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AMD XC7S75-1FGGA676C
- Part No.:
- XC7S75-1FGGA676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7S75-1FGGA676C.pdf
- Description:
- IC FPGA 400 I/O 676FPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,435
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Product details
Overview
XC7S75-1FGGA676C from AMD is a Spartan-7 FPGA with 74,945 logic cells, 3.3V I/O voltage support, and -1 speed grade (1.2ns LUT delay), designed for industrial control, motor drive, and embedded vision systems requiring deterministic timing and low power.
For engineers reviewing the XC7S75-1FGGA676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (400 user I/Os), embedded RAM (3.2 Mb block RAM), DSP slice count (220), and thermal performance in the FGG676 package under industrial temperature operation.
Technical Context
The XC7S75-1FGGA676C implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), 6-input LUTs, and distributed RAM. It integrates 220 DSP48E1 slices supporting 25×18-bit multiply-accumulate operations at up to 300 MHz.
It supports SelectIO™ standards including LVCMOS, LVDS, SSTL, and HSTL across 400 user I/O pins, with programmable slew rate and drive strength per bank. Configuration is performed via Quad-SPI, BPI, or JTAG interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,945 - total available LUT-based fabric resources for combinational and sequential logic implementation |
| User I/O Pins | 400 - configurable single-ended and differential I/Os distributed across 12 banks with independent voltage support |
| Block RAM | 3.2 Mb - distributed as 288 × 36 Kb BRAM primitives enabling large FIFOs or data buffers |
| DSP Slices | 220 - hardened 25×18-bit multipliers with pre-adders and accumulators for high-throughput math operations |
| Speed Grade | -1 - guarantees timing closure at 1.2 ns LUT propagation delay under industrial temperature and voltage conditions |
| Operating Temp | 0°C to +85°C - specified junction temperature range for reliable operation in industrial environments |
| I/O Voltage | 1.2V/1.35V/1.5V/1.8V/2.5V/3.3V - per-bank programmable VCCO enabling mixed-voltage interface design |
Pinout & Package
The XC7S75-1FGGA676C is housed in a 676-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free RoHS-compliant construction. Thermal pad on underside enables efficient heat dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated balls provide low-inductance return paths for core and I/O domains |
| VCCINT | Core supply | 1.0V ±3% regulated supply for FPGA fabric and CLBs; requires low-noise decoupling |
| VCCAUX | Auxiliary supply | 1.8V supply for configuration circuitry, clock management, and transceivers (if present) |
| VCCO_0–VCCO_11 | I/O bank supply | Per-bank voltage rails supporting mixed I/O standards; each bank independently configurable |
| M0–M2 | Mode pins | Three-pin strap configuration determining boot source (SPI/BPI/JTAG) and configuration mode |
| CCLK | Configuration clock | Input clock during master SPI or BPI configuration; driven by external source or internal oscillator |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Includes 4 MMCMs and 8 PLLs for precise clock synthesis, phase alignment, and jitter reduction across multiple domains |
| SelectIO Technology | Supports 21 I/O standards with programmable drive strength, slew rate, and on-die termination for signal integrity optimization |
| UltraFast Memory Interface | Hardened DDR3/DDR3L controller supporting up to 800 Mbps data rates with full calibration and training |
| Configurable Logic Block Density | 74,945 logic cells enable mid-range system integration without over-provisioning or cost penalty |
| Industrial Temperature Rating | Qualified for 0°C to +85°C operation, enabling deployment in factory automation and outdoor edge devices |
Applications
| Industrial Motor Control | Embedded Vision Processing |
|---|---|
Use Scenario: Real-time closed-loop servo control with PWM generation, encoder feedback decoding, and safety monitoring. IC Role / Device Role / Timing Role: FPGA fabric executes deterministic control algorithms with sub-microsecond latency; MMCMs generate synchronized PWM and sampling clocks. Use Value: 74,945 logic cells and 220 DSP slices enable simultaneous motion profiling, current loop computation, and functional safety checking. | Use Scenario: On-camera preprocessing of 1080p60 video streams using Bayer demosaicing, noise reduction, and histogram equalization. IC Role / Device Role / Timing Role: XC7S75-1FGGA676C acts as real-time image pipeline accelerator with parallel pixel processing and DDR3 buffer management. Use Value: 3.2 Mb block RAM and UltraFast DDR3 interface allow dual-frame buffering and low-latency frame stitching. |
| Programmable Logic Controller (PLC) | Test & Measurement Equipment |
Use Scenario: Modular I/O expansion module handling analog input, digital I/O, and fieldbus communication (e.g., CAN, RS-485). IC Role / Device Role / Timing Role: Configurable I/O banks interface with diverse sensors and actuators; soft-core microblaze handles protocol stack execution. Use Value: 400 user I/Os and per-bank VCCO support enable direct connection to legacy industrial interfaces without level-shifting components. | Use Scenario: High-precision waveform generation and acquisition in portable oscilloscopes and signal analyzers. IC Role / Device Role / Timing Role: FPGA implements time-interleaved ADC/DAC control, trigger logic, and real-time FFT computation. Use Value: -1 speed grade ensures consistent 1.2 ns LUT timing for sub-nanosecond trigger resolution and deterministic sample alignment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-2FFVA676E | Kintex UltraScale with 352K logic cells, 20nm process, higher power and cost; supports PCIe Gen3 and 16.3 Gb/s transceivers | Targeted at high-bandwidth test equipment and radar processing where XC7S75-1FGGA676C lacks transceiver capability | Select only when >200K logic cells, serial transceivers, or Gen3 PCIe root complex functionality are required |
| XC7A75T-1CSG324C | Artix-7 with same 75K-class logic density but smaller 324-pin CSP package, lower I/O count (210), and no DDR3 memory controller hard IP | Suitable for space-constrained embedded controllers where DDR3 interface is not needed and board area is critical | Prefer when footprint reduction outweighs need for 400 I/Os and integrated DDR3 PHY |
Compared with XC7S75-1FGGA676C, XCKU035-2FFVA676E delivers significantly higher compute density and serial connectivity at increased power and cost, while XC7A75T-1CSG324C trades I/O and memory interface capability for compact packaging-making XC7S75-1FGGA676C optimal for balanced industrial I/O-rich designs.
Availability
XC7S75-1FGGA676C is available at Aetrix Electronics and suitable for industrial motor control, embedded vision systems, and programmable logic controller (PLC) modules requiring stable component supply and long-term industrial temperature support.
Supply support for XC7S75-1FGGA676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets with focus on performance-per-watt efficiency.
The Spartan-7 family targets cost-sensitive, power-efficient industrial and automotive applications where reliability, small form factor, and extended temperature operation are essential design requirements.
FAQ
What is the maximum supported DDR3 data rate for XC7S75-1FGGA676C?
The XC7S75-1FGGA676C integrates a hardened DDR3/DDR3L memory controller supporting up to 800 Mbps per pin (400 MHz clock). This enables dual-rank, 16-bit wide interfaces with full calibration and training sequences implemented in hardware, reducing software overhead and improving system stability in industrial memory subsystems.
Does XC7S75-1FGGA676C support JTAG boundary-scan testing?
Yes, XC7S75-1FGGA676C fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. The TAP controller is accessible via dedicated TDI, TDO, TMS, and TCK pins, and supports device identification, configuration verification, and debug access through Vivado Hardware Manager.
How many MMCMs and PLLs are available in XC7S75-1FGGA676C?
The XC7S75-1FGGA676C contains four Mixed-Mode Clock Managers (MMCMs) and eight Phase-Locked Loops (PLLs). These clocking resources support frequency synthesis, phase shifting, duty-cycle correction, and jitter filtering across multiple clock domains, enabling precise timing control for motor control PWM, camera sensor synchronization, and high-speed I/O interfaces.
What configuration modes does XC7S75-1FGGA676C support?
XC7S75-1FGGA676C supports master SPI, slave SPI, master BPI, slave BPI, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up, allowing flexible boot sources including QSPI flash, parallel NOR flash, or host processor-initiated programming via JTAG or ICAP.
Is XC7S75-1FGGA676C qualified for automotive applications?
No, XC7S75-1FGGA676C is rated for industrial temperature (0°C to +85°C) and is not AEC-Q100 qualified. For automotive use, AMD offers the XA7S75 variant with extended temperature range (-40°C to +125°C) and automotive-grade screening-XC7S75-1FGGA676C must not be used in safety-critical automotive systems without additional qualification.
XC7S75-1FGGA676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6000
- Number of Logic Elements/Cells:
- 76800
- Total RAM Bits:
- 4331520
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FPBGA (27x27)
XC7S75-1FGGA676C FAQ
1.How can I place an order for XC7S75-1FGGA676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S75-1FGGA676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S75-1FGGA676C reliable?
The price and inventory of XC7S75-1FGGA676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S75-1FGGA676C is usually 5 days.
3.What payment methods are accepted for XC7S75-1FGGA676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S75-1FGGA676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S75-1FGGA676C?
XC7S75-1FGGA676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S75-1FGGA676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S75-1FGGA676C?
For technical support, including XC7S75-1FGGA676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S75-1FGGA676C requirements.
6.How does Aetrix verify that XC7S75-1FGGA676C is sourced from the original manufacturer or authorized distributors?
All XC7S75-1FGGA676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S75-1FGGA676C meets industry standards.
7.What is the process for return or replacement of XC7S75-1FGGA676C?
All XC7S75-1FGGA676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7S75-1FGGA676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S75-1FGGA676C part is unused and in its original packaging.
Return procedure for XC7S75-1FGGA676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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