designs requiring stable component supply and long-term manufacturing continuity.

Supply support for XC7S75-1FGGA484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency and heterogeneous integration.

The Spartan-7 family targets cost-sensitive, power-efficient embedded applications requiring reliable I/O expansion, real-time processing, and integrated processor subsystems-especially in industrial automation and vision systems.

FAQ

What is the maximum supported DDR3 data rate for XC7S75-1FGGA484C?

The XC7S75-1FGGA484C integrates a hard memory controller supporting DDR3 and DDR3L SDRAM up to 800 MHz data rate (1600 MT/s). This is validated across commercial temperature range and requires adherence to board layout guidelines for signal integrity and termination.

Does XC7S75-1FGGA484C support partial reconfiguration?

Yes, XC7S75-1FGGA484C supports partial reconfiguration through its configuration logic interface (ICAP) and hierarchical design flow. This enables dynamic updates of specific PL regions during operation without resetting the ARM processor subsystem or disrupting active I/O functions.

What transceiver protocols are natively supported by XC7S75-1FGGA484C?

XC7S75-1FGGA484C supports native physical layer implementation of JESD204B subclass 1, CPRI v6.1, and Camera Link HS via its GTY transceivers. Protocol stacks above PHY layer require soft IP or vendor-provided IP cores.

Is bitstream encryption enabled by default on XC7S75-1FGGA484C?

No, bitstream encryption must be explicitly enabled during bitstream generation using AMD Vivado tools with appropriate keys. Once programmed, the XC7S75-1FGGA484C enforces AES-256 decryption and HMAC integrity checking on every configuration load.

What is the thermal pad requirement for XC7S75-1FGGA484C's FCBGA package?

The XC7S75-1FGGA484C FCBGA package requires a soldered thermal pad connected to an internal PCB ground plane via ≥6 thermal vias (0.3 mm diameter, spaced ≤2 mm apart) under the die area. Thermal relief design must comply with AMD Xilinx UG475 and XPE power estimation guidelines.