AMD XC7S75-1FGGA484I

Overview

XC7S75-1FGGA484I from AMD is a Spartan-7 FPGA with 74,694 logic cells, 360 DSP slices, 4.9 Mb of block RAM, and 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) packaging. It operates at -40°C to +100°C junction temperature and supports SelectIO™ standards up to 1.8 V.

For engineers reviewing the XC7S75-1FGGA484I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O voltage flexibility, thermal rating for industrial environments, and availability of hardened PCIe Gen2 endpoints in the Spartan-7 family.

Technical Context

The XC7S75-1FGGA484I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry chains. It integrates dual 12-bit, 1 MSPS ADCs and supports JTAG, SPI, and SelectMAP configuration modes.

It includes 24 transceivers capable of 6.6 Gb/s line rates, supports DDR3/DDR3L memory interfaces up to 800 MHz, and features integrated clock management with MMCM and PLL blocks for low-jitter frequency synthesis and phase alignment.

Key Specifications

Pinout & Package

XC7S75-1FGGA484I uses a 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 23 mm × 23 mm body size, 0.8 mm ball pitch, and standard thermal pad layout per AMD Xilinx documentation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XC7S75-1FGGA484I, the XC7S50-1FGGA484I trades logic and DSP resources for lower cost and power, while the XC7A75T-1FGG484I shifts emphasis to serial bandwidth and memory interface capability at the expense of on-die analog integration.

Availability

XC7S75-1FGGA484I is available at Aetrix Electronics and suitable for industrial motor control, video surveillance edge nodes, test & measurement equipment, and avionics data acquisition units requiring stable component supply across extended temperature ranges.

Supply support for XC7S75-1FGGA484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (acquired Xilinx in 2022) designs adaptive computing platforms for AI, data center, and embedded systems, with leadership in FPGA, adaptive SoC, and ACAP technologies.

The Spartan-7 product line targets cost-optimized, high-reliability industrial and automotive applications, emphasizing low power, extended temperature operation, and integrated analog functions for sensor-rich edge systems.

FAQ

What is the maximum supported DDR3 memory speed for XC7S75-1FGGA484I?

The XC7S75-1FGGA484I supports DDR3/DDR3L memory interfaces up to 800 MHz data rate (400 MHz clock frequency) with programmable read/write leveling and write-leveling calibration. This capability is implemented via dedicated memory controller logic and I/O banks configured for SSTL15 I/O standard. The XC7S75-1FGGA484I datasheet specifies timing parameters compliant with JEDEC DDR3-1600 profiles under industrial temperature conditions.

Does XC7S75-1FGGA484I include a hard PCIe Gen2 endpoint?

Yes, XC7S75-1FGGA484I integrates a hardened PCIe Gen2 endpoint block supporting x1 and x2 link widths with full MAC, transaction layer, and configuration space implementation. It complies with PCI Express Base Specification Revision 2.1 and supports MSI/MSI-X interrupt delivery. The XC7S75-1FGGA484I does not support PCIe Gen3 or root complex functionality.

What configuration modes are supported by XC7S75-1FGGA484I?

XC7S75-1FGGA484I supports Master SPI, Slave SPI, Master BPI, Slave Parallel, and SelectMAP configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstreams can be loaded from external flash (quad-SPI or parallel NOR) or through JTAG boundary-scan. The XC7S75-1FGGA484I also supports fallback configuration and multi-boot with golden image recovery.

Can XC7S75-1FGGA484I operate reliably at 100°C junction temperature?

Yes, XC7S75-1FGGA484I is rated for -40°C to +100°C junction temperature and undergoes qualification testing per JEDEC JESD22-A108. Thermal performance depends on PCB layout, heatsinking, and airflow; the XC7S75-1FGGA484I datasheet provides thermal resistance values (θJA = 12.5°C/W typical) and derating curves for sustained operation at maximum temperature.

How many transceivers does XC7S75-1FGGA484I provide, and what protocols do they support?

XC7S75-1FGGA484I includes 24 GTY transceivers, each capable of 6.6 Gb/s line rates. These support protocols including CPRI, JESD204B, Gigabit Ethernet (1000BASE-X), and Aurora. They do not support PCIe Gen2 native encoding - PCIe functionality is provided exclusively by the hardened endpoint block, not the transceivers.