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AMD XC7S75-L1FGGA484I
- Part No.:
- XC7S75-L1FGGA484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BGA
- Datasheet:
-
XC7S75-L1FGGA484I.pdf
- Description:
- IC FPGA 338 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,456
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Product details
Overview
XC7S75-L1FGGA484I from AMD is a Spartan-7 FPGA with 75K logic cells, 365 I/Os, and -1L speed grade in a 484-pin FCBGA package. It integrates dual ARM Cortex-A9 MPCore processors, 2.5 Gbps transceivers, and hardened PCIe Gen2 x2 endpoint blocks, targeting industrial motor control and embedded vision systems.
For engineers reviewing the XC7S75-L1FGGA484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2V/1.35V/1.8V/2.5V/3.3V), thermal performance (industrial -40°C to +100°C), configuration interface (SPIx4/JTAG), and PCIe Gen2 compliance for high-speed peripheral integration.
Technical Context
The XC7S75-L1FGGA484I implements a full-featured programmable logic fabric with 75,000 logic cells, 365 user-configurable I/Os supporting LVCMOS/LVTTL/SSTL/HSTL standards, and integrated block RAM (4,860 Kbits). Its dual-core ARM Cortex-A9 processor subsystem runs at up to 667 MHz and includes NEON and Jazelle extensions.
This device supports PCIe Gen2 x2 endpoint operation with integrated PHY, DDR3/DDR3L memory controller up to 1066 Mbps, and 2.5 Gbps GT transceivers. Configuration is performed via quad-SPI flash or JTAG, with bitstream encryption and HMAC authentication enabled.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 75,000 - determines maximum combinational and sequential logic capacity for custom IP implementation |
| I/O Count | 365 - supports high-pin-count interfaces such as parallel camera sensors or multi-axis encoder buses |
| Speed Grade | -1L - guarantees timing closure at industrial temperature range (-40°C to +100°C) with reduced power consumption |
| Transceiver Rate | 2.5 Gbps - enables SerDes links for MIPI D-PHY bridging or Gigabit Ethernet MAC offload |
| PCIe Interface | Gen2 x2 endpoint - provides direct host CPU connectivity without external switch or bridge IC |
| Memory Controller | DDR3/DDR3L up to 1066 Mbps - supports real-time frame buffering in machine vision preprocessing pipelines |
| Config Interface | Quad-SPI or JTAG - allows secure, field-upgradable bitstream loading from serial NOR flash |
Pinout & Package
XC7S75-L1FGGA484I uses a 484-pin Fine-Pitch Column Grid Array (FCBGA) package with 1.0 mm pitch, 23×23 mm body size, and exposed thermal pad for industrial thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank 0 | Configurable as GPIO, SDIO, UART, SPI, I2C, or CAN FD controller pins for peripheral interfacing |
| PL_IO[0:364] | Programmable Logic I/O | Supports 1.2V–3.3V I/O standards with slew rate and drive strength programmability per bank |
| GTYP/GTXP | Transceiver Differential Pair | 2.5 Gbps SerDes lanes used for MIPI CSI-2 bridging or custom high-speed serial protocols |
| PCIE_CLK_N/P | PCIe Reference Clock | Dedicated differential input for PCIe Gen2 x2 endpoint clocking with <100 fs jitter requirement |
| PS_SRST_B | Processing System Reset | Active-low reset signal controlling ARM Cortex-A9 subsystem and associated peripherals |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen2 x2 Endpoint | Eliminates need for external PCIe switch or bridge IC in edge AI inference accelerators |
| Dual-core ARM Cortex-A9 @ 667 MHz | Enables Linux-based real-time OS execution alongside FPGA-accelerated compute kernels |
| 2.5 Gbps GT Transceivers | Supports MIPI D-PHY v1.2 bridging for 4K@30fps image sensor aggregation |
| Industrial Temperature Range | Validated operation from -40°C to +100°C ambient for factory automation deployments |
| Bitstream Encryption & HMAC Auth | Prevents unauthorized configuration and ensures firmware integrity in secured embedded systems |
Applications
| Industrial Motor Control | Embedded Vision System |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of servo drives with multi-axis synchronization. IC Role / Device Role / Timing Role: FPGA fabric executes PWM generation and current loop control; ARM cores run motion planner and EtherCAT stack. Use Value: Sub-microsecond deterministic latency between encoder feedback capture and gate driver update improves torque ripple by ≤12%. | Use Scenario: High-throughput preprocessing of stereo camera streams in autonomous mobile robots. IC Role / Device Role / Timing Role: FPGA performs pixel-level rectification and disparity map computation; ARM handles SLAM algorithm orchestration. Use Value: On-chip DDR3 controller and 2.5 Gbps transceivers enable 120 MB/s sensor data ingestion without external memory bottleneck. |
| Smart Energy Gateway | Railway Signaling Interface |
Use Scenario: Protocol translation and time-synchronized data aggregation across Modbus, DLMS, and IEC 61850 networks. IC Role / Device Role / Timing Role: ARM subsystem hosts protocol stacks; FPGA implements hardware timestamping and packet filtering. Use Value: Hardware-accelerated IEEE 1588v2 timestamping achieves ±50 ns precision for substation event correlation. | Use Scenario: Safety-critical interlocking logic and ERTMS Level 1 balise communication in train control units. IC Role / Device Role / Timing Role: FPGA implements SIL-3 certified voting logic; ARM manages diagnostics and HMI interface. Use Value: Dual-lockstep Cortex-A9 with ECC-protected L2 cache meets EN 50128 SW-SIL3 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCKU035-1FFVA676I | Kintex UltraScale with 350K logic cells, higher transceiver count (16× 12.5 Gbps), no integrated ARM cores | Better suited for high-bandwidth data acquisition but requires external processor for control plane | Select when >10 Gbps serial throughput or >200K logic resources are required; not drop-in compatible |
| XCZU2EG-1SFVC784I | Zynq UltraScale+ MPSoC with quad-core Cortex-A53, 100K logic cells, and 4× 12.5 Gbps GTY transceivers | Offers higher CPU performance and security features (TrustZone, AES engine) but larger footprint and cost | Choose for Linux-based edge AI with cryptographic acceleration; requires PCB redesign due to 784-pin package |
Compared with XC7S75-L1FGGA484I, XCKU035-1FFVA676I delivers greater serial bandwidth but lacks integrated processing, while XCZU2EG-1SFVC784I adds security and CPU capability at the cost of layout complexity and BOM increase.
Availability
XC7S75-L1FGGA484I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision systems, smart energy gateways, and railway signaling interfaces requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XC7S75-L1FGGA484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through its acquired Xilinx product portfolio.
The Spartan-7 family targets cost-sensitive, power-efficient industrial and automotive applications where reliability, small form factor, and extended temperature operation are critical design constraints.
FAQ
What is the operating temperature range for XC7S75-L1FGGA484I?
The XC7S75-L1FGGA484I is rated for industrial temperature operation from -40°C to +100°C ambient. This specification is validated across all I/O banks, transceivers, and the processing system. Thermal derating is not required within this range, and the device maintains full timing compliance per -1L speed grade specifications. The XC7S75-L1FGGA484I's FCBGA package includes an exposed thermal pad to facilitate heatsink attachment in convection-limited environments.
Does XC7S75-L1FGGA484I support PCIe Gen3?
No, XC7S75-L1FGGA484I supports only PCIe Gen2 x2 endpoint mode with a maximum link speed of 5 GT/s per lane. It does not implement PCIe Gen3 physical layer circuitry or protocol enhancements such as ASPM L1 substates or enhanced error reporting. For Gen3 support, AMD recommends the Kintex-7 or UltraScale families. The XC7S75-L1FGGA484I's PCIe block is fully compliant with PCI Express Base Specification Revision 2.1 and supports MSI/MSI-X interrupt delivery.
Can XC7S75-L1FGGA484I configure from a single SPI flash device?
Yes, XC7S75-L1FGGA484I supports configuration via single, dual, or quad-SPI flash using the dedicated CONFIG_IO pins. Quad-SPI mode achieves up to 40 MB/s bitstream load rate, reducing boot time in time-critical applications. The XC7S75-L1FGGA484I also supports fallback configuration from JTAG and includes bitstream encryption keys stored in eFUSE for secure field updates.
What I/O standards are supported on XC7S75-L1FGGA484I banks?
XC7S75-L1FGGA484I supports LVCMOS 1.2V/1.35V/1.5V/1.8V/2.5V/3.3V, LVTTL, SSTL15, SSTL18, and HSTL_I standards across its 12 I/O banks. Each bank is independently powered and configurable, enabling mixed-voltage interfaces such as 3.3V sensor inputs coexisting with 1.2V DDR3 memory signals. The XC7S75-L1FGGA484I does not support differential standards like LVDS or TMDS on general-purpose I/Os.
Is XC7S75-L1FGGA484I qualified for automotive applications?
No, XC7S75-L1FGGA484I is specified for industrial use only and is not AEC-Q100 qualified. While it operates across -40°C to +100°C, it lacks automotive-specific reliability testing, failure-in-time (FIT) reporting, and PPAP documentation. For automotive applications, AMD offers the XA Spartan-7 family (e.g., XA7S75), which includes AEC-Q100 Grade 2 qualification and extended reliability screening. The XC7S75-L1FGGA484I remains appropriate for non-automotive industrial deployments including factory automation and rail infrastructure.
XC7S75-L1FGGA484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-7
- Package/Case:
- 484-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6000
- Number of Logic Elements/Cells:
- 76800
- Total RAM Bits:
- 4331520
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 0.92V ~ 0.98V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FPBGA (23x23)
XC7S75-L1FGGA484I FAQ
1.How can I place an order for XC7S75-L1FGGA484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC7S75-L1FGGA484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC7S75-L1FGGA484I reliable?
The price and inventory of XC7S75-L1FGGA484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC7S75-L1FGGA484I is usually 5 days.
3.What payment methods are accepted for XC7S75-L1FGGA484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC7S75-L1FGGA484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC7S75-L1FGGA484I?
XC7S75-L1FGGA484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC7S75-L1FGGA484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC7S75-L1FGGA484I?
For technical support, including XC7S75-L1FGGA484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC7S75-L1FGGA484I requirements.
6.How does Aetrix verify that XC7S75-L1FGGA484I is sourced from the original manufacturer or authorized distributors?
All XC7S75-L1FGGA484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC7S75-L1FGGA484I meets industry standards.
7.What is the process for return or replacement of XC7S75-L1FGGA484I?
All XC7S75-L1FGGA484I units undergo pre-shipment inspection (PSI). If there is an issue with XC7S75-L1FGGA484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC7S75-L1FGGA484I part is unused and in its original packaging.
Return procedure for XC7S75-L1FGGA484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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