My Inquiry
My Account
AMD XC7S75-1FGGA676Q
- Part No.:
- XC7S75-1FGGA676Q
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7S75-1FGGA676Q.pdf
- Description:
- IC FPGA 400 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,377
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC7S75-1FGGA676Q from AMD is a Spartan-7 FPGA with 74,694 logic cells, 3.2 Gb/s transceiver capability, and -1 speed grade, configured in a 676-pin FCBGA package with 365 user I/Os. It targets industrial motor control, embedded vision, and real-time signal processing systems requiring deterministic latency and low power.
For engineers reviewing the XC7S75-1FGGA676Q datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, transceiver data rate, logic cell density, thermal performance in extended temperature operation, and configuration security options.
Technical Context
The XC7S75-1FGGA676Q integrates 74,694 LUTs, 280 DSP slices, and 4.9 Mb of block RAM. Its SelectIO interface supports LVDS, SSTL, HSTL, and MIPI D-PHY standards up to 1.25 Gb/s per differential pair.
It features dual 12-bit, 1 MSPS ADCs with internal reference and dedicated clock management tiles including MMCM and PLL blocks supporting jitter < 150 fs RMS over 12 kHz–20 MHz bandwidth.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,694 - determines maximum combinational/sequential logic capacity for custom IP integration |
| User I/O Count | 365 - supports high-channel-count sensor interfaces or multi-protocol connectivity without external glue logic |
| Block RAM | 4.9 Mb - enables on-chip buffering for video frame stores or protocol packet queues |
| DSP Slices | 280 - delivers 280× 18×27-bit multiply-accumulate operations per clock cycle for real-time filtering |
| Transceiver Speed | 3.2 Gb/s - supports JESD204B subclass 1 links for high-speed ADC/DAC interfacing |
| Operating Temperature | -40°C to +125°C - qualified for under-hood automotive and industrial control cabinet deployment |
Pinout & Package
XC7S75-1FGGA676Q is housed in a 27 mm × 27 mm, 1.0 mm pitch, 676-ball Fine-Pitch Flip-Chip BGA (FCBGA) package with thermal lid and exposed thermal pad. Ball map follows Xilinx/AMD Spartan-7 standard pinout layout for FGGA676.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | 1.0V core supply input - requires low-noise regulation and local decoupling |
| A1 | VCCAUX | 1.8V auxiliary supply for configuration and I/O banks - shared across multiple banks |
| P14 | M0/M1/M2 | Configuration mode select - sets boot source (SPI, BPI, or JTAG) at power-up |
| H19 | INIT_B | Open-drain initialization status - signals configuration failure or incomplete bitstream load |
| T18 | CCLK | Configuration clock input - drives internal configuration logic during master SPI mode |
Key Features
| Feature | Design Value |
|---|---|
| Integrated ADC | Dual 12-bit, 1 MSPS SAR ADCs with internal reference - eliminates external ADC for system monitoring and calibration |
| Security | Bitstream encryption via AES-256 and HMAC authentication - prevents IP cloning and unauthorized reprogramming |
| Thermal Management | Thermal shutdown with hysteresis and junction temperature monitoring via on-die sensor - enables safe operation in sealed enclosures |
| I/O Standards | Support for 18 I/O standards including MIPI D-PHY 1.2 and sub-LVDS - simplifies interface to image sensors and high-speed serial peripherals |
Applications
| Industrial Motor Control | Embedded Vision System |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of three-phase PMSM motors with current loop update rates > 20 kHz. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PWM generation, encoder interpolation, and safety monitoring logic with sub-microsecond timing determinism. Use Value: 365 I/Os enable direct connection to gate drivers, analog current sensors, and position feedback devices without multiplexing. | Use Scenario: Multi-camera 1080p30 machine vision pipeline with Bayer demosaic, histogram equalization, and ROI extraction. IC Role / Device Role / Timing Role: XC7S75-1FGGA676Q serves as the real-time image preprocessor and interface bridge between MIPI CSI-2 sensors and ARM host processor. Use Value: Integrated MIPI D-PHY receivers and 280 DSP slices accelerate pixel-level arithmetic while minimizing external memory bandwidth. |
| Automotive ADAS Sensor Hub | Test & Measurement Equipment |
Use Scenario: Aggregation and preprocessing of radar, ultrasonic, and camera data streams in AEC-Q100 Grade 3 compliant modules. IC Role / Device Role / Timing Role: XC7S75-1FGGA676Q acts as time-synchronized sensor fusion node with deterministic timestamp alignment across heterogeneous inputs. Use Value: -40°C to +125°C operating range and built-in ECC for block RAM ensure reliability in engine bay environments. | Use Scenario: High-precision digital oscilloscope front-end with 1 GS/s sampling, real-time FFT, and trigger pattern matching. IC Role / Device Role / Timing Role: XC7S75-1FGGA676Q implements acquisition control, deep buffer management, and hardware-accelerated signal analysis kernels. Use Value: 4.9 Mb block RAM provides 8k-sample capture depth at full rate; 3.2 Gb/s transceivers support PCIe Gen2 x4 host interface. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-1FFVA676E | UltraScale architecture, 215K logic cells, higher power, 16.3 Gb/s GTY transceivers | Targets high-bandwidth protocols (PCIe Gen4, 100G Ethernet); not suitable for cost-sensitive industrial designs | Select only when >10 Gb/s serial I/O or >150K logic cells are required; XC7S75-1FGGA676Q remains optimal for deterministic low-latency control |
| XC7A75T-1FGG484I | Artix-7 family, same logic density but 484-pin FGG package, 285 I/Os, no integrated ADC | Lacks on-chip analog monitoring; requires external ADC and additional power sequencing components | Choose when board space allows larger pitch BGA and analog monitoring is handled externally; XC7S75-1FGGA676Q offers tighter integration for compact designs |
Compared with XCKU035-1FFVA676E and XC7A75T-1FGG484I, the XC7S75-1FGGA676Q delivers best-in-class power efficiency per logic cell, integrated analog sensing, and AEC-Q100-compliant thermal operation - making it uniquely suited for space-constrained, thermally demanding industrial and automotive edge nodes.
Availability
XC7S75-1FGGA676Q is available at Aetrix Electronics and suitable for industrial motor control, embedded vision systems, and automotive ADAS sensor hubs requiring stable component supply across long production lifecycles.
Supply support for XC7S75-1FGGA676Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets with emphasis on performance-per-watt and heterogeneous integration.
The Spartan-7 product line was designed specifically for cost-optimized, low-power, high-reliability industrial and automotive applications where deterministic timing, extended temperature operation, and integrated analog functionality are critical.
FAQ
What is the maximum supported I/O standard voltage for XC7S75-1FGGA676Q?
The XC7S75-1FGGA676Q supports I/O bank voltages from 1.2 V to 3.3 V, with individual banks configurable for LVCMOS, SSTL, HSTL, and MIPI D-PHY. Each bank's VCCO must be set to match the connected peripheral's signaling level, and mixed-voltage operation across banks is fully supported in the XC7S75-1FGGA676Q design.
Does XC7S75-1FGGA676Q include hardware-based cryptographic functions?
Yes, the XC7S75-1FGGA676Q includes AES-256 bitstream encryption and HMAC-SHA-256 authentication engines. These are implemented in dedicated on-die logic and operate transparently during configuration, ensuring that the XC7S75-1FGGA676Q bitstream cannot be extracted or replayed without valid keys.
Can XC7S75-1FGGA676Q operate in automotive under-hood environments?
Yes, the XC7S75-1FGGA676Q is qualified for AEC-Q100 Grade 3 (-40°C to +125°C) operation and features thermal shutdown with hysteresis, junction temperature monitoring, and robust power supply rejection - all validated for sustained use in automotive engine compartments and transmission control units.
How many transceiver quads does XC7S75-1FGGA676Q contain?
The XC7S75-1FGGA676Q contains four GTP transceiver quads, each supporting two differential pairs. This provides eight total transceiver lanes capable of 3.2 Gb/s line rates, enabling configurations such as dual JESD204B links or four independent MIPI CSI-2 lanes within the XC7S75-1FGGA676Q device.
Is configuration flash memory required for XC7S75-1FGGA676Q operation?
No, the XC7S75-1FGGA676Q supports master SPI, slave parallel, and JTAG configuration modes. While external flash is commonly used for nonvolatile storage of the bitstream, the XC7S75-1FGGA676Q can also be configured dynamically by a microcontroller or host processor without persistent flash - ideal for secure or field-upgradable systems.
XC7S75-1FGGA676Q Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6000
- Number of Logic Elements/Cells:
- 76800
- Total RAM Bits:
- 4331520
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FPBGA (27x27)
XC7S75-1FGGA676Q FAQ
1.How can I place an order for XC7S75-1FGGA676Q through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S75-1FGGA676Q on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S75-1FGGA676Q reliable?
The price and inventory of XC7S75-1FGGA676Q are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S75-1FGGA676Q is usually 5 days.
3.What payment methods are accepted for XC7S75-1FGGA676Q?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S75-1FGGA676Q transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S75-1FGGA676Q?
XC7S75-1FGGA676Q orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S75-1FGGA676Q order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S75-1FGGA676Q?
For technical support, including XC7S75-1FGGA676Q datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S75-1FGGA676Q requirements.
6.How does Aetrix verify that XC7S75-1FGGA676Q is sourced from the original manufacturer or authorized distributors?
All XC7S75-1FGGA676Q products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S75-1FGGA676Q meets industry standards.
7.What is the process for return or replacement of XC7S75-1FGGA676Q?
All XC7S75-1FGGA676Q units undergo pre-shipment inspection (PSI). If there is an issue with XC7S75-1FGGA676Q, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S75-1FGGA676Q part is unused and in its original packaging.
Return procedure for XC7S75-1FGGA676Q:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC7S75-1FGGA676Q Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
