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AMD XC7S75-2FGGA484I
- Part No.:
- XC7S75-2FGGA484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BGA
- Datasheet:
-
XC7S75-2FGGA484I.pdf
- Description:
- IC FPGA 338 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:413
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Product details
Overview
XC7S75-2FGGA484I from AMD is a Spartan-7 FPGA featuring 75K logic cells, 365 I/Os, and a -2 speed grade in a 484-pin FCBGA package. It integrates Block RAM, DSP slices, and SelectIO resources for high-performance embedded control and real-time signal processing in industrial automation systems.
For engineers reviewing the XC7S75-2FGGA484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic density, thermal performance in sealed enclosures, and support for LVDS and SSTL signaling standards.
Technical Context
The XC7S75-2FGGA484I implements a 28 nm HKMG process architecture with configurable logic blocks (CLBs), 18x25 multiplier DSP slices, and up to 4.9 Mb of total on-chip memory (Block RAM + UltraRAM). It supports JTAG and ICAP configuration interfaces and operates across -40°C to +100°C junction temperature.
It delivers 2.5 Gbps transceiver capability via SelectIO technology, includes integrated clock management (MMCM/PLL), and supports partial reconfiguration for dynamic function switching in safety-critical control loops.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 75,000 - determines maximum combinational and sequential logic capacity for control state machines and data path implementation |
| I/O Count | 365 - supports dense peripheral interfacing including parallel buses, sensor arrays, and multi-protocol communication controllers |
| Speed Grade | -2 - guarantees timing closure at 667 MHz DDR3 interface operation and 450 MHz system clock frequency |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without external thermal derating |
| Package | 484-pin FCBGA (19×19 mm, 0.8 mm pitch) - enables high-density PCB routing and thermal dissipation via solder ball array |
| Config Interface | JTAG + ICAP - allows in-system programming and dynamic partial reconfiguration during runtime |
Pinout & Package
XC7S75-2FGGA484I is housed in a 484-pin Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 19×19 ball arrangement, 0.8 mm pitch, and exposed thermal pad. Pin functions follow Xilinx/AMD Spartan-7 pinout standard for bank-specific voltage domains and differential pair assignments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0V ±3% supply for CLB, DSP, and memory logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 1.8V supply for configuration logic, clock management, and JTAG circuitry |
| VCCO_0 | I/O bank power | Programmable 1.2–3.3V output bank supply enabling mixed-voltage interface with legacy peripherals |
| M0–M2 | Mode pins | Three-pin strap defining boot source (SPI, BPI, or JTAG) and configuration mode at power-up |
| CCLK | Configuration clock | Driven by external master or internal oscillator during bitstream loading; controls data latch timing |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MMCM & PLL | Enables precise clock synthesis and jitter reduction for multi-domain timing (e.g., video pixel clock + ADC sampling clock) |
| SelectIO Technology | Supports 21 I/O standards including LVDS, SSTL-18, HSTL, and MIPI D-PHY input modes for sensor and display interfacing |
| Partial Reconfiguration | Allows dynamic swapping of functional modules (e.g., motor control vs. vision processing) without full device reset or system interruption |
| UltraScale-inspired DSP Slices | Delivers 18×25 signed multiplication with pre-add capability for real-time FIR filtering and PID loop acceleration |
Applications
| Industrial PLC Controller | Machine Vision Preprocessing Unit |
|---|---|
Use Scenario: Real-time motion control and I/O scanning in modular programmable logic controllers with fieldbus co-processing. IC Role / Device Role / Timing Role: Central logic fabric executing ladder logic, motion trajectory generation, and EtherCAT slave protocol stack. Use Value: 75K logic cells enable concurrent execution of safety monitoring, motion profiling, and diagnostics without external microcontroller offload. | Use Scenario: On-camera preprocessing of Bayer-pattern image data before transmission to host processor in smart cameras. IC Role / Device Role / Timing Role: Pixel-level demosaicing, histogram equalization, and ROI cropping using pipelined hardware accelerators. Use Value: SelectIO support for MIPI D-PHY input and 2.5 Gbps serial link throughput reduce latency versus software-based preprocessing. |
| Motor Drive Field-Oriented Control | Test Equipment Digital Pattern Generator |
Use Scenario: Closed-loop vector control of three-phase PMSM motors in servo drives with current sensing and PWM generation. IC Role / Device Role / Timing Role: Real-time current loop computation, space-vector PWM generation, and fault protection logic with sub-100 ns response. Use Value: DSP slices accelerate Clarke/Park transforms and PI regulators, achieving 20 kHz current loop bandwidth within deterministic timing budget. | Use Scenario: High-speed digital stimulus generation for ASIC validation and boundary-scan testing in ATE platforms. IC Role / Device Role / Timing Role: Programmable pattern sequencer with synchronized multi-channel output and variable slew-rate control. Use Value: 365 I/Os and -2 speed grade support 250+ MHz parallel vector rates with precise setup/hold margin across all channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7S50-2FGGA484I | 50K logic cells, same package and speed grade; reduced Block RAM and DSP slice count | Suitable for less complex control tasks with lower algorithmic depth or fewer concurrent peripherals | Select when design fits within 50K LUTs and requires cost optimization without sacrificing thermal or I/O footprint |
| XCKU3P-2FFVA676E | Kintex UltraScale+ device with 355K logic cells, 20G transceivers, and higher power consumption | Targeted at high-bandwidth applications requiring PCIe Gen3, 10G Ethernet, or advanced AI inference acceleration | Choose only if XC7S75-2FGGA484I lacks required serial bandwidth, memory bandwidth, or computational throughput |
Compared with XC7S75-2FGGA484I, the XC7S50-2FGGA484I offers lower cost and power at reduced logic capacity, while the XCKU3P-2FFVA676E provides scalable bandwidth and compute but demands stricter thermal and power delivery design.
Availability
XC7S75-2FGGA484I is available at Aetrix Electronics and suitable for industrial automation, machine vision, and motor control applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XC7S75-2FGGA484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through high-performance, energy-efficient architectures.
The Spartan-7 family targets cost-sensitive, thermally constrained industrial and automotive applications where reliability, small form factor, and single-event upset resilience are critical design requirements.
FAQ
What is the maximum operating junction temperature for XC7S75-2FGGA484I?
The XC7S75-2FGGA484I is rated for a maximum junction temperature of +100°C under continuous operation. This specification is validated per AMD's Spartan-7 qualification standards and applies to designs meeting recommended PCB thermal vias, copper pour, and airflow requirements. The XC7S75-2FGGA484I maintains timing integrity and configuration stability within this range without throttling or functional degradation.
Does XC7S75-2FGGA484I support partial reconfiguration?
Yes, the XC7S75-2FGGA484I supports partial reconfiguration via ICAP and PCIe-based configuration interfaces. This capability allows runtime swapping of logic modules-such as switching between encoder interface and resolver decoding firmware-without resetting the entire device. The XC7S75-2FGGA484I implements dedicated configuration logic and frame-based bitstream partitioning to ensure deterministic reconfiguration latency.
What I/O standards are supported by XC7S75-2FGGA484I?
The XC7S75-2FGGA484I supports 21 I/O standards including LVDS, SSTL-18, HSTL-I, MIPI D-PHY input, and differential HCSL. Each I/O bank is independently configurable for voltage and standard, enabling mixed-signal interfacing-for example, connecting DDR3 memory (SSTL-15) and camera sensors (MIPI D-PHY) simultaneously. The XC7S75-2FGGA484I datasheet specifies drive strength, termination, and slew rate settings per bank.
Is XC7S75-2FGGA484I pin-compatible with other Spartan-7 devices in the FGGA484 package?
No, XC7S75-2FGGA484I is not fully pin-compatible with lower-density Spartan-7 devices in the same FGGA484 package. While mechanical footprint and ball map align, certain I/O banks and configuration pins differ in function assignment and voltage domain constraints. Migration requires review of bank-specific VCCO assignments and I/O standard compatibility. The XC7S75-2FGGA484I pinout must be verified against the target design's signal routing and power delivery plan.
What configuration modes does XC7S75-2FGGA484I support?
The XC7S75-2FGGA484I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes, selected via M0–M2 pin strapping at power-up. It also supports fallback configuration and dual-boot capability using external flash memory. Configuration bitstreams can be loaded via ICAP for partial reconfiguration or updated over PCIe in deployed systems. The XC7S75-2FGGA484I includes built-in CRC checking and secure boot options with AES-256 encryption support.
XC7S75-2FGGA484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 484-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6000
- Number of Logic Elements/Cells:
- 76800
- Total RAM Bits:
- 4331520
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FPBGA (23x23)
XC7S75-2FGGA484I FAQ
1.How can I place an order for XC7S75-2FGGA484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S75-2FGGA484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S75-2FGGA484I reliable?
The price and inventory of XC7S75-2FGGA484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S75-2FGGA484I is usually 5 days.
3.What payment methods are accepted for XC7S75-2FGGA484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S75-2FGGA484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S75-2FGGA484I?
XC7S75-2FGGA484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S75-2FGGA484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S75-2FGGA484I?
For technical support, including XC7S75-2FGGA484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S75-2FGGA484I requirements.
6.How does Aetrix verify that XC7S75-2FGGA484I is sourced from the original manufacturer or authorized distributors?
All XC7S75-2FGGA484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S75-2FGGA484I meets industry standards.
7.What is the process for return or replacement of XC7S75-2FGGA484I?
All XC7S75-2FGGA484I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S75-2FGGA484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S75-2FGGA484I part is unused and in its original packaging.
Return procedure for XC7S75-2FGGA484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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