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AMD XC7S75-2FGGA676C
- Part No.:
- XC7S75-2FGGA676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7S75-2FGGA676C.pdf
- Description:
- IC FPGA 400 I/O 676FPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,446
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Product details
Overview
XC7S75-2FGGA676C from AMD (Xilinx) is a Spartan-7 FPGA with 74,945 logic cells, 3.3V I/O voltage support, -2 speed grade, and 676-pin FCBGA package. It integrates block RAM, DSP slices, and SelectIO interfaces for embedded vision and industrial control applications.
For engineers reviewing the XC7S75-2FGGA676C datasheet, pinout, applications, or equivalent options, key selection factors include logic capacity, I/O count (400 user I/Os), thermal performance (max junction temperature 100°C), and configuration interface compatibility (SPIx4, JTAG).
Technical Context
The XC7S75-2FGGA676C implements a 28nm high-performance low-power (HPLP) architecture with integrated clock management (MMCM and PLL), configurable logic blocks (CLBs), and hardened I/O banks supporting LVCMOS, LVDS, and SSTL standards. It supports partial reconfiguration and AES bitstream encryption.
Configuration is performed via master SPI or JTAG, with fallback support through dual-boot mode. The device includes 480 KB of total block RAM and 240 DSP48E1 slices optimized for arithmetic-intensive tasks such as filtering and FFT computation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,945 - determines maximum combinational/sequential logic density for custom IP integration |
| User I/Os | 400 - supports high-pin-count peripheral interfacing including parallel sensors and memory buses |
| Block RAM | 480 KB - enables on-chip data buffering and FIFO implementation without external memory |
| DSP Slices | 240 - delivers 18×25-bit multiply-accumulate throughput for real-time signal processing |
| Speed Grade | -2 - guarantees timing closure at higher operating frequencies than -1 grade under same conditions |
| Max Junction Temp | 100°C - defines thermal derating limits for continuous operation in industrial ambient environments |
| I/O Voltage | 3.3V - enables direct interfacing with legacy industrial controllers and analog front-ends |
Pinout & Package
XC7S75-2FGGA676C uses a 676-ball Fine-Pitch Flip-Chip BGA (FCBGA) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal dissipation via solder balls and internal thermal slug.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.0V to FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8V to configuration logic, transceivers, and clock management circuits |
| VCCO_0 | I/O bank power | Configurable 1.2–3.3V per bank; sets voltage standard for associated I/O pins |
| M0–M2 | Mode pins | Set configuration mode (e.g., SPIx4, Master BPI, JTAG) at power-up |
| CCLK | Configuration clock | Drives internal configuration logic during SPI or slave serial programming |
| PROGRAM_B | Global reset | Active-low asynchronous reset that clears configuration memory and restarts boot process |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reboot-critical for mission-critical systems requiring uptime |
| AES Bitstream Encryption | Protects intellectual property by decrypting configuration data on-the-fly using 256-bit keys stored in eFUSE |
| Integrated Clock Management | Includes MMCM and PLL for jitter reduction and frequency synthesis across multiple domains (e.g., video pixel clock + system clock) |
| SelectIO Technology | Supports mixed-voltage I/O banks with programmable drive strength, slew rate, and termination-reduces external components |
| UltraScale-Compatible Toolflow | Uses Vivado Design Suite v2023.1+ for synthesis, place-and-route, and bitstream generation-ensures design portability |
Applications
| Industrial Motor Control | Embedded Vision System |
|---|---|
Use Scenario: Real-time closed-loop servo control with multi-axis coordination and safety monitoring. IC Role / Device Role / Timing Role: FPGA fabric executes PID loops, encoder interpolation, and functional safety logic with deterministic sub-microsecond latency. Use Value: 74,945 logic cells and 240 DSP slices enable simultaneous execution of motion control algorithms and fieldbus protocol stacks (e.g., EtherCAT). | Use Scenario: High-speed image preprocessing in smart cameras for factory automation. IC Role / Device Role / Timing Role: Configurable logic processes Bayer demosaicing, histogram equalization, and edge detection before sending frames to host processor. Use Value: 400 user I/Os support parallel CMOS sensor interfaces and DDR3 memory co-processing, reducing frame latency by offloading CPU. |
| Programmable Logic Controller (PLC) | Test & Measurement Equipment |
Use Scenario: Modular I/O expansion with hot-swap capability and deterministic scan cycle timing. IC Role / Device Role / Timing Role: Implements custom I/O interface logic, cyclic redundancy checking, and time-triggered communication scheduling. Use Value: Block RAM and SelectIO flexibility allow seamless integration of analog input modules, digital isolators, and fieldbus PHYs on single PCB. | Use Scenario: High-resolution waveform generation and acquisition in portable oscilloscopes. IC Role / Device Role / Timing Role: Generates precise trigger signals, manages ADC/DAC timing, and performs real-time FFT analysis. Use Value: MMCM-based clock synthesis ensures <1 ps jitter on sampling clocks, meeting 12-bit ENOB requirements at 100 MS/s. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC7S50-2FGGA676C | 52,416 logic cells, 330 user I/Os, 330 KB block RAM - lower density and I/O count | Suitable for cost-sensitive PLC modules with fewer I/O points and simpler motion profiles | Select when design fits within reduced resources and thermal envelope is tighter |
| XC7A75T-2FGG676C | Artix-7 family; 75,050 logic cells but higher static power, no AES encryption, different I/O bank structure | Better suited for high-throughput data path applications where encryption is not required | Choose if Vivado toolchain familiarity exists and security features are secondary to raw DSP throughput |
Compared with XC7S75-2FGGA676C, the XC7S50-2FGGA676C offers lower cost and power at the expense of logic and I/O headroom, while the XC7A75T-2FGG676C trades security and thermal efficiency for broader DSP resource availability and legacy toolchain support.
Availability
XC7S75-2FGGA676C is available at Aetrix Electronics and suitable for industrial motor control, embedded vision systems, and programmable logic controller (PLC) designs requiring stable component supply and long-term production continuity.
Supply support for XC7S75-2FGGA676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD (acquired Xilinx in 2022) is a global semiconductor leader delivering adaptive computing platforms for data center, AI, and embedded applications.
The Spartan-7 product line targets cost-optimized, thermally efficient FPGA solutions for industrial automation, automotive ADAS sensing, and IoT edge devices requiring secure, reliable reconfigurable logic.
FAQ
What is the maximum operating temperature for XC7S75-2FGGA676C?
The XC7S75-2FGGA676C has a maximum junction temperature of 100°C, validated for continuous operation in industrial environments up to 85°C ambient with appropriate PCB thermal design. This rating is specified in the Xilinx DS191 Spartan-7 DC and Switching Characteristics document and applies directly to the XC7S75-2FGGA676C device in its FCGA676 package.
Does XC7S75-2FGGA676C support JTAG configuration?
Yes, XC7S75-2FGGA676C supports JTAG configuration via TCK, TMS, TDI, and TDO pins as defined in IEEE 1149.1. It also supports boundary-scan testing and debug access through the same interface. Configuration mode is selected using M0–M2 pins, and JTAG is enabled when those pins are set to 001.
How many block RAM resources does XC7S75-2FGGA676C provide?
XC7S75-2FGGA676C provides 480 KB of total block RAM, distributed across 216 individual 36 Kb BRAM primitives. Each BRAM can be configured as dual-port memory, shift register, or FIFO, enabling flexible on-chip data storage for buffering, lookup tables, or state machines in the XC7S75-2FGGA676C design.
Is XC7S75-2FGGA676C pin-compatible with other Spartan-7 FPGAs in the FGG676 package?
No, XC7S75-2FGGA676C is not fully pin-compatible with other Spartan-7 devices in the FGG676 package. While ball count and mechanical footprint match, I/O bank assignments, VCCO groupings, and dedicated function pin locations differ between XC7S50, XC7S75, and XC7S100 variants. Pin mapping must be verified per device-specific pinout files.
What configuration modes are supported by XC7S75-2FGGA676C?
XC7S75-2FGGA676C supports master SPI (x1/x2/x4), slave serial, JTAG, and BPI parallel configuration modes. Mode selection is controlled by M0–M2 pins at power-up. SPIx4 is commonly used for fast, secure configuration from flash memory, while JTAG is preferred for development and debugging of the XC7S75-2FGGA676C.
XC7S75-2FGGA676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6000
- Number of Logic Elements/Cells:
- 76800
- Total RAM Bits:
- 4331520
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FPBGA (27x27)
XC7S75-2FGGA676C FAQ
1.How can I place an order for XC7S75-2FGGA676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S75-2FGGA676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S75-2FGGA676C reliable?
The price and inventory of XC7S75-2FGGA676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S75-2FGGA676C is usually 5 days.
3.What payment methods are accepted for XC7S75-2FGGA676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S75-2FGGA676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S75-2FGGA676C?
XC7S75-2FGGA676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S75-2FGGA676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S75-2FGGA676C?
For technical support, including XC7S75-2FGGA676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S75-2FGGA676C requirements.
6.How does Aetrix verify that XC7S75-2FGGA676C is sourced from the original manufacturer or authorized distributors?
All XC7S75-2FGGA676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S75-2FGGA676C meets industry standards.
7.What is the process for return or replacement of XC7S75-2FGGA676C?
All XC7S75-2FGGA676C units undergo pre-shipment inspection (PSI). If there is an issue with XC7S75-2FGGA676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S75-2FGGA676C part is unused and in its original packaging.
Return procedure for XC7S75-2FGGA676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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