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AMD XC7S75-2FGGA676I
- Part No.:
- XC7S75-2FGGA676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC7S75-2FGGA676I.pdf
- Description:
- IC FPGA 400 I/O 676FPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,915
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Product details
Overview
XC7S75-2FGGA676I from AMD is a Spartan-7 FPGA with 74,945 logic cells, 3.3V I/O voltage support, -2 speed grade, and 676-pin FCBGA package. It integrates 360 DSP slices, 4.9 Mb of block RAM, and supports PCIe Gen2 x2 endpoint operation in industrial temperature range (-40°C to +100°C).
For engineers reviewing the XC7S75-2FGGA676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (400 user I/Os), transceiver capability (no integrated transceivers), thermal performance in sealed enclosures, and industrial-grade reliability validation.
Technical Context
The XC7S75-2FGGA676I implements a 28 nm HKMG process-based architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry chains. It supports SelectIO standards including LVCMOS, LVDS, SSTL, and HSTL across banks with independent VCCO and VREF per bank.
Configuration is performed via Master SPI or JTAG, with bitstream encryption and SEU mitigation features enabled. The device lacks integrated high-speed serial transceivers but supports multi-gigabit parallel interfaces up to 1.25 Gbps using source-synchronous techniques.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 74,945 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 400 - supports wide parallel buses, multiple peripheral interfaces, or dense sensor aggregation |
| Block RAM | 4.9 Mb - enables large on-chip data buffering, FIFOs, or lookup table storage without external memory |
| DSP Slices | 360 - accelerates fixed-point math, filtering, FFT, and motor control algorithms |
| Speed Grade | -2 - guarantees timing closure at 667 MHz for internal logic and 1.25 Gbps for source-synchronous I/O |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without forced cooling or derating |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - enables direct interfacing with ADCs, DACs, FPGAs, and microcontrollers |
Pinout & Package
XC7S75-2FGGA676I is housed in a 27 mm × 27 mm, 1.0 mm pitch, 676-ball Fine-Pitch Flip-Chip BGA (FCBGA) package with thermal lid and exposed thermal pad. Ball map follows AMD's standard Spartan-7 FGGA676 footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCINT | 1.0V core supply input requiring low-noise regulation and local decoupling |
| A14, A15 | CONFIG_IO | Primary configuration pins for Master SPI mode; must be pulled appropriately during power-up |
| E20 | PROGRAM_B | Active-low asynchronous reset that reloads configuration from flash or reinitializes JTAG chain |
| H19 | DONE | Open-drain status output indicating successful configuration completion |
| K17 | INIT_B | Open-drain output signaling configuration controller readiness or error state |
| M18 | GND | System ground reference for analog and digital sections; tied to thermal pad for heat dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Industrial Temperature Rating | Qualified from –40°C to +100°C ambient, enabling deployment in unventilated control cabinets and outdoor enclosures |
| SEU Mitigation | Configurable soft-error detection and correction for CLB and block RAM, reducing system-level fault injection risk |
| Bitstream Encryption | AES-256 encryption with battery-backed key storage prevents unauthorized configuration cloning or IP theft |
| SelectIO Flexibility | Per-bank VCCO and VREF allow mixed-voltage I/O (1.2V–3.3V) on same device without level shifters |
| UltraFast+ Architecture | Dedicated carry chains and distributed RAM improve arithmetic throughput and reduce routing congestion in control logic |
Applications
| Motor Control System | Industrial Vision Sensor Hub |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) for servo drives with dual-axis synchronization and current loop update rates >20 kHz. IC Role / Device Role / Timing Role: FPGA fabric executes PWM generation, encoder interpolation, and closed-loop computation with deterministic sub-microsecond latency. Use Value: 360 DSP slices and 74,945 logic cells enable simultaneous execution of dual-axis FOC, safety monitoring, and EtherCAT slave stack. | Use Scenario: Aggregation and preprocessing of 4× MIPI CSI-2 camera streams feeding an embedded vision processor. IC Role / Device Role / Timing Role: Parallel pixel alignment, Bayer demosaicing, and ROI cropping before transmission over PCIe Gen2 x2 to host CPU. Use Value: 400 user I/Os support full-width MIPI lanes; 4.9 Mb block RAM buffers frame data for real-time image processing. |
| Programmable Logic Controller (PLC) | Test & Measurement Front-End |
Use Scenario: Modular PLC base unit supporting hot-swappable I/O modules with deterministic cyclic I/O scanning at 1 ms intervals. IC Role / Device Role / Timing Role: Configurable logic implements cyclic scan engine, safety watchdog, and protocol offload (PROFINET RT, EtherNet/IP). Use Value: Industrial temp rating and SEU mitigation ensure reliable operation in factory-floor EMI environments over 10+ years. | Use Scenario: High-precision signal conditioning and time-stamping of analog inputs sampled at 10 MS/s with ±1 LSB INL. IC Role / Device Role / Timing Role: FPGA synchronizes ADC sampling clocks, applies digital calibration coefficients, and formats data for USB 3.0 or PCIe transfer. Use Value: SelectIO flexibility interfaces directly with 1.8V ADCs and 3.3V USB PHYs; -2 speed grade ensures setup/hold timing margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU3P-1FFVA676E | Higher logic density (356K LUTs), integrated 12.5 Gbps GTY transceivers, Kintex UltraScale+ architecture | Supports high-speed serial protocols (PCIe Gen3, 10G Ethernet); requires more complex power sequencing and thermal management | Choose when serial connectivity, higher bandwidth, or advanced DSP is required; not drop-in compatible |
| XC7A75T-2FGG676I | Artix-7 family, lower static power, same 676-pin FGG package but only 74,000 logic cells and no SEU mitigation | Better suited for cost-sensitive, low-power applications where radiation tolerance is not required | Consider for non-industrial environments or where reduced BOM cost outweighs SEU and temp-range advantages |
Compared with XC7S75-2FGGA676I, XCKU3P-1FFVA676E delivers significantly higher bandwidth and integration but increases design complexity and cost, while XC7A75T-2FGG676I offers lower power and price at the expense of industrial qualification and soft-error resilience.
Availability
XC7S75-2FGGA676I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and embedded vision systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XC7S75-2FGGA676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-7 product line targets cost-optimized, power-efficient, and industrial-grade programmable logic for real-time control, I/O expansion, and embedded vision applications.
FAQ
What is the maximum supported I/O standard voltage for XC7S75-2FGGA676I?
XC7S75-2FGGA676I supports I/O voltages from 1.2V to 3.3V across independent banks, with VCCO per bank configurable to match connected peripherals. Each bank also supports programmable VREF for differential standards like LVDS and SSTL. This eliminates need for external level shifters in mixed-voltage systems.
Does XC7S75-2FGGA676I include built-in high-speed serial transceivers?
No, XC7S75-2FGGA676I does not integrate multi-gigabit transceivers. It relies on source-synchronous parallel I/O for high-speed interfaces such as DDR3, MIPI CSI-2, or custom parallel buses. For PCIe Gen2 x2, it uses the integrated hard IP endpoint block-not a transceiver-operating over standard I/O pins.
What configuration modes are supported by XC7S75-2FGGA676I?
XC7S75-2FGGA676I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Master SPI is most common for standalone operation using quad-SPI flash; JTAG is used for debugging and programming during development. Configuration pins (M0–M2) determine mode at power-up.
Is XC7S75-2FGGA676I qualified for extended temperature operation?
Yes, XC7S75-2FGGA676I is rated for industrial temperature range (–40°C to +100°C). It undergoes accelerated life testing and characterization across this range, including thermal cycling and burn-in, ensuring reliability in harsh environments without derating.
How many block RAM resources does XC7S75-2FGGA676I provide?
XC7S75-2FGGA676I provides 4.9 Mb of total block RAM, implemented as 288 BRAM primitives (each 36 Kb). These can be configured as true dual-port RAM, ROM, or shift register, supporting deep buffering, FIFOs, or coefficient storage for DSP applications.
XC7S75-2FGGA676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6000
- Number of Logic Elements/Cells:
- 76800
- Total RAM Bits:
- 4331520
- Number of I/O:
- 400
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FPBGA (27x27)
XC7S75-2FGGA676I FAQ
1.How can I place an order for XC7S75-2FGGA676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S75-2FGGA676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S75-2FGGA676I reliable?
The price and inventory of XC7S75-2FGGA676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S75-2FGGA676I is usually 5 days.
3.What payment methods are accepted for XC7S75-2FGGA676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S75-2FGGA676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S75-2FGGA676I?
XC7S75-2FGGA676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S75-2FGGA676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S75-2FGGA676I?
For technical support, including XC7S75-2FGGA676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S75-2FGGA676I requirements.
6.How does Aetrix verify that XC7S75-2FGGA676I is sourced from the original manufacturer or authorized distributors?
All XC7S75-2FGGA676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S75-2FGGA676I meets industry standards.
7.What is the process for return or replacement of XC7S75-2FGGA676I?
All XC7S75-2FGGA676I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S75-2FGGA676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S75-2FGGA676I part is unused and in its original packaging.
Return procedure for XC7S75-2FGGA676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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